Edition 2015-07-1626
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2015 Infineon Technologies AG
All Rights Reserved.
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TDA21320
Revision History
Page or Item
Subjects (major changes since previous revision)
Package drawings figures 18 – 20 updated
Inserted chapter 10 (packaging information)
Revision 2.4, 2015-07-16
Trademarks of Infineon Technologies AG
AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™,
CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™,
EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™,
ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™,
PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™,
SIEGET™, SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™,
TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by
AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum.
COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™
of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium.
HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™
of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR
STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc.
MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc.
MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE
OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc.
Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of
Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd.
Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc.
TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company
Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments
Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex
Limited.
Last Trademarks Update 2010-10-26
Data Sheet
3
Revision 2.4, 2015-07-16
TDA21320
Applications
1
Applications
Desktop and Server Vcore and non-Vcore buck-converter
Single Phase and Multiphase POL
CPU/GPU Regulation in Notebook, Desktop Graphics Cards, DDR Memory, Graphic Memory
High Power Density Voltage Regulator Modules (VRM).
2
Features
Input voltage range +4.5 V to +16 V
Maximum average current up to 60 A
For synchronous Buck step down voltage applications
Power MOSFETs rated 25 V for safe operation under all conditions
Fast switching technology for improved performance at high switching frequencies (> 750 kHz)
1
Up to 95.5% peak efficiency
Includes bootstrap diode
Shoot through protection
Max +8 V V
GS
, high-side and low-side MOSFET gate driving voltage
Compatible to standard +3.3 V PWM controller integrated circuits
Tri-state PWM input functionality
Small package: LG-WIQFN-38-1 (6.6x4.5x0.6 mm³)
RoHS compliant
Integrated temperature sense
Integrated current sense
Product Identification
Temp Range
-25C to 125C
Package
LG-WIQFN-38-1 (6.6x4.5x0.6 mm³)
Marking
TDA21320
Table 1
Part Number
TDA21320
Figure 1
1
Picture of the Product
f
sw
= 429 kHz, V
DRV
= 5V, Vin = 12V, Vout = 1.8V, 5 phases, no heatsink, no airflow
Data Sheet
4
Revision 2.4, 2015-07-16
TDA21320
Description
3
3.1
Description
Pinout
Figure 2
Table 2
Pin No.
2
3
Pinout, Numbering and Name of Pins (transparent top view)
I/O Signals
Name
PWM
OFF#
Pin Type Buffer Type Function
I/O
I
+3.3 V logic
+3.3 V logic
PWM drive logic input, Status output for VCIN
The tri-state PWM input is compatible with 3.3 V.
Deactivates LS-MOSFET
Pull low to prevent LS-FET turn-on. Leave open if not used.
(If traced out in noisy layout it may require external pull up.)
Load current Sensing
Provides a voltage proportional to the high/low-side
MOSFET currents; Leave open if not used.
Load current Sensing
Reference to pin 4; Leave open if not used.
Thermal Sensing / Fault Pin
Temperature reporting, fault signaling by logic “H”; Status
output of VDRV, Leave open if not used.
Bootstrap voltage pin
Connect to BOOT capacitor
Switch node input
Internally connected to SW pins, Connect to BOOT
capacitor as reference pin for boot voltage
Switch node output
High current output switching node
5
Revision 2.4, 2015-07-16
4
IMON
O
Analog
5
7
IMONREF
O
Analog
Analog/
Digital
Analog
Analog
TMON/FAULT O
8
9
BOOT
PHASE
I
I
33-38
(pads)
SW
O
Analog
Data Sheet