Data Sheet
FEATURES
Programmable Digital Gyroscope Sensor
ADIS16260/ADIS16265
GENERAL DESCRIPTION
The
ADIS16260
and
ADIS16265
are programmable digital
gyroscopes that combine industry-leading MEMS and signal
processing technology in a single compact package. They provide
accuracy performance that would require full motion calibration
with any other MEMS gyroscope in their class. When power is
applied, the
ADIS16260
and
ADIS16265
automatically start up
and begin sampling sensor data, without requiring configuration
commands from a system processor. An addressable register
structure and a common serial peripheral interface (SPI) provide
simple access to sensor data and configuration settings. Many
digital processor platforms support the SPI with simple firmware-
level instructions.
The
ADIS16260
and
ADIS16265
provide several programmable
features for in-system optimization. The sensor bandwidth switch
(50 Hz and 330 Hz), Bartlett window FIR filter length, and sample
rate settings provide users with controls that enable noise vs.
bandwidth optimization. The digital input/output lines offer
options for a data ready signal that helps the master processor
efficiently manage data coherency, an alarm indicator signal
for triggering master processor interrupts, and a general-
purpose function for setting and monitoring system-level digital
controls/conditions.
The
ADIS16260
and
ADIS16265
are drop-in replacements for
the
ADIS1625x
family and come in LGA packages (11.2 mm ×
11.2 mm × 5.5 mm) that meet Pb-free solder reflow profile
requirements, per JEDEC J-STD-020. They have an extended
operating temperature range of −40°C to +105°C.
Yaw rate gyroscope with range scaling
±80°/sec, ±160°/sec, and ±320°/sec settings
No external configuration required to start data collection
Start-up time: 165 ms
Sleep mode recovery time: 2.5 ms
Factory-calibrated sensitivity and bias
ADIS16265
calibration temperature range: −40°C to +85°C
ADIS16260
calibration temperature: +25°C
SPI-compatible serial interface
Relative angle displacement output
Embedded temperature sensor
Programmable operation and control
Automatic and manual bias correction controls
Sensor bandwidth selection: 50 Hz/330 Hz
Sample rate: 256 SPS/2048 SPS settings
Bartlett window FIR filter length, number of taps
Digital I/O: data ready, alarm indicator, general-purpose
Alarms for condition monitoring
Sleep mode for power management
DAC output voltage
Single-command self-test
Single-supply operation: 4.75 V to 5.25 V
3.3 V compatible digital lines
2000
g
shock survivability
Operating temperature range: −40°C to +105°C
APPLICATIONS
Platform control and stabilization
Navigation
Medical instrumentation
Robotics
FUNCTIONAL BLOCK DIAGRAM
DIO1 DIO2 RST
INPUT/
OUTPUT
VCC
SELF-TEST
RATE
FILT
TEMPERATURE
SENSOR
POWER
SUPPLY
AUX
ADC
VREF
AUX
DAC
CONTROLLER
USER
CONTROL
REGISTERS
MEMS
GYROSCOPE
SENSOR
ALARMS
POWER
MANAGEMENT
GND
CS
SPI
PORT
SCLK
DIN
DOUT
08246-001
CLOCK
FILTER
OUTPUT
DATA
REGISTERS
CALIBRATION
ADIS16260/ADIS16265
Figure 1.
Rev. E
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
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ADIS16260/ADIS16265
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Specifications .................................................................. 5
Absolute Maximum Ratings............................................................ 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 8
Theory of Operation ........................................................................ 9
Sensing Element ........................................................................... 9
Data Sampling and Processing ................................................... 9
User Interface ................................................................................ 9
Basic Operation .......................................................................... 10
Data Sheet
SPI Write Commands ................................................................ 11
SPI Read Commands ................................................................. 11
Memory Map .............................................................................. 12
Processing Sensor Data ............................................................. 13
Operational Controls ................................................................. 13
Input/Output Functions ............................................................ 15
Diagnostics .................................................................................. 16
Product Identification................................................................ 17
Applications Information .............................................................. 18
Assembly...................................................................................... 18
Bias Optimization....................................................................... 18
Interface Printed Circuit Board (PCB) .................................... 18
Outline Dimensions ....................................................................... 20
Ordering Guide .......................................................................... 20
REVISION HISTORY
1/14—Rev. D to Rev. E
Change to Table 3 ............................................................................. 6
Change to Bias Optimization Section .......................................... 18
10/11—Rev. C to Rev. D
Change to Step 9, Bias Optimization Section ............................. 18
5/11—Rev. B to Rev. C
Changes to Bias Optimization Section ........................................ 18
12/10—Rev. A to Rev. B
Changes to Equation in Internal Sample Rate Section .............. 13
Changes to Figure 15 ...................................................................... 14
Changes to Bias Optimization Section ........................................ 18
10/09—Rev. 0 to Rev. A
Added ADIS16260 .............................................................. Universal
Changes to Features List and General Description Section........ 1
Changes to Table 1 ............................................................................ 4
Change to Absolute Maximum Ratings Table Section ................ 6
Changes to Interface Printed Circuit Board Section ................. 18
Changes to Ordering Guide .......................................................... 20
9/09—Revision 0: Initial Version
Rev. E | Page 2 of 20
Data Sheet
SPECIFICATIONS
ADIS16260/ADIS16265
T
A
= −40°C to +105°C, V
CC
= 5.0 V, angular rate = 0°/sec, ±1
g,
±320°/sec range setting, unless otherwise noted.
Table 1.
Parameter
SENSITIVITY
1
Test Conditions/Comments
Clockwise rotation is positive output
25°C, dynamic range = ±320°/sec
2
25°C, dynamic range = ±160°/sec
25°C, dynamic range = ±80°/sec
25°C, dynamic range = ±320°/sec
ADIS16260
ADIS16265
Best fit straight line
25°C, 1σ
25°C, 1σ
25°C, 1σ
ADIS16260
ADIS16265
Any axis
V
CC
= 4.75 V to 5.25 V
25°C, ±320°/sec range, no filtering, 50 Hz, 256 SPS
25°C, ±320°/sec range, no filtering, 330 Hz, 2048 SPS
25°C, ±160°/sec range, 4-tap filter setting, 50 Hz
25°C, ±80°/sec range, 16-tap filter setting, 50 Hz
25°C, f = 25 Hz, ±320°/sec range, no filtering
SENS_AVG[7] = 0
SENS_AVG[7] = 1
Min
Typ
0.07326
0.03663
0.01832
±0.2
125
25
0.1
0.007
0.025
2
0.03
0.005
0.2
0.5
0.4
0.9
0.2
0.1
0.044
50
330
14
+575
−575
+1100
−1100
25
12
±2
±1
±4
±2
0
During acquisition
25°C
−10
±40
70
20
2.5
+10
2.5
+1500
−1500
Max
Unit
°/sec/LSB
°/sec/LSB
°/sec/LSB
%
ppm/°C
ppm/°C
% of FS
°/sec
°/sec
°/√hour
°/sec/°C
°/sec/°C
°/sec/g
°/sec/V
°/sec rms
°/sec rms
°/sec rms
°/sec rms
°/sec/√Hz rms
Hz
Hz
kHz
LSB
LSB
ms
Bits
LSB
LSB
LSB
LSB
V
pF
V
mV
ppm/°C
Ω
Initial Tolerance
Temperature Coefficient
Nonlinearity
BIAS
In-Run Bias Stability
Turn-On-to-Turn-On Bias Stability
Angular Random Walk
Temperature Coefficient
Linear Acceleration Effect
Voltage Sensitivity
NOISE PERFORMANCE
Output Noise
±1
Rate Noise Density
FREQUENCY RESPONSE
3 dB Bandwidth
Sensor Resonant Frequency
SELF-TEST STATE
Change for Positive Stimulus
Change for Negative Stimulus
Internal Self-Test Cycle Time
ADC INPUT
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Gain Error
Input Range
Input Capacitance
ON-CHIP VOLTAGE REFERENCE
Accuracy
Temperature Coefficient
Output Impedance
320°/sec dynamic range setting
320°/sec dynamic range setting
Rev. E | Page 3 of 20
ADIS16260/ADIS16265
Parameter
DAC OUTPUT
Resolution
Relative Accuracy
Differential Nonlinearity
Offset Error
Gain Error
Output Range
Output Impedance
Output Settling Time
LOGIC INPUTS
Input High Voltage, V
INH
Input Low Voltage, V
INL
Logic 1 Input Current, I
INH
Logic 0 Input Current, I
INL
All Except RST
RST
Input Capacitance, C
IN
DIGITAL OUTPUTS
Output High Voltage, V
OH
Output Low Voltage, V
OL
SLEEP TIMER
Timeout Period
3
START-UP TIME
Initial Start-Up Time
Sleep Mode Recovery
Flash Update Time
Flash Test Process Time
FLASH MEMORY
Endurance
4
Data Retention
5
CONVERSION RATE
Minimum Conversion Time
Maximum Conversion Time
Maximum Throughput Rate
Minimum Throughput Rate
POWER SUPPLY
Operating Voltage Range, V
CC
Power Supply Current
Test Conditions/Comments
5 kΩ/100 pF to GND
For Code 101 to Code 4095
Min
Typ
12
4
1
±5
±0.5
0
2
10
Internal 3.3 V interface
2.0
V
IH
= 3.3 V
V
IL
= 0 V
The RST pin has an internal pull-up.
Internal 3.3 V interface
I
SOURCE
= 1.6 mA
I
SINK
= 1.6 mA
±0.2
−40
−1
10
2.4
0.4
0.5
165
2.5
50
18
70
20,000
10
0.488
7.75
2048
0.129
4.75
Low power mode, SMPL_PRD[7:0] ≥ 0x08
Normal mode, SMPL_PRD[7:0] ≤ 0x07
Sleep mode
5.0
17
41
350
5.25
128
0.8
±10
−60
2.5
Max
Data Sheet
Unit
Bits
LSB
LSB
mV
%
V
Ω
µs
V
V
µA
µA
mA
pF
V
V
sec
ms
ms
ms
ms
ms
Cycles
Years
ms
sec
SPS
SPS
V
mA
mA
µA
Normal mode, SMPL_PRD[7:0] ≤ 0x07
Low power mode, SMPL_PRD[7:0] ≥ 0x08
T
J
= 55°C
SMPL_PRD[7:0] = 0x00
SMPL_PRD[7:0] = 0xFF
SMPL_PRD[7:0] = 0x00
SMPL_PRD[7:0] = 0xFF
ADIS16260/ADIS16265
characterization data represents ±4σ to fall within the ±1% limit.
The maximum guaranteed measurement range is ±320°/sec. The sensor outputs will measure beyond this range, but performance is not assured.
3
Guaranteed by design.
4
Endurance is qualified as per JEDEC Standard 22, Method A117, and measured at −40°C, +25°C, +85°C, and +125°C.
5
Retention lifetime equivalent at a junction temperature (T
J
) of 55°C, as per JEDEC Standard 22, Method A117. Retention lifetime decreases with junction temperature.
1
2
Rev. E | Page 4 of 20
Data Sheet
TIMING SPECIFICATIONS
T
A
= −40°C to +85°C, V
CC
= 5.0 V, unless otherwise noted.
Table 2.
Normal Mode
(SMPL_PRD[7:0] ≤ 0x07, f
S
≥ 64 Hz)
Min
1
Typ
Max
1
0.01
2.5
32
9
48.8
100
24.4
48.8
5
5
5
12.5
12.5
5
24.4
48.8
ADIS16260/ADIS16265
Parameter
f
SCLK
t
DATARATE
t
STALL
t
CS
t
DAV
t
DSU
t
DHD
t
DF
t
DR
t
SFS
1
2
Description
Serial clock
Data rate period
Stall period between data
Chip select to clock edge
Data output valid after SCLK falling
edge
2
Data input setup time before SCLK
rising edge
Data input hold time after SCLK
rising edge
Data output fall time
Data output rise time
CS high after SCLK edge
3
Low Power Mode
(SMPL_PRD[7:0] ≥ 0x08, f
S
≤ 56.9 Hz)
Min
1
Typ
Max
1
0.01
1.0
42
12
48.8
100
Unit
MHz
µs
µs
ns
ns
ns
ns
5
5
12.5
12.5
ns
ns
ns
Guaranteed by design; not production tested.
The MSB presents an exception to this parameter. The MSB clocks out on the falling edge of CS. The rest of the DOUT bits are clocked after the falling edge of SCLK and
are governed by this specification.
3
This parameter may need to be expanded to allow for proper capture of the LSB. After CS goes high, the DOUT line goes into a high impedance state.
Timing Diagrams
t
DATARATE
CS
t
STALL
Figure 2. SPI Chip Select Timing
CS
t
CS
1
SCLK
2
3
4
5
6
15
16
08246-002
SCLK
t
SFS
t
DAV
DOUT
*
MSB
DB14
DB13
DB12
DB11
DB10
DB2
DB1
LSB
t
DSU
DIN
*NOT DEFINED
R/W
A5
t
DHD
08246-003
A4
A3
A2
D2
D1
LSB
Figure 3. SPI Timing (Using SPI Settings Typically Identified as CPOL = 1, CPHA = 1)
Rev. E | Page 5 of 20
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