Only Reflow Soldering
Chip Multilayer Ceramic Capacitors on Interposer Board for General Purpose
ZRB18AR6YA475KE05_ (0603, X5R:EIA, 4.7uF, DC35V)
_: packaging code
1.Scope
Reference Sheet
This product specification is applied to Chip Multilayer Ceramic Capacitors on Interposer Board used for General Electronic equipment.
This product is applied for Only Reflow Soldering.
2.MURATA Part NO. System
(Ex.)
ZRB
18
(1)L/W
Dimensions
A
(2)T
Dimensions
R6
(3)Temperature
Characteristics
YA
(4)Rated
Voltage
475
(5)Nominal
Capacitance
K
(6)Capacitance
Tolerance
E05
(7)Murata’s Control
Code
L
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
1.6±0.2
(1)-2 W
0.8±0.2
(2) T
1.0±0.2
e
0.2 to 0.65
(Unit:mm)
g
0.6 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
-15 to 15 %
-55 to 85 °C
(25 °C)
DC 35 V
4.7 uF
±10 %
-55 to 85 °C
5.Package
mark
L
K
(8) Packaging
f180mm
Reel
EMBOSSED W8P4
f330mm
Reel
EMBOSSED W8P4
Packaging Unit
3000 pcs./Reel
8000 pcs./Reel
Product specifications in this catalog are as of Apr.3,2018,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
ZRB18AR6YA475KE05-01
1
■
Specifications and Test Methods
No
1
Item
Rated Voltage
Shown in Rated value.
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, V
P-P
or V
O-P
,
whichever is larger, should be maintained within the rated voltage
range.
2
3
4
Appearance
Dimension
Voltage proof
No defects or abnormalities.
Within the specified dimensions.
No defects or abnormalities.
Visual inspection.
Using Measuring instrument of dimension.
Measurement Point
Test Voltage
Applied Time
:Between the terminations
: 1 to 5 s
: 250% of the rated voltage
Charge/discharge current : 50mA max.
To apply the test voltage through the Interposer board termination.
5
Insulation Resistance(I.R.)
More than 2000MΩ or 50Ω
∙
F (Whichever is smaller)
Measurement Point
Measurement Voltage
Charging Time
: Between the terminations
: DC Rated Voltage
: 1 min
Charge/discharge current : 50mA max.
Measurement Temperature: Room Temperature
To apply the test voltage through the Interposer board termination.
6
7
Capacitance
Dissipation Factor (D.F.)
Shown in Rated value.
0.1 max.
Measurement Temperature: Room Temperature
Capacitance
C≦10μF
(10V min.)
C≦10μF
(6.3V max.)
C＞10μF
Frequency
1.0+/-0.1kHz
1.0+/-0.1kHz
120+/-24Hz
Voltage
1.0+/-0.2Vrms
0.5+/-0.1Vrms
0.5+/-0.1Vrms
To apply the test voltage through the Interposer board termination.
8
Temperature
Characteristics
of Capacitance
No bias
R6
C8
D7
: Within +/-10%
: Within +/-22%
: Within +22/-33%
(-55°C to +85°C)
(-55°C to +125°C)
(-55°C to +105°C)
(-55°C to +125°C)
· Measurement Voltage : Less than 1.0Vrms
(Refer to the individual data sheet)
The capacitance change should be measured after 5 min.
at each specified temp. stage.
Capacitance value as a reference is the value in step 3.
R7
:
Within +/-15%
Step
1
2
3
4
5
Temperature(C)
Reference Temp.+/-2
Min.Operating Temp. +/-3
Reference Temp. +/-2
Max.Operating Temp. +/-3
Reference Temp. +/-2
Applying Voltage(VDC)
No bias
To apply the test voltage through the Interposer board termination.
½Initial
measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9
Adhesive Strength
of Termination
No removal of the terminations or other defect
should occur.
Solder the capacitor on the test substrate shown in Fig.3.
Applied Force : 5N
Holding Time
: 10+/-1s
capacitor side.
10 Vibration
Appearance
Capacitance
No defects or abnormalities.
Within the specified initial value.
Solder the capacitor on the test substrate shown in Fig.3.
Kind of Vibration
Total amplitude
D.F.
Within the specified initial value.
: A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
:1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
Applied Direction : In parallel with the test substrate and vertical with the
JEMCGS-05965
2
No
11 Substrate
Bending test
Item
Appearance
Specification
No defects or abnormalities.
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Solder the capacitor on the test substrate shown in Fig.1.
Pressurization method
Flexure
: Shown in Fig.2
:
1mm
:5+/-1s
: Reflow soldering
: Solder bath method
: 80℃ to 120℃ for 10s to 30s
: Sn-3.0Ag-0.5Cu
: 245+/-5℃
2+/-0.5s
Capacitance
Change
12 Solderability of
Interposer board termination
Within +/-10%
Holding Time
Soldering Method
95% of the terminations is to be soldered evenly and
continuously.
Test Method
Preheat
Solder
Solder Temp.
Immersion time
:
Flux
:
Solution of rosin ethanol 25(mass)%
13 Resistance
to
Soldering
Heat
Appearance
Capacitance
Change
D.F.
I.R.
No defects or abnormalities.
Within +/-7.5%
Test Conditions : Reflow method
Solder
Solder Temp.
Exposure Time
: Sn-3.0Ag-0.5Cu
: 255+/-10℃[Peak Temperature]
: 24+/-2h
: 150℃ to 160℃ for 2 min
Heat Time of over 200°C : 120s max.
Within the specified initial value.
Within the specified initial value.
Preheat
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Solder the capacitor on the test substrate shown in Fig.3.
Perform the five cycles according to the four heat treatments
shown in the following table.
Voltage proof No defects.
14 Temperature
Sudden Change
Capacitance
Change
D.F.
Within the specified initial value.
Within +/-7.5%
Appearance
No defects or abnormalities.
Step
1
Temp.(C)
Min.Operating Temp.+0/-3
Room Temp
Max.Operating Temp.+3/-0
Room Temp
Time
(min)
30+/-3
2 to 3
30+/-3
2 to 3
2
3
4
I.R.
Within the specified initial value.
Exposure Time
: 24+/-2h
Voltage proof No defects.
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
15
High
Temperature
High
Humidity
(Steady)
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
Test Humidity
: 40+/-2℃
: 90%RH to 95%RH
: 500+/-12h
: DC Rated Voltage
Capacitance
Change
D.F.
Within +/-12.5%
Test Time
Test Voltage
Charge/discharge current : 50mA max.
0.2 max.
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
I.R.
More than 500MΩ or 12.5Ω ∙ F (Whichever is smaller)
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
16 Durability
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature
: Max. Operating Temp. +/-3℃
: 1000+/-12h
: 150% of the rated voltage
Capacitance
Change
Within +/-12.5%
Test Time
Test Voltage
Charge/discharge current : 50mA max.
D.F.
0.2 max.
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
I.R.
More than 1000MΩ or 25Ω ∙ F (Whichever is smaller)
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
JEMCGS-05965
3
Test method : Substrate Bending test
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (ZRB15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
*1,2：2.0±0.05
φ1.5
+0.1
-0
Land
f4.5
4.0±0.1
＊1
＊2
a
100
ZRB15
ZRB18
a
0.4
1.0
c
0.5
1.2
0.05以下
3.5±0.05
40
c
c
Type
Dimension (mm)
b
Ａ
1.5
3.0
Ｂ
1.75±0.1
8.0±0.3
b
t
Fig.1
・Kind
of Solder : Sn-3.0Ag-0.5Cu
・Pressurization
method
(in mm)
20
50 min.
Pressurization
speed
1.0mm/s
acitor
R5
Pressurize
45
Support
Capacitance meter
45
45
Flexure
Fig.2
(in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test
substrate
Material
: Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・
Kind of Solder : Sn-3.0Ag-0.5Cu
・
Land Dimensions
Chip Capacitor
Land
Type
ZRB15
ZRB18
b
a
Solder Resist
a
0.4
1.0
Dimension (mm)
b
1.5
3.0
c
c
0.5
1.2
Fig.3
JEMCGS-05965
4
Package
ZRB Type
1.Tape Carrier Packaging(Packaging Code:D/L/J/K)
1.1 Minimum Quantity(pcs./reel)
Type
ZRB15
ZRB18
X/7
A
6
φ180mm reel
Paper Tape
Plastic Tape
Code:D
Code:L
8000
3000
4000
φ330mm reel
Paper Tape
Plastic Tape
Code:J
Code:K
30000
8000
10000
1.2 Dimensions of Tape
(1)ZRB15
(in:mm)
φ1.5
-0
+0.1
*1
*2
3.5±0.05
Ｂ
0.05 max.
1.75±0.1
8.0±0.3
*1,2：2.0±0.05
4.0±0.1
Ａ
t
Type
X
7
ZRB15
Product Dimensions
L
W
T
1.0±0.15
0.5±0.15
0.65±0.15
1.0±0.2
1.0±0.22
0.5±0.2
0.65±0.2
1.0+0.22/-0.2
0.7±0.15
A *3
B *3
t *3
0.8
*3 Nominal value
1.3
0.95
JEMCGP-02345F
5
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