CSPEMI201A
2 Channel Headset Speaker EMI Filter with ESD Protection
Features
•
•
•
•
•
•
•
•
•
•
Two channels of EMI filtering
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
Greater than 40dB attenuation at 1GHz
+
8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
+
15kV ESD protection in each channel (HBM)
Supports AC signals—ideal for
audio applications
Extremely low lead inductance for optimum filter
and ESD performance
5-bump, 0.950mm X 1.410mm footprint
Chip Scale Package (CSP)
Lead-free version available
Product Description
The CSPEMI201A is a dual low-pass filter array inte-
grating two pi-style filters (C-R-C) that reduce EMI/RFI
emissions while at the same time providing ESD pro-
tection. This part is custom-designed to interface with a
speaker port on a cellular telephone or similar device.
Each high quality filter provides more than 35dB atten-
uation in the 800-2700 MHz range. These pi-style fil-
ters support bidirectional filtering, controlling EMI both
to and from a speaker element. They also support
bipolar signals with a cutoff frequency of 31MHz,
enabling audio signals to pass through without distor-
tion.
In addition, the CSPEMI201A provides a very high
level of protection for sensitive electronic components
that may be subjected to electrostatic discharge (ESD).
The CSPEMI201A can safely dissipate ESD strikes of
8kV, the maximum requirement of the IEC 61000-4-2
international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the device provides protection for contact
discharges to greater than 15kV.
The CSPEMI201A is particularly well suited for porta-
ble electronics (e.g., cellular telephones, PDAs, note-
book computers) because of its small package format
and low weight. The CSPEMI201A is available in a
space-saving, low-profile Chip Scale Package with
optional lead-free finishing.
Applications
•
•
•
•
•
•
•
EMI filtering and ESD protection for headset
speaker ports
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Camcorders
Notebooks
Desktop PCs
Electrical Schematic
SPKR_IN1
A1
10Ω
C1
100pF
SPKR_OUT1
100pF
SPKR_IN2
A3
10Ω
C3
100pF
SPKR_OUT2
100pF
GND
B2
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
1
CSPEMI201A
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
BOTTOM VIEW
(Bumps Up View)
SPKR_OUT1 SPKR_OUT2
1 2 3
A
B
C
C1
C3
GND
AB
B2
Pin "A1"
Marking
SPKR_IN1
SPKR_IN2
A1
A3
A1
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
CSPEMI201A
CSP Package
PIN DESCRIPTIONS
PIN
A1
A3
B2
C1
C3
NAME
SPKR_IN1
SPKR_IN2
GND
SPKR_OUT1
SPKR_OUT2
DESCRIPTION
Speaker Input 1 (from audio circuitry)
Speaker Input 2 (from audio circuitry)
Device Ground
Speaker Output 1 (to speaker)
Speaker Output 2 (to speaker)
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Ordering Part
Pins
5
Package
CSP
Number
1
CSPEMI201A
Part Marking
AB
Lead-free Finish
2
Ordering Part
Number
1
CSPEMI201AG
Part Marking
AB
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
© 2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
10/09/03
CSPEMI201A
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
DC Power per Resistor
DC Package Power Rating
RATING
-65 to +150
100
200
UNITS
°C
mW
mW
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
RATING
-40 to +85
UNITS
°C
ELECTRICAL OPERATING CHARACTERISTICS
1
SYMBOL
R
C
I
LEAK
V
SIG
PARAMETER
Resistance
Capacitance
Diode Leakage Current
Signal Voltage
Positive Clamp
Negative Clamp
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Cut-off frequency
Z
SOURCE
= 50Ω, Z
LOAD
= 50Ω
V
IN
=5.0V
I
LOAD
= 10mA
5
-5
Notes 2,4 and 5
±15
±8
Notes 2,3,4 and 5
+15
-19
R = 10Ω, C = 100pF
31
V
V
MHz
kV
kV
7
-10
15
-15
V
V
CONDITIONS
MIN
9
80
TYP
10
100
MAX
11
120
1.0
UNITS
Ω
pF
µA
V
ESD
V
CL
f
C
Note 1: T
A
=25
°
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
3
CSPEMI201A
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)
© 2003 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
10/09/03
CSPEMI201A
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask defined pads
0.325mm Round
0.125 - 0.150mm
0.330mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50µm
+20µm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (°C)
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
L
Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
5
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