Intel
®
Wireless Flash Memory (W18)
28F320W18, 28F640W18, 28F128W18
Datasheet
Product Features
■
■
■
High Performance Read-While-Write/
Erase
— Burst frequency at 66 MHz
— 60 ns Initial Access Read Speed
— 11 ns Burst-Mode Read Speed
— 20 ns Page-Mode Read Speed
— 4-, 8-, 16-, and Continuous-Word Burst
Mode Reads
— Burst and Page Mode Reads in all
Blocks, across all partition boundaries
— Burst Suspend Feature
— Enhanced Factory Programming at
3.1 µs/word (typ.for 0.13 µm)
Security
— 128-bit Protection Register
— 64-bits Unique Programmed by Intel
— 64-bits User-Programmable
— Absolute Write Protection with V
PP
at
Ground
— Individual and Instantaneous Block
Locking/Unlocking with Lock-Down
Capability
Quality and Reliability
— Temperature Range: –40 °C to +85 °C
— 100k Erase Cycles per Block
— 0.13 µm ETOX™ VIII Process
— 0.18 µm ETOX™ VII Process
■
■
■
Architecture
— Multiple 4-Mbit Partitions
— Dual Operation: RWW or RWE
— 8KB parameter blocks
— 64KB main blocks
— Top or Bottom Parameter Devices
— 16-bit wide data bus
Software
— 5 µs (typ.) Program and Erase Suspend
Latency Time
— Flash Data Integrator (FDI) and Common
Flash Interface (CFI) Compatible
— Programmable WAIT Signal Polarity
Packaging and Power
— 0.13 µm: 32-, 64-, and 128-Mbit in VF
BGA Package; 128-Mbit in QUAD+
Package
— 0.18 µm: 32- and 128-Mbit Densities in
VF BGA Package; 64-Mbit Density in
µBGA* Package
— 56 Active Ball Matrix, 0.75 mm Ball-
Pitch
— V
CC
= 1.70 V to 1.95 V
— V
CCQ
= 1.70 V to 2.24 V or 1.35 V to
1.80 V
— Standby current (0.13 µm): 8µA (typ.)
— Read current: 7mA (typ.)
The Intel
®
Wireless Flash Memory (W18) device with flexible multi-partition dual operation,
provides high-performance asynchronous and synchronous burst reads. It is an ideal memory for
low-voltage burst CPUs. Combining high read performance with flash memory’s intrinsic non-
volatility, the W18 device eliminates the traditional system-performance paradigm of shadowing
redundant code memory from slow nonvolatile storage to faster execution memory. It reduces
the total memory requirement that increases reliability and reduces overall system power
consumption and cost.
The W18 device’s flexible multi-partition architecture allows programming or erasing to occur
in one partition while reading from another partition. This allows for higher data write
throughput compared to single partition architectures. The dual-operation architecture also
allows two processors to interleave code operations while program and erase operations take
place in the background. The designer can also choose the size of the code and data partitions via
the flexible multi-partition architecture.
Notice:
This document contains information on new products in production. The specifications
are subject to change without notice. Verify with your local Intel sales office that you have the
latest datasheet before finalizing a design.
290701-009
December 2003
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The 1.8 Volt Intel® wireless flash memory datasheet may contain design defects or errors known as errata which may cause the product to deviate
from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
548-4725 or by visiting Intel's website at http://www.intel.com.
Copyright © 2003, Intel Corporation.
*Other names and brands may be claimed as the property of others.
2
Datasheet
Contents
Contents
1.0 Introduction
...............................................................................................................................9
1.1
1.2
1.3
2.1
2.2
2.3
2.4
3.1
Document Purpose ...............................................................................................................9
Nomenclature .......................................................................................................................9
Conventions..........................................................................................................................9
Product Overview ...............................................................................................................10
Package Diagram ...............................................................................................................12
Signal Descriptions .............................................................................................................14
Memory Map and Partitioning .............................................................................................15
Bus Operations ...................................................................................................................18
3.1.1 Read ......................................................................................................................18
3.1.2 Burst Suspend .......................................................................................................19
3.1.3 Standby..................................................................................................................19
3.1.4 Reset .....................................................................................................................19
3.1.5 Write ......................................................................................................................20
Device Commands .............................................................................................................20
Command Sequencing .......................................................................................................24
Read Array..........................................................................................................................25
Read Device ID...................................................................................................................25
Read Query (CFI) ...............................................................................................................26
Read Status Register..........................................................................................................26
Clear Status Register..........................................................................................................28
Word Program ....................................................................................................................28
Factory Programming .........................................................................................................29
Enhanced Factory Program (EFP) .....................................................................................30
5.3.1 EFP Requirements and Considerations.................................................................30
5.3.2 Setup .....................................................................................................................31
5.3.3 Program .................................................................................................................31
5.3.4 Verify......................................................................................................................31
5.3.5 Exit.........................................................................................................................32
Program/Erase Suspend and Resume ...............................................................................34
Block Erase.........................................................................................................................36
Read-While-Write and Read-While-Erase ..........................................................................38
Block Lock Operations ........................................................................................................39
7.1.1 Lock .......................................................................................................................40
7.1.2 Unlock ....................................................................................................................40
2.0 Device Description
................................................................................................................10
3.0 Device Operations
.................................................................................................................18
3.2
3.3
4.1
4.2
4.3
4.4
4.5
5.1
5.2
5.3
4.0 Read Operations
....................................................................................................................25
5.0 Program Operations
.............................................................................................................28
6.0 Program and Erase Operations
.......................................................................................34
6.1
6.2
6.3
7.1
7.0 Security Modes
.......................................................................................................................39
Datasheet
3
Contents
7.2
7.3
7.1.3 Lock-Down............................................................................................................. 40
7.1.4 Block Lock Status .................................................................................................. 41
7.1.5 Lock During Erase Suspend .................................................................................. 41
7.1.6 Status Register Error Checking ............................................................................. 41
7.1.7 WP# Lock-Down Control ....................................................................................... 42
Protection Register ............................................................................................................. 42
7.2.1 Reading the Protection Register............................................................................ 43
7.2.2 Programing the Protection Register....................................................................... 43
7.2.3 Locking the Protection Register............................................................................. 44
VPP Protection ................................................................................................................... 45
8.0 Set Configuration Register
................................................................................................ 46
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
9.1
9.2
9.3
9.4
Read Mode (CR[15])........................................................................................................... 48
First Access Latency Count (CR[13:11]) ............................................................................ 48
8.2.1 Latency Count Settings.......................................................................................... 49
WAIT Signal Polarity (CR[10]) ............................................................................................ 50
WAIT Signal Function ......................................................................................................... 50
Data Hold (CR[9]) ............................................................................................................... 51
WAIT Delay (CR[8]) ............................................................................................................ 52
Burst Sequence (CR[7])...................................................................................................... 52
Clock Edge (CR[6])............................................................................................................. 54
Burst Wrap (CR[3]) ............................................................................................................. 54
Burst Length (CR[2:0])........................................................................................................ 54
Active Power....................................................................................................................... 55
Automatic Power Savings (APS) ........................................................................................ 55
Standby Power ................................................................................................................... 55
Power-Up/Down Characteristics......................................................................................... 55
9.4.1 System Reset and RST# ....................................................................................... 56
9.4.2 VCC, VPP, and RST# Transitions ......................................................................... 56
Power Supply Decoupling................................................................................................... 56
Absolute Maximum Ratings ................................................................................................ 57
Operating Conditions .......................................................................................................... 57
DC Current Characteristics (.13
∝µ
and .18 µµ)................................................................. 58
DC Voltage Characteristics................................................................................................. 60
Read Operations – .13
µµ Λιτηογραπηψ............................................................................
62
Read Operations – .18
µµ Λιτηογραπηψ............................................................................
64
AC Write Characteristics..................................................................................................... 74
Erase and Program Times.................................................................................................. 79
Reset Specifications ........................................................................................................... 80
AC I/O Test Conditions ....................................................................................................... 81
Device Capacitance............................................................................................................ 82
9.0 Power Consumption
............................................................................................................. 55
9.5
10.1
10.2
10.3
10.4
11.1
11.2
11.3
11.4
11.5
11.6
11.7
10.0 Thermal and DC Characteristics
..................................................................................... 57
11.0 AC Characteristics
................................................................................................................ 62
Appendix A Write State Machine States
............................................................................... 83
Appendix B Common Flash Interface
.................................................................................... 86
4
Datasheet
Contents
Appendix C Mechanical Specifications
.................................................................................95
Appendix D Ordering Information
.........................................................................................100
Datasheet
5
RF/Wirelessly
京公网安备 11010802033920号
EEWORLD
