HIGH POWER SWITCHING APPLICATIONS MOTOR CONTROL APPLICATIONS
| Parameter Name | Attribute value |
| Maker | Toshiba Semiconductor |
| package instruction | FLANGE MOUNT, R-XUFM-P24 |
| Contacts | 24 |
| Reach Compliance Code | unknow |
| Maximum collector current (IC) | 25 A |
| Collector-emitter maximum voltage | 600 V |
| Gate-emitter maximum voltage | 20 V |
| JESD-30 code | R-XUFM-P24 |
| Number of components | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 150 °C |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | FLANGE MOUNT |
| Maximum power dissipation(Abs) | 90 W |
| Certification status | Not Qualified |
| surface mount | NO |
| Terminal form | PIN/PEG |
| Terminal location | UPPER |
| VCEsat-Max | 2.7 V |
| MIG20J906HA | MIG20J906H | |
|---|---|---|
| Description | HIGH POWER SWITCHING APPLICATIONS MOTOR CONTROL APPLICATIONS | HIGH POWER SWITCHING APPLICATIONS MOTOR CONTROL APPLICATIONS |
| Maker | Toshiba Semiconductor | Toshiba Semiconductor |
| Reach Compliance Code | unknow | unknow |
| Maximum collector current (IC) | 25 A | 20 A |
| Collector-emitter maximum voltage | 600 V | 600 V |
| JESD-30 code | R-XUFM-P24 | R-XUFM-P24 |
| Number of components | 1 | 6 |
| Number of terminals | 24 | 24 |
| Maximum operating temperature | 150 °C | 150 °C |
| Package body material | UNSPECIFIED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | FLANGE MOUNT | FLANGE MOUNT |
| Certification status | Not Qualified | Not Qualified |
| surface mount | NO | NO |
| Terminal form | PIN/PEG | PIN/PEG |
| Terminal location | UPPER | UPPER |
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