combination of super efficient MOSFET switches and
photovoltaic die provides 3750V
rms
of input to output
isolation.
The optically coupled outputs, which use the
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED.
Dual single-pole OptoMOS relays provide a more
compact design solution than two discrete single-pole
relays in a variety of applications, and save board
space by incorporating both switches in a single 8-pin
package.
Features
•
Current Limiting Device
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
No Moving Parts
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
FCC Compatible
•
VDE Compatible
•
No EMI/RFI Generation
•
Small 8-Pin Package
•
Machine Insertable, Wave Solderable
•
Surface Mount Tape & Reel Versions Available
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment-Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
LAA127L
LAA127LS
LAA127LSTR
LAA127PL
LAA127PLTR
Description
8-Pin DIP (50/Tube)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1,000/Reel)
8-Pin Flatpack (50/Tube)
8-Pin Flatpack (1,000/Reel)
Pin Configuration
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
1
2
3
4
8
7
6
5
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Switching Characteristics of
Normally Open (Form A) Devices
Form-A
I
F
90%
I
LOAD
10%
t
on
t
off
Pb
DS-LAA127L-R04
e
3
www.ixysic.com
1
I
NTEGRATED
C
IRCUITS
D
IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Ratings
Blocking Voltage
250
Reverse Input Voltage
5
Input Control Current
50
Peak (10ms)
1
Input Power Dissipation
1
150
800
Total Power Dissipation
2
Isolation Voltage, Input to Output
3750
Operational Temperature
-40 to +85
Storage Temperature
-40 to +125
1
2
LAA127L
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / °C
Derate linearly 6.67 mW / °C
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous
1
Peak
On-Resistance
2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Load Current Limiting
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
Conditions
Symbol
Min
Typ
Max
Units
-
t=10ms
I
L
=170mA
V
L
=250V
P
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
I
CL
I
F
-
V
F
I
R
C
I/O
-
-
-
-
-
-
-
190
-
0.4
0.9
-
-
-
-
13
-
-
-
110
235
-
0.7
1.2
-
3
170
-
15
1
5
5
-
280
5
-
1.4
10
-
mA
rms
/ mA
DC
-
A
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz
-
I
L
=170mA
-
I
F
=5mA
V
R
=5V
-
ms
pF
mA
mA
mA
V
A
pF
If both poles operate, the load current must be derated so as not to exceed the package power dissipation value.
Measurement taken within one (1) second of on-time.
2
www.ixysic.com
R04
I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
35
30
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
Device Count (N)
25
20
15
10
5
0
0.33
0.55
0.77
0.99
1.21
Turn-On Time (ms)
1.43
LAA127L
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=170mA
DC
)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=170mA
DC
)
Device Count (N)
0.05
0.08
0.11
0.14
0.17
Turn-Off Time (ms)
0.20
25
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=170mA
DC
)
Typical I
F
for Switch Dropout
(N=50, I
L
=170mA
DC
)
25
20
15
10
5
0
35
30
Device Count (N)
25
20
15
10
5
0
0.45
0.63
0.81 0.99 1.17
LED Current (mA)
1.35
1.53
Typical On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=170mA
DC
)
Device Count (N)
0.45
0.63
0.81 0.99 1.17
LED Current (mA)
1.35
1.53
Device Count (N)
11.25
11.75 12.25 12.75 13.25
On-Resistance ( )
13.75
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
262.5
267.5 272.5 277.5 282.5
Blocking Voltage (V
P
)
287.5
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
Turn-On Time (ms)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=170mA
DC
)
0.14
0.12
Turn-Off Time (ms)
0.10
0.08
0.06
0.04
0.02
0
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=170mA
DC
)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
10 15 20 25 30 35 40
LED Forward Current (mA)
45
50
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R04
www.ixysic.com
3
I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Turn-On Time
vs. Temperature
(I
L
=170mA
DC
)
Turn-Off Time (ms)
LAA127L
3.0
Turn-On Time (ms)
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
Typical Turn-Off Time
vs. Temperature
(I
F
=5mA, I
L
=170mA
DC
)
On-Resistance ( )
60
50
40
30
20
10
0
Typical On-Resistance vs. Temperature
(I
F
=5mA, I
L
=170mA
DC
)
I
F
=5mA
I
F
=10mA
I
F
=20mA
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
F
=170mA
DC
)
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
0
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=170mA
DC
)
200
150
Load Current (mA)
100
50
0
-50
-100
-150
Typical Load Current vs. Load Voltage
(I
F
=5mA)
-20
0
20
40
60
Temperature (ºC)
80
100
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-200
-2.5 -2.0 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 2.0 2.5
Load Voltage (V)
Maximum Load Current
vs. Temperature
300
Blocking Voltage (V
P
)
250
Load Current (mA)
200
150
100
50
0
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
290
285
Typical Blocking Voltage
vs. Temperature
0.014
0.012
Leakage ( A)
0.010
0.008
0.006
0.004
0.002
-20
0
20
40
60
80
100
0
-40
Typical Leakage vs. Temperature
Measured across Pins 5&6 or 7&8
280
275
270
265
260
255
-40
I
F
=20mA
I
F
=10mA
I
F
=5mA
-20
0
Temperature (ºC)
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
1.2
1.0
Load Current (A)
Current (mA)
0.8
0.6
0.4
0.2
0
10 s 100 s 1ms 10ms 100ms
Time
300
250
200
150
100
50
0
1s
10s
100s
Typical Current Limiting vs. Temperature
(I
F
=5mA)
-40
-20
0
20
40
60
80
100
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
www.ixysic.com
R04
I
NTEGRATED
C
IRCUITS
D
IVISION
Manufacturing Information
Moisture Sensitivity
LAA127L
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LAA127L / LAA127LS / LAA127PL
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
LAA127L / LAA127LS
LAA127PL
Maximum Temperature x Time
250ºC for 30 seconds
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
I was really envious of Ma Ge’s multi-function debugging tool, so I also made a high-speed USB hub and supported an xlink, and used stm32 to realize USB to serial TTL/serial 232/serial 485 (through ju...
As the title says, if I click on the clock in the tray to change the time, what registry entry will be modified accordingly? Please give me some advice!...
[p=null, 2, left]This test simulates the repetitive damped oscillatory waves that appear in the power cables, control cables and signal cables installed in high-voltage and medium-voltage substations,...
In the previous article, the Waft test routine has been compiled. When updating the binary library file, the problem of insufficient system capacity is encountered. In this article, we will first expa...
China Netcom: Building a Broadband Olympics "Network connects the world, broadband fulfills dreams" is China Netcom's brand appeal. On July 22, 2004, China Netcom officially became the fixed communica...
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Administration (USPTO) for a patent for a remote vehicle control system that may be used in future ...[Details]
When we travel in cities, we all find that electric vehicles have many advantages. As a means of transportation, they can also fulfill their mission well. Now, more and more residential communities...[Details]
We are entering a new era where people are increasingly affordably equipped with more electronic gadgets. Electronics have become essential to our lives. For example, the average consumer now owns ...[Details]
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
Robotics
has become
LiDAR
's "second growth curve."
While LiDAR was still battling with its "pure vision" rivals in the automotive field, another field ignited the demand f...[Details]
The all-new MG4 was recently officially announced on the Ministry of Industry and Information Technology's (MIIT) new vehicle announcement. The all-new MG4's semi-solid-state battery version addres...[Details]
1 Source of creativity
With the further development of electronic technology, electronic pets have gradually entered people's family life. At present, there are two main categories of relative...[Details]
With the development of science, the use of variable frequency technology is becoming more and more widespread, and it is used in both industrial equipment and household appliances. Inverter air co...[Details]
Laird Thermal Systems has introduced the HiTemp ET series Peltier cooler modules, which can operate at high temperatures and provide on-site cooling for sensitive electronic devices.
Dig...[Details]
In the electronics manufacturing industry, surface mount technology (SMT) placement machines are core equipment for production lines. However, with many different models available on the market, ch...[Details]
On August 21st, BYD announced the launch of its next-generation "Little White Pile" product, the "Lingchong"
charging
pile
, which is now available for general sale. This charging pile feat...[Details]
Civilian internal combustion engines operate in the range of approximately 1000-4000 rpm. This results in the engine's kinetic energy being ineffective at low or high rpm, making starting difficult...[Details]
On August 21, it was reported that Intel's new generation of AI chip Jaguar Shores was recently exposed for the first time.
According to photos shared by Andreas Schilling, the Jaguar Shores t...[Details]
When American cartoonist Chester Gould sketched the watch on Dick Tracy's wrist, he had no idea that science fiction would become reality 70 years later. As a comic strip artist, Gould imagined fut...[Details]
introduction
A common voltage regulator is a three-terminal one. Its function is to step down the voltage and stabilize it at a fixed output value. Voltage regulators are commonly available in...[Details]