1. Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating
the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction temperature, T
J(max)
, the
junction-to-ambient thermal resistance,
θ
JA
, and the ambient temperature, T
A
. The maximum allowable power dissipation at any ambient temperature
is calculated using: P
D(max)
= (T
J(max)
–T
A
) ÷
θ
JA
. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the
regulator will go into thermal shutdown. See the
“Thermal Considerations”
section for details.
2. Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.
3. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from
100µA to 500mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1Vdifferential.
5. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load
current plus the ground pin current.
6. Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line
regulation effects. Specifications are for a 500mA load pulse at V
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Embedded System
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