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BM14B08-20DS-04V53

Description
Thick Film Resistors - SMD 10K OHM 1%
CategoryThe connector   
File Size765KB,12 Pages
ManufacturerHirose
Websitehttp://www.hirose-connectors.com/
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BM14B08-20DS-04V53 Overview

Thick Film Resistors - SMD 10K OHM 1%

BM14B08-20DS-04V53 Parametric

Parameter NameAttribute value
Product CategoryBoard to Board & Mezzanine Connectors
ManufacturerHirose
RoHSDetails
ProductReceptacles
Number of Positions20 Position
Pitch0.4 mm
Termination StyleSMD
PackagingCut Tape
PackagingMouseReel
PackagingReel
Stack Height0.8 mm
Factory Pack Quantity1000
0.4 mm Contact Pitch, Board-to-FPC Connectors
BM14 Series
Mating Cross-Section Diagram (H = 0.8 mm type)
Molded structure
Two-point
contact system
Dec.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Features
1. Two stacking height options
Two separate heights available: 0.8 and 1.3 mm
Molded structure
The molded structure provides security and
insulation between the terminals and the board
2. Ultra space-saving design
With its drastically reduced depth of 1.98 mm,
this series can fit in the tightest designs.
Fig. 1
Solid mating feedback
Dimple on contact
Point A
3. Two point contact system
The two point contact structure encloses the
plug contacts and assures a completely secure
connection. (Fig.1)
4. Superior tactile feedback
A clear tactile click is delivered upon the
successful completion of the mating process
(Fig. 2).
5. Drop and shock resistant structure
Dimples were designed into the plug contacts;
they increase retention force and absorb shock
when dropped.
Insertion force
70
60
50
6. User friendly operations
Insertion force (N)
The low-profile connectors with stacking height
of 0.8 mm maintain the mating self-alignment
ra n g e o f 0 . 3 m m , s e c u r i n g e a s y m a t i n g
operations.
40
30
20
10
0
-10
Distance (mm)
Time
Clear tactile
feeling
7. No pattern prohibited area
No restrictions on PCB layout patter n are
imposed, as thin molding technology maintains
the effective mating length of 0.2 mm while
achieving complete insulation between the
bottom side of the receptacle and the board.
Image: 0.8 mm stacking height
Fig. 2
2015.2w
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