& *R
AE oH
C- S C
Q2 O
00 MP
Q LI
UA AN
LI T
FI
ED
Features
n
Resistance value as low as 0.001 ohm
n
High power density
n
Inductance less than 5 nH
n
RoHS compliant*
n
AEC-Q200 qualified, automotive grade
AP *Ro
PR HS
OV C
ED OM
(S P L
el IAN
ec T
t M
od
el
s)
Applications
n
Power supplies
n
Stepper motor drives
n
Input amplifiers
R02
5
AE
C
CRF Series - High Power Current Sense Chip Resistor
Electrical Characteristics
Rating
Power Rating @ 70 °C
Operating Temperature Range
Derated to Zero Load at
Maximum Working Voltage
CRF0805
0.5 W
CRF1206
1W
-55 °C to +170 °C
+170 °C
(P x R)
1/2
0.001 ~ 0.030
Ω
1 %, ±5 %
±50 PPM/°C
CRF2512
(0.001 to 0.010
Ω)
2 W
(0.011 to 0.050
Ω)
1 W
Resistance
Resistance Tolerance
Temperature Coefficient
0.003 ~ 0.020
Ω
0.001 ~ 0.050
Ω
Performance Characteristics
Test
Thermal Shock
Short Time Overload
Low Temperature Storage
High Temperature Exposure
Bias Humidity
Mechanical Shock
Vibration
Load Life
Resistance to Solder Heat
Moisture Resistance
Conditions
-55 ˚C to +150 ˚C,
300 Cycles, 15 minutes
5 X Rated Power for 5 seconds
-55 ˚C for 1000 hours
1000 hours @ + 170 ˚C
+ 85 ˚C, 85 % RH,
10 % Bias, 1000 hours
CRF0805
ΔR
< ± 1 %
ΔR
< ± 0.5 %
ΔR
< ± 0.5 %
ΔR
< ± 1 %
N/A
N/A
N/A
ΔR
< ± 1 %
ΔR
< ± 0.5 %
ΔR
< ± 0.5 %
Specification
CRF1206
CRF2512
ΔR
< ± 0.5 %
ΔR
< ± 0.5 %
ΔR
< ± 0.5 %
ΔR
< ± 0.5 %
ΔR
< ± 1 %
ΔR
< ± 0.5 %
ΔR
< ± 0.5 %
ΔR
< ± 1 %
ΔR
< ± 0.5 %
ΔR
< ± 0.5 %
100 g for 6 milliseconds,
5 pulses
Frequency varied 10-2000 KHz
in one minute, 3 directions,
12 hours
1000 hours at rated power at
+70 ˚C, 1.5 hours on, 0.5 hours
off
+260 ˚C, 10-12 second dwell,
25 mm/second emergence
MIL-STD-202 Method 106, 0 %
power (7a and 7b not required)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CRF Series - High Power Current Sense Chip Resistor
Product Dimensions
A
A
B
B
C
C
C
C
T
T
C
C
C
C
Dim.
A
B
C
T
2.0 ± 0.10
(0.079 ± 0.004)
CRF0805
1.25 ± 0.10
(0.049 ± 0.004)
3.20 ± 0.20
(0.126 ± 0.008)
CRF1206
0.40 ± 0.20
(0.016 ± 0.008)
0.60 ± 0.20
(0.024 ± 0.008)
0.50 ± 0.30
(0.0197 ± 0.012)
0.60 ± 0.20
(0.024 ± 0.008)
1.65 ± 0.20
(0.064 ± 0.008)
6.40 ± 0.20
(0.252 ± 0.008)
CRF2512
3.20 ± 0.20
(0.126 ± 0.008)
0.95 ± 0.30
(0.037 ± 0.012)
0.60 ± 0.20
(0.024 ± 0.008)
DIMENSIONS:
MM
(INCHES)
Recommended Solder Pad Layout
Dim.
A
B
Cu TRACE
SENSING TRACE
CRF0805
0.003 ~ 0.020 Ω
CRF1206
0.001 Ω
CRF2512
L
B
0.002 ~ 0.030 Ω 0.001 ~ 0.003 Ω 0.004 ~ 0.050 Ω
A
1.4
(0.055)
1.15
(0.045)
1.8
(0.070)
L
1.2
(0.047)
2.3
(0.090)
1.8
(0.070)
1.0
(0.039)
1.7
(0.066)
4.0
(0.157)
1.6
(0.062)
3.1
(0.122)
4.0
(0.157)
1.3
(0.051)
2.1
(0.083)
4.1
(0.161)
MM
(INCHES)
Construction
Overcoat
Ni / Sn
Plating
DIMENSIONS:
Resistance Value Tables
CRF0805
Metal Alloy Plate
Code
R003
R004
R005
R009
CRF1206
R Value
0.003
0.004
0.005
0.009
Code
R009
R010
R020
R Value
0.009
0.010
0.020
CRF2512 (1W)
R011
R012
R015
R018
R020
R025
Code
R Value
0.011
0.012
0.015
0.018
0.020
0.025
Code
R030
R033
R035
R040
R050
R Value
0.030
0.033
0.035
0.040
0.050
Derating Curve
Power Ratio (%)
100
-55
70
170
Ambient Temperature (°C)
Code
R001
R002
3L50
R004
R005
R006
R007
R008
R009
R Value
0.001
0.002
0.0035
0.004
0.005
0.006
0.007
0.008
0.009
Code
R010
R012
R014
R015
R020
R022
R025
R030
R Value
0.010
0.012
0.014
0.015
0.020
0.022
0.025
0.030
CRF2512 (2W)
Code
R001
R002
R003
R004
R005
R Value
0.001
0.002
0.003
0.004
0.005
Code
R006
R007
R008
R010
R Value
0.006
0.007
0.008
0.010
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
EMBOSSED TAPE
TOP TAPE
1.5 +0.1/-0
DIA.
(0.059 +0.004/-0)
1.5
(0.059)
DIA. MIN.
1.75 ± 0.1
(0.069 ± 0.004)
5.5 ± 0.05
(0.217 ± 0.002)
12.0 ± 0.2
(0.472 ± 0.008)
RESISTOR
3.60 ± 0.20
(0.142 ± 0.008)
4.0 ± 0.1
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
CRF Series - High Power Current Sense Chip Resistor
Packaging Dimensions (Conforms to EIA RS-481A)
EMBOSSED TAPE
TOP TAPE
D0 DIA.
0.85 ± 0.15
(0.033 ± 0.006)
4.0 ± 0.05
(0.157 ± 0.002)
6.9 ± 0.2
(0.272 ± 0.008)
USER DIRECTION OF FEED
1.5
(0.059)
DIA. MIN.
E
F
13.0 ± 1.0
(0.512 ± 0.039)
DIA.
180 +0/-3
(7.09 +0/-0.118)
DIA.
W
60.0
(2.362)
MIN.
DIA.
RESISTOR
t
A
P1
P2
P0
B
15.4 ± 2.0
(0.606 ± 0.079)
13.0 ± 1.0
(0.512 ± 0.039)
USER DIRECTION OF FEED
DIMENSIONS:
MM
(INCHES)
Packing
Paper
Tape
Paper
Tape
Embossed
Tape
Model
CRF0805
CRF1206
CRF2512
A
B
W
F
3.5 ± 0.05
(0.138 ± 0.002)
3.5 ± 0.05
(0.138 ± 0.002)
E
1.75 ± 0.10
(0.069 ± 0.004)
1.75 ± 0.10
(0.069 ± 0.004)
P1
4.0 ± 0.10
(0.157 ± 0.004)
4.0 ± 0.10
(0.157 ± 0.004)
P2
2.0 ± 0.1
(0.079 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
P0
4.0 ± 0.1
(0.157 ± 0.004)
4.0 ± 0.05
(0.157 ± 0.002)
D0
1.5+0.1/-0
(0.059+0.004/-0)
1.5+0.1/-0
(0.059+0.004/-0)
t
0.84 ± 0.10
(0.033 ± 0.004)
0.85 ± 0.15
(0.033 ± 0.006)
1.6 ± 0.15
2.4 ± 0.20
8.0 ± 0.20
(0.063 ± 0.006) (0.094 ± 0.008) (0.315 ± 0.008)
13.0
2.0 ± 0.15
3.6 ± 0.20
± 1.0
± 0.20
8.0
(0.079 ± 0.006) (0.142 ±
(0.512 ± 0.039)
± 0.008)
0.008) (0.315
DIA.
3.60 ± 0.20
6.9 ± 0.20
12.0 ± 0.20
(0.142 ± 0.008) (0.272 ± 0.008) (0.472 ± 0.008)
How to Order
CRF 0805 - F Z - R020 E LF
Model
(CRF = Precision Chip Resistor)
15.4 ± 2.0
Size
(0.606 ± 0.079)
0805 = 0805 Size
13.0 ± 1.0
1206 = 1206 Size
(0.512 ± 0.039)
2512 = 2512 Size
Resistance Tolerance
• F = ±1 %
• J = ±5 %
TCR (PPM/°C)
• Z = ±50 PPM/°C
Resistance Value Code
(See Resistance Value Tables)
Packaging
• E = 5,000 pcs./180 mm (7-inch) reel (CRF0805 & CRF1206)
or 4,000 pcs./180 mm (7-inch) reel (CRF2512)
Termination
• LF = Tin-plated (RoHS compliant)
5.5 ± 0.05
1.75 ± 0.10
4.0 ± 0.10
2.0 ± 0.05
2.0 ± 0.05
1.5+0.1/-0
0.85 ± 0.15
(0.217
180 +0/-3
(0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002) (0.079 ± 0.002) (0.059+0.004/-0) (0.033 ± 0.006)
± 0.002)
(7.09 +0/-0.118)
DIA.
60.0
(2.362)
Soldering Profile
MIN.
DIA.
Can be soldered in accordance with IPC/JEDEC-J-STD-020.
275
<1>
Maximum of 20 seconds between
+255 °C and +260 °C
260 °C peak
<1>
255 °C
225
220 °C
Temperature (°C)
190 °C
175
150 °C
90 - 150
seconds
Ramp Down
6 °C/second
60 - 120 seconds
10 seconds minimum
75
Ramp Up
3 °C/second maximum
25
125
0
50
100
150
Time (seconds)
200
250
300
REV. 01/17
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
京公网安备 11010802033920号
EEWORLD
