853-93-030-30-001000 datasheet, PDF

Datasheet> All Categories > The connector> The connector> 853-93-030-30-001000

853-93-030-30-001000: DescriptionIC u0026 Component Sockets; CategoryThe connector The connector; File Size119KB，3 Pages; ManufacturerMill-Max; Websitehttps://www.mill-max.com

Download Datasheet Parametric View All

853-93-030-30-001000 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	853-93-030-30-001000	-	-	View	Buy Now

853-93-030-30-001000 Overview

IC u0026 Component Sockets

853-93-030-30-001000 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Reach Compliance Code	compliant
Body/casing type	SOCKET
Connector type	BOARD CONNECTOR
Contact to complete cooperation	GOLD (30) OVER NICKEL (100)
Contact completed and terminated	TIN LEAD (200)
Contact point gender	FEMALE
Contact material	NOT SPECIFIED
DIN compliance	NO
Filter function	NO
IEC compliance	NO
JESD-609 code	e0
MIL compliance	NO
Manufacturer's serial number	853
Plug information	MULTIPLE MATING PARTS AVAILABLE
Mixed contacts	NO
Installation method	STRAIGHT
Installation type	BOARD
Number of rows loaded	2
Options	GENERAL PURPOSE
Terminal pitch	1.27 mm
Termination type	SURFACE MOUNT
Total number of contacts	30
Base Number Matches	1

Preview

Download Datasheet

View All

Product Number: 853-43-006-10-001000

Description:

Interconnect Socket

Standard Solder Tail Socket

Accepts .015"- .020" (0,38 - 0,508

mm) dia leads

Double Row

Through Hole

Plating Code:

Shell Plating:

200 μ" Tin (matte finish) over 100

μ" Nickel

Inner Contact Plating:

30 μ" Gold over 50 μ" Nickel

Pins

Mill-Max

Part

Number

853-43-006-10-001000

RoHS

Compliant

CONTACT:

Contact Used: #11, Standard 3 Finger Contact

Current Rating =

3 Amps

BERYLLIUM COPPER ALLOY

172 (UNS C17200) per ASTM B 194

Properties of BERYLLIUM COPPER:

Chemical composition: Cu 98.1%, Be 1.9%

Temper as stamped: TD01

Properties after heat treatment (TH01):

Hardness: 36-43 Rockwell C

Mechanical Life: 1000 Cycles Min.

Density: .298 lbs/in3

Electrical Conductivity: 22% IACS*

Resistance: 10 miliohms Max

Operating Temperature: -55°C/+125°C

Melting point: 980°C/865°C (liquidus/solidus)

Stress Relaxation†: 96% of stress remains after 1,000 hours @ 100 °C; 70% of stress remains after 1,000 hours

@ 200 °C

*International Annealed Copper Standard, i.e. as a % of pure copper.

†Since BeCu loses its spring properties over time at high temperatures; it is rated for continuous use up to 150°C. For

applications up to 300°C, Mill-Max offers many contacts in Beryllium Nickel. Contact Tech Support for more info.

Mill-Max Mfg. Corp. Datasheet — Last Modified 8/18/2017

Page 1 of 3

LOOSE PIN:

Pin Used: 4890 (Brass Alloy)

BRASS ALLOY

360 per ASTM B 16, or 385 per ASTM B455

Properties of BRASS ALLOY 360 ASTM B 16:

Chemical composition: Cu 63% (max), Pb 3.7% (max)†, Fe .35% (max), Zn remainder

Temper as machined: H02/H04

Yield Strength: 25-45 ksi

Tensile strength: 57-80 ksi

Hardness as machined: 80-90 Rockwell B

Electrical conductivity: 26% IACS*

Melting point: 1000°C/840°C (liquidus/solidus)

Properties of BRASS ALLOY 385 ASTM B 455:

Chemical composition: Cu 60% (max), Pb 3.5% (max)†, Fe .35% (max), Zn remainder

Temper as machined: H02/H04

Yield Strength: 16 ksi(min)

Tensile strength: 48 ksi(min)

Hardness as machined: 80-90 Rockwell B

Electrical conductivity: 28% IACS*

Melting point: 1000°C/840°C (liquidus/solidus)

After machining, brass parts are often annealed (softened) for subsequent bending, swaging or crimping. A partial anneal

down to 60±10 RB is recommended for 90° bends, a full anneal down to 35±15 RB is recommended for pins or terminals

that are swaged (riveted) to a circuit board or crimped to a wire.

†RoHS-2 directive 2011/65/EU, exemption 6c allows up to 4% lead as an alloy agent in copper.

*International Annealed Copper Standard, i.e. as a % of pure copper.

INSULATOR INFORMATION:

NYLON 46

(Stanyl TE250F6 {30% glass} or TE250F9 {45% glass}, black)

High Temperature

Properties of NYLON 46:

Brand: Stanyl

Grade: TE250-F6 or F9

Material Heat Deflection Temp. (per ASTM D 648): 554°F (290°C) @ 264 psi

Note: Materials above 446°F (230°C) are considered suitable for "eutectic" reflow soldering, above 500°F (260°C) for

"lead-free" reflow soldering.

Certificate of Compliance:

This is to Certify that the product described above is manufactured to Mill-Max quality standards in accordance with all

applicable specifications and drawing. Mill-Max certifies this product to be free from defects of materials and workmanship.

This Certificate of Compliance covers the following requirements:

Dimensional (all features verified to be within tolerances described on the applicable drawing).

Raw Material (materials and properties verified to be as described on the applicable drawing).

Plating (platings as required, thickness verified, and performance including solderability per mil-standard).

Performance (insertion extraction or other force requirements as described on the applicable drawing).

RoHS Compliance Statement for the restriction of lead, mercury, cadmium and hexavalent chromium PBB,

PBDE, including Octa-BDE, Penta-BDE, Deca -BDE, in electronic equipment and use of PFOA

and PFOS in metal plating processes.

Reference:

1. Directive 2002/95/EC of the European Parliament and of the Council of January 27 2003 on the restriction of the use of

certain hazardous substances in electrical and electronic equipment.

2. Directive 2003/11/EC which amends Council Directive 76/769/EC to include pentabromodiphenyl ether and

octabromodiphenyl ether.

Mill-Max Mfg. Corp. Datasheet — Last Modified 8/18/2017

Page 2 of 3

3. Directive 2005/618/EC Commission decision of 18 August 2005 amending Directive 2002/95/EC. Establishes threshold

limits for Lead, Mercury, Cadmium, Hexavalent Chromium, PBB, and PBDE.

4. Judgment of the Court (Grand Chamber) 1 April 2008, Directive 2002/95/EC-Electrical and electronic equipment -

Decabromodiphenyl ether (Deca-BDE) Actions for annulment of exemption.

5. EU Directive 2006/122/EC of the European Parliament and of the Council of 12 December 2006, amending Council

Directive 76/769/EEC on the restriction of Perfluorooctanoic Acid (PFOA) and Perfluorooctane Sulfanates (PFOS) used

during metal plating processes.

In reference to the directives described above, MILL-MAX Mfg.Corp. declares that lead, mercury, cadmium, hexavalent

chromium, polybrominated biphenyls, polybrominated diphenyl ethers, including pentabromodiphenyl ether,

octabromodiphenyl ether, decabromodiphenyl ether, Perfluorooctanoic Acid, and Perfluorooctane Sulfanates are not

intentionally added to the raw material or processes used for our certified RoHS compliant products except where described

and allowed under item 6 of the annex; Applications where lead mercury, cadmium, and hexavalent chromium, which are

exempted from the requirements of Article 4 (1) of reference 1. No warranty, liability of indemnification is expressed or

implied with this information.

Compliance Statement for Registration, Evaluation, Authorization and Restriction of Chemicals (REACH)

Reference:

1. Regulation EC No 1907/2006 of the European Parliament and of the Council of 18 December 2006, concerning the

Registration, Evaluation, Authorization and Restriction of Chemicals (REACH)

2. ECHA, Candidate list of Substances of Very High Concern (SVHC)

http://echa.europa.eu/reach_en.asp

Mill-Max is aware of the regulation and the SVHC list the EU published (referenced above). Mill-Max does not produce or

sell any of the listed substances in their homogeneous form. These substances are not intentionally added during the

manufacturing of any Mill-Max products. To our knowledge, our products do not contain the substances described on the

ECHA SVHC list. Testing is not performed for materials and substances that were not intentionally added. No warranty,

liability of indemnification is expressed or implied with this information. Mill-Max maintains surveillance of the ECHA website

to obtain the latest information and periodically reviews the SVHC list for changes and additions.

Compliance Statement for DRC Conflict Free products.

Reference:

Dodd-Frank Wall Street Reform and Consumer Protection Act, Section 1502, reporting requirements for users of conflict

minerals.

“Conflict minerals,” are Columbite-tantalite (coltan), cassiterite, gold, wolframite, or their derivatives; or any other mineral

or its derivatives determined by the Secretary of State to be financing conflict in the Democratic Republic of the Congo

(DRC) or an adjoining country. Metals derived from these minerals are tin, tantalum, tungsten, and gold. By this definition,

the only minerals of concern that may be found in Mill-Max products are tin and gold.

Mill-Max Mfg.Corp. hereby certifies that its products are manufactured with tin and gold that is derived from material that

is considered DRC Conflict Free. Mill-Max provides this assurance as a result of a due diligence process that includes

traceability to the source and in some cases the identification of recycled and scrap materials included in the subject

material.

Mill-Max Mfg. Corp. Datasheet — Last Modified 8/18/2017

Page 3 of 3

Recommended Resources

Water full alarm circuit 2

Transistor pairing measuring instrument circuit

LASER310 learning machine circuit diagram

Huafeng FS-40 luxury floor fan circuit diagram

Car anti-collision warning device

810 computer motherboard circuit diagram_07

Share the information of a mini 51 MCU learning board, small and beautiful, with reference programs, schematics and other information: Share the information of a mini 51 MCU learning board, small and beautiful, with reference programs, schematics and other informationDownload address: https://pan.baidu.com/s/13WpA8914kdn6jU04JNR6jwEx...; tyxdz 51mcu

Reference design for WIFI wireless application using TI Stellaris: As the title:TI's official website provides a solution for using Stellaris with the TI cc3000 wifi chip. The download link is: http://www.ti.com/tool/cc3000-stellarisswThe Stellaris LM4F uses WiFi con...; hansonhe Microcontroller MCU

EEWORLD University ---- MSP430 Seminar (2014) MPU Introduction: MSP430 Seminar (2014) MPU Introduction : https://training.eeworld.com.cn/course/105...; dongcuipin Talking

Test of HDMI audio playback function of Rockchip RK3399 chip development board Orange Pi 4: Rockchip RK3399 chip development board OrangePi 4 (16G) has 4G memory and 16G storage, integrated dual-band WiFi, Bluetooth 5.0, HDMI output, Gigabit network port, USB interface and other rich functio...; 火辣西米秀 Domestic Chip Exchange

Moderator --- uart4,5 question: The serial ports 4 and 5 of the STM32F103RC cannot enter the interrupt.I debugged it through software? ?...; yousheyoude stm32/stm8

I can't believe it: the official routines of C8051F58x_59x also have errors!: See Figure 1,the C8051F58x_59x SMBus routine provided by the SiLabs development environment: F580_SMBus_EEPROM.c;An error occurred during compilation, see Figure 2.What's going on? Is there no test?I ...; yhyworld MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components