EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-B0202AA-03-7680-B

Description
Resistor Networks u0026 Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

WBC-B0202AA-03-7680-B Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-B0202AA-03-7680-B - - View Buy Now

WBC-B0202AA-03-7680-B Overview

Resistor Networks u0026 Arrays

WBC-B0202AA-03-7680-B Parametric

Parameter NameAttribute value
Product CategoryResistor Networks & Arrays
ManufacturerTT Electronics plc
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
Discuss solutions for space-constrained DC/DC converters
[i=s]This post was last edited by qwqwqw2088 on 2014-7-18 09:42[/i] [backcolor=rgb(247, 252, 255)][/backcolor] [p=26, null, left][backcolor=rgb(255, 255, 255)][font=宋体][size=14px] The world is shrinki...
qwqwqw2088 Analogue and Mixed Signal
Expert advice: Graphical interface design under Linux when doing embedded
I've been studying embedded systems recently, using Linux+ARM. When it comes to LCD programming, I have to do some graphics programming. I searched the Internet for a long time and found several optio...
神童 Linux and Android
Does anyone have the AVR_PQ1A.h header file from Tianxiang Electronics' avr video? Can you send me a copy? xfh168168@163.com
Does anyone have the AVR_PQ1A.h header file from Tianxiang Electronics AVR video? Can you send me a copy? [email=xfh168168@163.com]xfh168168@163.com[/email]...
xfh168168 Microchip MCU
Introduction to materials used in FPC
1. Raw materials (1) Glue materials and non-glue materials; the copper on the materials is divided into electrolytic copper and rolled copper. The non-glue rolled copper materials are more flexible an...
方学放 PCB Design
Some articles, information, and news I usually collect will be updated on 10-1...
[color=#dc143c]I am in the analytical instrument industry and I am quite interested in this. I usually pay attention to collecting some information and articles on environmental protection. I speciall...
qinglang Embedded System
Questions about high-frequency power supply impedance matching
For low-frequency power supplies, the load impedance value is generally not important, because low-frequency power supplies have small output impedance and strong load capacity. For high-frequency pow...
secondlife110 Analog electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2107  2064  2468  2921  2834  43  42  50  59  58 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号