HD
D-Sub connectors - Stamped and Formed Contacts
RIGHT ANGLE
HIGH DENSITY CONNECTORS
Specifications
M N C AR TER STI C
AI
H AC I
S
Materials and Platings
Shells
Insulator
Contacts
Steel, tin over nickel plating
Glass-filled thermoplastic, UL 94V- 0
Brass, selected gold in mating area;
2.54µm (100 µ") min.tin on
termination area over 1.27µm
(50µ") min.nickel
Brass, 2.54µm (100µ") min.nickel plated
Phosphor bronze or Brass, 2.54µm
(100µ") min.nickel plated
Brass, 2.54µm (100µ") min.nickel plated
D R PTI O
ESC I
N
APPLI C O S
ATI N
• Connectors according to: MIL
C24308
• UL File:
E149426
Amphenol’s high density
D-Sub connectors complement
Amphenol’s extensive D-Sub
connector line. This line offers many
superior features, high performance
level and low installation cost.
The decreased contact spacing
accommodates greater signal
density in comparison to conventional
D-Sub connectors.
Rear insert
Boardlock
Screwlock
Electrical Data
Current rating
Voltage
rating
Withstanding
voltage
Insulation resistance
Contact resistance
3A
250V AC/ rms 50Hz
1000V AC/rms 50Hz for one minute
5000MΩ at 500V DC
10mΩ max
Economical
right angle PCB
mount
connectors
•
Industrial
•
Telecom
•
Any industry standard
I / O connections
Climatic Data
Operating temperature
-55°C to +125°C
Salt spray
24 hours
Mechanical Data
Single contact insertion force
Single contact withdrawal force
Mating and unmating force
Unit: kg ( lb)
No. of Cts
15
26
44
62
M
ate (max)
3.81 (8.42)
5.95 (13.16)
9.26 (20.46)
13.48 (29.78)
• Gold flash
• 0.4µm (15µ") Gold
• 0.76 µm (30µ") Gold
Unmate (min)
0.52 (1.14)
1.05 (2.32)
1.37 (3.02)
1.76 (3.88)
0.34kg (0.75lb) max.
0.02kg (0.044lb) min.
Standard plating thickness
HD / E19
TEC N C D
H I AL ATA
How to order
L
RoHS Compliant
... HD ... ... ... ... ... C309
Plating option
valid only for 0.76µm (30µ")
part numbers to be written
as follow:
or
77...................C309
717.................C309
Gold
flash
77:
tinned shell
for receptable
717:
tinned shell
+ dimples
for plug
177:
tinned shell
for receptable
777:
tinned shell
+ dimples
for plug
0.4µm
(15µ")
Series
High density
Front mounting option
Blank
= 3.05mm (.120”) rivet
4R
= 4-40 rear insert
4F
= 4-40 front screwlock
3R
= M3 rear insert
3F
= M3 front screwlock
Grounding option
CO
CH
C4
C3
= Grounding bracket
= Grounding bracket +
PCB boardlock
= Grounding bracket +
PCB 4-40 insert
= Grounding bracket +
PCB M3 insert
Contact type
P
= Plug
S
= Socket
Examples:
L 717 HD E15 P D1 CH 4R C309
L 177 HD A26 S D0 CO 3F
Footprint option
D0
= 1.5mm (.059”)
D1
= 8.89mm (.350”)
D2
= 5.08mm (.200”)
D3
= 2.50mm (.098”)
For special request, please consult factory
Do not hesitate to contact us for further information
Amphenol IT & Communication Products
Block A3/A4, The 4th Industrial District of
Industrial Headquarters, Dong Keng Road
Gong Ming Town, Shen Zhen China
Fax:+86(0)755 2754 9955
Technical Support
Tel:+86(0)755 2717 7945
Info-dsub@amphenol.com.cn
http://www.dsubconnector.com
E19/H
The information given in this document are as a guideline only. We reserve the right to modify our products in any way we deem necessary. Any duplication is prohibited, unless approved in writing.
Configuration
E15, A26, B44, C62
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
