This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI.
Copyright FCI.
Form E-3005
Rev E
GS-01-001
PDM: Rev:H
STATUS:
Released
Printed: Nov 27, 2010
.
Type
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-233
REV.
PCI EXPRESS CONNECTOR
TM
2 of
11
AUTHORIZED BY
H
DATE
Richard Chiu
07/04/08
1.0 INTRODUCTION
1.1 SCOPE
This document describes the functional and test requirements
for the PCI Express
TM
card-edge connector. The connector is
designed to meet the requirements of the PCI Express Card
Electromechanical Specification and certain customer
specifications not covered by the PCI-SIG document.
minimum gold over 1.27 micrometers (50 microinches)
minimum unbrushed nickel
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI.
Copyright FCI.
Form E-3005
Rev E
GS-01-001
PDM: Rev:H
STATUS:
Released
Printed: Nov 27, 2010
.
Type
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-233
REV.
PCI EXPRESS CONNECTOR
TM
3 of
11
AUTHORIZED BY
H
DATE
Richard Chiu
07/04/08
2.5.5Pad and trace design: pad and trace design shall follow
PCI Express standard as depicted in customer drawing.
2.6 SOLDERTAIL TERMINATION
Tests requiring termination of the soldertails to a PC
plated thru holes in the pattern specified in AFCI
customer drawing, shall be used.
2.6.2 Solder washers, AFCI part number 78523-001, shall be
applied to the tails, and the connector vapor phase
reflowed at 215°C (419°F) for a time not to exceed 2
minutes.
3.0 MECHANICAL REQUIREMENTS
3.1
EXAMINATION OF PRODUCT
Samples must comply to applicable FCI product prints.
3.2 INSERTION / WITHDRAWAL FORCE- ADD IN CARD
PER EIA-364-13
Mating cycle is with maximum/minimum thickness gage at a rate
of 25.4 mm/minute.
3.2.1 Maximum insertion force is 1.15 N max. per contact pair
when measured with a 1.70 +0.00/-0.01(0.067 +0.000/
-0.004 inches) thick hardened steel card made to the
dimensions shown for the PCI Express expansion board
in the FCI customer drawing. The card has a R0.05 min.,
R0.10 max.(sharpedge)and the surface roughness in
connector area to be 0.10 micrometers (4 microinches)
maximum.
3.2.2 Withdrawal force is 0.15N minimum per contact pair when
measured with a 1.44 +0.01/-0.00 (0.067 +0.004/-0.000
inches) thick hardened steel card made to the
dimensions shown for the PCI Express expansion board
in the FCI customer drawing. The card has a R0.05
min., R0.10 max (sharp edge) and the surface
roughness in the connector area to be 0.10 micrometers
(4 microinches) maximum.
3.3
CONTACT RETENTION
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI.
Copyright FCI.
Form E-3005
Rev E
GS-01-001
PDM: Rev:H
STATUS:
Released
Printed: Nov 27, 2010
.
Type
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-233
REV.
PCI EXPRESS CONNECTOR
TM
4 of
11
AUTHORIZED BY
H
DATE
Richard Chiu
07/04/08
Minimum retention force of terminals in the connector
housing to be 5N each. Pull rate to be 1.27 mm/min.
3.4 BOARD RETENTION / INSERTION FORCES
3.4.1 Board retention / insertion forces should be checked on
an 1.57 +/- 0.13 (0.062 +/- 0.005 inch) thick segment
of FR-4 glass / epoxy circuit board segment with a
hole of diameter as described below drilled through.
Connectors should have all contacts present. Forces
apply to connectors with plastic pegs and metal board
locks.
3.4.2 Maximum insertion force(including all types post or
straddle mount solder tails) to seat connector in
PCB(including straddle mount or through PCB)are:
36 pos
2.14 kg max.
64 pos
3.91 kg max.
98 pos
7.45 kg max.
164 pos
7.45 kg max.
3.5 SOLDERABILITY
Per J-STD-002
a. steam age for 1 hour
b. contact areas evaluated shall meet 95% minimum coverage.
4.0 ELECTRICAL REQUIREMENTS
Unless otherwise specified, all measurements should be
performed in the following ambients:
relative humidity:
temperature:
barometric pressure:
4.1 LOW LEVEL CONTACT RESISTANCE
EIA-364-23
50% or less
25°C +/- 5°c
711 to 812 mm mercury (at sea level)
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI.
Copyright FCI.
Form E-3005
Rev E
GS-01-001
PDM: Rev:H
STATUS:
Released
Printed: Nov 27, 2010
.
Type
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-233
REV.
PCI EXPRESS CONNECTOR
TM
5 of
11
AUTHORIZED BY
H
DATE
Richard Chiu
07/04/08
4.1.1Solder connector to pc board per section 2.6 and insert card
per section 2.5
4.1.2Resistance measurements should be made from the underside of
the pc board to the PTH in the add-in card above the contact
pad. The test current shall be 100 milliampere d.c. max.
with a maximum open circuit voltage of 20 millivolts D.C.
See figure 1.0 for attachment of current and voltage leads.
4.1.3Requirement is 30 milliohms maximum initial, with change of 10
milliohms maximum after exposure testing.
CONTACT RESISTANCE TEST SET UP
THROUGH HOLE
FIGURE 1
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI.
I used VERSAPRO programming software to modify a 90-30CPU331 program, but the program compilation showed errors, and the displayed information was: IN STRUCTION NOT SUPPORTED BY CURRENT CPU, and MISSI...
It was the same when I first learned DSP. When I encountered a problem, I didn't know how to express it clearly. It was really painful. Recently, I had some time to recall my process of learning DSP. ...
Currently, the WinCE image compiled on the development workstation is downloaded to the target machine through the network. Now the target machine and the development workstation can be connected. The...
[i=s]This post was last edited by Hot Ximixiu on 2020-6-13 20:56[/i]Various interrupt vectors
【Note】The sorting order is the experimental order and does not represent the priorityCalculation of interr...
[align=center]This is my first time to use dxp, and I am not very familiar with pcb design. How can I find the rectangular components in this circuit, and how can I find the power supplies on both sid...
As a wireless broadband metropolitan area network standard, WiMAX technology has greater advantages than previous 3.5GHz MMDS products in terms of non-line-of-sight transmission and spectrum utiliz...[Details]
Since the No. 4 blast furnace of Handan Iron and Steel was put into operation in 1993, its external equipment has been seriously aged, and the original PLC control system TDC3000 of the hot blast furn...[Details]
With the rapid development of intelligent control technology, computers and information technology, the trend of information appliances IA (Information Application), computers and communications integ...[Details]
In recent years, with the rapid development of the information industry, dot matrix LED display screens have been widely used in various advertising and information display systems such as the fina...[Details]
VP2188 is a color STN LCD module produced by Jingdian Pengyuan. This module is a dot matrix transmissive color STN display screen with a color scale of 65 k colors and white LED backlight. Its core...[Details]
OC faults may be the most frequent and the most frequent of all faults in the inverter. They alarm during the startup process, during the shutdown process, during operation, and even when powered o...[Details]
Today, the value of electronic components in cars accounts for 15-20% of the total vehicle. In the future, this proportion may be as high as 30-40% as more safety electronics, fuel consumption and ...[Details]
Abstract: With the development and construction of BeiDou II system, China will shift from the situation dominated by GPS to the situation dominated by BeiDou II global navigation system independen...[Details]
Preface
In recent years, white light LEDs have gradually replaced incandescent bulbs and fluorescent lamps because they have unparalleled advantages over traditional light sources in terms...[Details]
Since AC mains power may experience power outages, voltage sags and surges, continuous undervoltage and overvoltage, and frequency fluctuations during supply, these factors will affect the continuous ...[Details]
System Overview
The system consists of a signal preprocessing circuit, a single-chip computer AT89C2051, a systematic LED display module, a serial port data storage circuit and system software...[Details]
0 Introduction
With the rapid development of social economy and science and technology, electric locomotives, subways and electric vehicles will be widely used. The power conversion and cont...[Details]
With the continuous advancement of various technologies in the field of measurement and control, the baseband subsystem of general measurement and control equipment has entered the fourth generation o...[Details]
Abstract: Based on the ZigBee parking lot SMS car search system, the location of the vehicle in the parking lot is sent to the owner through SMS, which is convenient for the owner to quickly find ...[Details]
One in five car failures are caused by batteries, a problem that will become more serious in the coming years as electric-by-wire, start/stop engine management and hybrid (electric/gas) vehicles be...[Details]