69916-018LF datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > The connector> 69916-018LF

69916-018LF: DescriptionHeaders u0026 Wire Housings .500 VERT HDR W/O MTG HOLES; CategoryThe connector; File Size346KB，21 Pages; ManufacturerFCI [First Components International]

Download Datasheet Parametric View All

69916-018LF Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	69916-018LF	-	-	View	Buy Now

69916-018LF Overview

Headers u0026 Wire Housings .500 VERT HDR W/O MTG HOLES

69916-018LF Parametric

Parameter Name	Attribute value
Product Category	Headers & Wire Housings
Manufacturer	FCI [First Components International]
RoHS	Details
Number of Rows	2 Row
Factory Pack Quantity	100

Preview

Download Datasheet

View All

TYPE

NUMBER

PRODUCT SPECIFICATION

TITLE

PAGE

BUS-12-059

REVISION

SLOTTED and VERTICAL STACKING HEADER CONNECTORS

1 of 21

AUTHORIZED BY

DATE

10-Oct-06

M. Barrios

CLASSIFICATION

UNRESTRICTED

1.0 OBJECTIVE

This specification defines the performance, test, quality and reliability requirements of the slotted and vertical

staking header connectors.

2.0 SCOPE

This specification covers the slotted header and the vertical stacking header connectors designed for use in

low power applications requiring a printed wiring board mounted disconnect. The headers provide only the

male half of the inter-connection, using a female connector to complete the connection.

The Headers shall be available in one of the following type classifications:

TYPE

III

VII

VIII

PLATING

30u INCH GOLD

15 u INCH GOLD

GOLD FLASH

150u INCH TIN

15u Pd. Ni.

30u Pd. Ni.

DUPLEX 150u INCH TIN AND 15u INCH GOLD

PRESS FIT WITH TYPE 1 THRU VII PLATING

3.0 GENERAL

The specification is composed of the following sections.

PARAGRAPH

1.0

2.0

3.0

4.0

5.0

5.1

5.2

5.3

5.4

6.0

7.0

8.0

9.0

9.1

9.2

9.3

9.11

TITLE

OBJECTIVE

SCOPE

GENERAL

APPLICABLE DOCUMENTS

REQUIREMENTS

Qualification

Material

Finish

Design and Construction

ELECTRICAL CHARACTERISTICS

MECHANICAL CHARACTERISTICS

ENVIRONMENTAL CONDITIONS

QUALITY ASSURANCE PROVISIONS

Equipment Calibration

Inspection Conditions

Qualification Inspection

Acceptance Inspection

PAGE

Form E-3334

Rev E

GS-01-001

PDM: Rev:B

STATUS:

Released

Printed: Nov 28, 2010

TYPE

NUMBER

PRODUCT SPECIFICATION

TITLE

PAGE

BUS-12-059

REVISION

SLOTTED and VERTICAL STACKING HEADER CONNECTORS

3 of 21

AUTHORIZED BY

DATE

10-Oct-06

M. Barrios

CLASSIFICATION

UNRESTRICTED

5.2 Material

Material for each part shall be as specified herein, or equivalent, substitute material shall meet the

performance requirements of this specification.

5.2.1 Contact. The contact shall be Phosphor Bronze Alloy UNS C51000 in accordance with

ASTM B-159.

5.2.2 Insulator. The insulator shall be glass filled polyester in accordance with MIL-M-24519,

Type GPT-30F, all plastic material shall be rated V-0 in accordance with UL-94.

5.3 Finish

5.3.1 The finish on the contact shall be as specified herein for the particular type (see 2.0 ) of connector

under consideration.

5.3.2 Types 1 through III. The contact shall be plated with the specified minimum thickness (see 2.0) of

gold in accordance with MIL-G-45204, Type II Grade C over 50 microinches, minimum of nickel in

accordance with QQ-N-290, Class 2.

5.3.3 Type IV. The contact shall be plated with 150 microinches, minimum thickness (See 2.0) of

Palladium Nickel.

5.3.4 Type V & VI. The contact shall be plated with the specified minimum thickness (see 2.0) of

Palladium Nickel.

5.3.5 Type VII. The contact shall be plated on the mated end with the specified minimum thickness

(see 2.0) of gold in accordance with MIL-G-45204, Type II Grade C over 50 microinches,

minimum of nickel in accordance with QQ-N-290, Class 2. On the PCB side the contact shall be

plated with 150 microinches, minimum, of 93/7 tin-lead in accordance with ML-P-81728.

5.3.6 Type VIII. The contact shall be complaint press fit with the specified minimum thickness of plating

of Type I through VIII.

5.4 Design and Construction

The connector shall be a multi-piece assembly having two rows of contacts, on a rectangular grid of

.100 inch. The connector is designed with solder tail termination for installation in .040 inch diameter

holes in printed wiring boards with recommended thickness of .063 inch to .125 inch. The slotted header

connector is also designed for press fit terminal having (3) three levels of wrap post length .310 inch,

.480 inch and .680 inch. For solderless connection in accordance with MIL-STD-1130, the

recommended PCB thickness is .093 inch to .187 inch having a diameter from .038 inch to .044 inch.

Both the solder tail and the press fit pin shall be available with all the plating types and thickness from

paragraph 2.0 type description.

5.4.1 Wrap Post/Mating Contact. The wrap post geometry shall be in accordance with MIL-STD-1130.

Both tips of the contact shall be beveled to facilitate insertion into the bit of the wire wrap tooling or

into the mating female contact.

Form E-3334

Rev E

GS-01-001

PDM: Rev:B

STATUS:

Released

Printed: Nov 28, 2010

TYPE

NUMBER

PRODUCT SPECIFICATION

TITLE

PAGE

BUS-12-059

REVISION

SLOTTED and VERTICAL STACKING HEADER CONNECTORS

4 of 21

AUTHORIZED BY

DATE

10-Oct-06

M. Barrios

CLASSIFICATION

UNRESTRICTED

5.4.2 Workmanship. Connectors shall be uniform in quality and shall be free from burns, scratches,

cracks, voids, chips, blisters, pin holes, sharp edges, and other defects that will adversely affect

life or serviceability.

5.4.3 Interchangeability. The connector shall be capable of mating with corresponding components

from any source, provided those components are of the same contact population spacing, and

guide post polarization.

6.0 ELECTRICAL CHARACTERISTICS

6.1 Current Rating. The maximum current rating of the connector shall be 3.0 amperes D.C. The mated

maximum current rating shall be 3.0 amperes D.C. or less depending on the current rating characteristics

for the mated connector.

6.2 Insulation Resistance. The insulation resistance of the unmated and unterminated connector shall not be

less than 5000 Megohms after exposure to the humidity environment described in Para. 8.1 when

measured in accordance with MIL-STD-1344, Method 3003. The following details shall apply:

a. Test condition - 500 volts D.C. applied for (1) minute.

b. Points of Measurement - Between individually paired adjacent contacts.

6.3 Dielectric Withstanding Voltage. There shall be no evidence of arc-over, insulation breakdown or

excessive leakage current (> 1 milliampere) when the unmated connectors are tested in accordance with

MIL-STD-1344, Method 3001. The following details shall apply:

a. Test Potential - 750 Volts RMS 60 HZ at sea level pressure.

b. Test duration - 60 seconds

c. Points of measurement – between individually paired adjacent and opposing contacts.

6.4 Capacitance. The capacitance between pairs of adjacent or opposing contacts in an unmated connector

shall not exceed 2.0 picofarads when measured in accordance with MIL-STD-202, Method 305, at a

frequency of 100 Kilohertz.

6.5 Low-Level Circuit Resistance. The low-level circuit resistance between the compliant press-fit pins and

the plated-through hole, when the connector assembly is pressed on a printed circuit board in

accordance with Para. 9.9, shall not exceed 0.2 milliohms (0.5 milliohms after environmental

conditioning), when measured in accordance with MIL-STD-1344, Method 3002. The following details

shall apply:

Test conducted on the pins at the extreme end of the insulator.

Test current – 100 MA, maximum (short-circuit)

Open circuit Voltage – 20 MV D.C. Maximum

Method of Connection - Attach current and voltage leads as shown in Figure 1.

Test Conducted on PC boards, with the maximum plated through hole tolerance. (Ref. Para. 9.5)

Form E-3334

Rev E

GS-01-001

PDM: Rev:B

STATUS:

Released

Printed: Nov 28, 2010

Recommended Resources

Circuit 2 for controlling one light in multiple places

DC power amplifier with fault indication

Video Game Fishing Circuit

STK437 audio IC circuit diagram

Standard battery buffer amplifier circuit

Computer motherboard circuit diagram 440LX_04

EEWORLD University - Hands-on tutorial on Hercules Launchpad (3): Step-by-step tutorial on Hercules Launchpad (3) : https://training.eeworld.com.cn/course/299...; cuipin Talking

Duty cycle setting problem: In 28335, EPwm2Regs.CMPA.half.CMPA = 0.5*Tcon; this kind of statement, the actual waveform, the duty cycle is not 0.5, and it is also related to the phase TBPHS (theoretically, there should be no rela...; lzx_18570633112 DSP and ARM Processors

5FPC Inductance Calculation (Zhou Jiemin, China Southern Airlines): ...; czf0408 Power technology

How to inherit an existing form in EVC?: I have defined a form dlg1 in VC/EVC, and some events and components have been encapsulated in the form. Now I want to make another form, but the content of this form only adds some things on the basi...; canyun0311 Embedded System

Share how to use GPIO to simulate I2C communication on C2000: As a simple digital communication method, I2C only needs two data lines to complete the communication between the host (Master) and the slave (Slave) at a short distance, saving MCU pins and additiona...; Jacktang Microcontroller MCU

I am learning vhdl and want to buy a wrench. Please give me some suggestions.: What type of board? Where can I buy it in Zhongguancun? How much does it cost?...; shdh6015 Embedded System

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components