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PM0805-39NM-RC

Description
Fixed Inductors 39nH 20%
CategoryPassive components    inductor   
File Size273KB,1 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Environmental Compliance
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PM0805-39NM-RC Overview

Fixed Inductors 39nH 20%

PM0805-39NM-RC Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerBourns
package instruction0805
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time12 weeks
uppercase and lowercase codes0805
structureRectangular
core materialALUMINA
DC Resistance0.29 Ω
Nominal inductance(L)0.039 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee4
Number of functions1
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package height1.2 mm
Package length2 mm
Package formSMT
Package width1.25 mm
method of packingTR, Embossed, 7 Inch
Minimum quality factor (at nominal inductance)60
Maximum rated current0.5 A
self resonant frequency2000 MHz
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
special characteristicsQ FACTOR IS MEASURED AT: 500MHZ
surface mountYES
Terminal surfaceGold (Au) - with Nickel (Ni) barrier
Terminal locationDUAL ENDED
Terminal shapeONE SURFACE
Test frequency250 MHz
Tolerance20%
CO
M
PL
IA
N
T
Features
Formerly
0805 size
Available in E12 series
High Q up to 60 typ.
High operating temperature of 125 °C
RoHS compliant*
Applications
model
Mobile phones
Cellular phones
CTV, VCR, HIC, FDD
*R
oH
S
PM0805 Series - High Q Chip Inductors
Electrical Specifications
Inductance
Test Frequency (MHz)
General Specifications
SRF
Min.
(MHz)
6000
6000
5800
5800
5500
4800
4100
3600
3400
3300
2600
2400
2100
1700
1600
1450
1350
1200
1100
950
900
860
850
800
780
340
I rms
Max.
(mA)
800
600
600
600
600
600
600
600
600
600
600
500
500
500
500
500
500
400
400
400
350
300
250
200
170
230
Bourns Part No.
PM0805-2N8M-RC
PM0805-3N3M-RC
PM0805-5N6M-RC
PM0805-6N8M-RC
PM0805-8N2M-RC
PM0805-10NM-RC
PM0805-12NM-RC
PM0805-15NM-RC
PM0805-18NM-RC
PM0805-22NM-RC
PM0805-27NM-RC
PM0805-33NM-RC
PM0805-39NM-RC
PM0805-47NM-RC
PM0805-56NK-RC
PM0805-68NK-RC
PM0805-82NK-RC
PM0805-R10K-RC
PM0805-R12K-RC
PM0805-R15K-RC
PM0805-R18K-RC
PM0805-R22K-RC
PM0805-R27K-RC
PM0805-R33K-RC
PM0805-R39K-RC
PM0805-R56K-RC
nH
2.8
3.3
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
560
Tol. %
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
Q
Min.
32
30
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
50
50
50
50
45
45
45
23
L
250
250
250
250
250
250
250
250
250
250
250
250
250
200
200
200
150
150
150
100
100
100
100
100
100
50
Q
1000
1500
1000
1000
1000
500
500
500
500
500
500
500
500
500
500
500
500
500
250
250
250
250
250
250
250
50
RDC
(Ω)
0.06
0.08
0.08
0.06
0.06
0.08
0.08
0.08
0.08
0.10
0.12
0.15
0.18
0.15
0.25
0.27
0.32
0.43
0.48
0.67
0.85
1.10
1.46
1.65
2.20
1.90
Temperature Rise
.................40 ˚C max. at rated current
Operating Temperature
................................-40 °C to +125 °C
Storage Temperature
................................-40 °C to +125 °C
Reflow Soldering .. 230 °C, 50 sec. max.
Resistance to Soldering Heat
...............................260 ˚C, 5 seconds
Materials
Core Material .......Alumina (1CC201211)
Wire ......Enamelled Copper (1W1E180)
Terminal ...........................Mo/Mn+Ni+Au
Packaging ................. 2,000 pcs. per reel
Product Dimensions
0.5
(.020)
1.3
±
0.2
(.051
±
.008)
2.1
±
0.2
(.083
±
.008)
1.5
±
0.2
(.059
±
.008)
0.5
(.020)
0.5
(.020)
Packaging Specifications
178.0
(7.00)
DIA.
2.0
±
0.5
(.079
±
.020)
Recommended Layout
12.5
(.492)
THICKNESS
0.10
(.004)
MAX.
EMBOSSED
CAVITY
REF.
1.02
(.040)
1.02
REF.
(.040)
21.0
±
0.8
(.827
±
.031)
13.0
±
0.5
(.512
±
.020)
DIA.
50.0
(1.969)
REF.
0.76
(.030)
1.78
REF.
(.070)
13.0
±
0.5
DIA.
(.512
±
.020)
DIMENSIONS:
EMBOSSED
CARRIER
10.0
(.393)
8.0
(.315)
MM
(INCHES)
REV. 05/11
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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