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NTJD2152PT1

Description
MOSFET 8V Dual P-Channel
CategoryDiscrete semiconductor    The transistor   
File Size126KB,6 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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NTJD2152PT1 Overview

MOSFET 8V Dual P-Channel

NTJD2152PT1 Parametric

Parameter NameAttribute value
Brand NameON Semiconductor
Is it lead-free?Contains lead
MakerON Semiconductor
Parts packaging codeSC-70
package instruction2 X 2 MM, CASE 419B-02, SC-88, SC-70-6, 6 PIN
Contacts6
Manufacturer packaging code419B-02
Reach Compliance Codenot_compliant
ECCN codeEAR99
ConfigurationSEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR
Minimum drain-source breakdown voltage8 V
Maximum drain current (Abs) (ID)0.775 A
Maximum drain current (ID)0.775 A
Maximum drain-source on-resistance0.3 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
Maximum feedback capacitance (Crss)40 pF
JESD-30 codeR-PDSO-G6
JESD-609 codee0
Number of components2
Number of terminals6
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)240
Polarity/channel typeP-CHANNEL
Maximum power dissipation(Abs)0.55 W
Certification statusNot Qualified
surface mountYES
Terminal surfaceTin/Lead (Sn80Pb20)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature30
transistor applicationsSWITCHING
Transistor component materialsSILICON
NTJD2152P
Trench Small Signal
MOSFET
8 V, Dual P−Channel, SC−88
ESD Protection
Features
http://onsemi.com
V
(BR)DSS
R
DS(on)
TYP
0.22
W
@
−4.5
V
−8
V
0.32
W
@
−2.5
V
0.51
W
@
−1.8
V
−0.775
A
I
D
Max
Leading –8 V Trench for Low R
DS(ON)
Performance
ESD Protected Gate
Small Footprint (2 x 2 mm)
Same Package as SC−70−6
Pb−Free Packages are Available
Load Power switching
DC−DC Conversion
Li−Ion Battery Charging Circuits
Cell Phones, Media Players, Digital Cameras, PDAs
Applications
SOT−363
SC−88 (6 LEADS)
S
1
Value
−8.0
±8.0
Unit
V
V
A
D
2
1
6
D
1
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise stated)
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current
(Based on R
qJA
)
Power Dissipation
(Based on R
qJA
)
Continuous Drain
Current
(Based on R
qJL
)
Power Dissipation
(Based on R
qJL
)
Pulsed Drain Current
Steady
State
Steady
State
Steady
State
Steady
State
T
A
= 25
°C
T
A
= 85
°C
T
A
= 25
°C
T
A
= 85
°C
T
A
= 25
°C
T
A
= 85
°C
T
A
= 25
°C
T
A
= 85
°C
t
≤10
ms
P
D
I
DM
T
J
,
T
STG
I
S
T
L
I
D
P
D
Symbol
V
DSS
V
GS
I
D
G
1
2
5
G
2
−0.775
−0.558
0.27
0.14
−1.1
−0.8
0.55
0.29
±1.2
−55
to
150
−0.775
260
3
4
S
2
W
Top View
A
MARKING DIAGRAM &
PIN ASSIGNMENT
D1 G2 S2
1
6
TA M
G
G
1
S1 G1 D2
TA
M
G
= Device Code
= Date Code
= Pb−Free Package
W
SC−88/SOT−363
A
CASE 419B
STYLE 28
Operating Junction and Storage Temperature
Continuous Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
°
C
A
°C
(Note: Microdot may be in either location)
Symbol
R
qJA
R
qJL
Typ
400
194
Max
460
226
Unit
°C/W
THERMAL RESISTANCE RATINGS
(Note 1)
Parameter
Junction−to−Ambient – Steady State
Junction−to−Lead (Drain) – Steady State
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 oz Cu area = 0.9523 in sq.
©
Semiconductor Components Industries, LLC, 2006
March, 2006
Rev. 3
1
Publication Order Number:
NTJD2152/D

NTJD2152PT1 Related Products

NTJD2152PT1 NTJD2152PT2G
Description MOSFET 8V Dual P-Channel MOSFET 8V Dual P-Channel ESD Protection
Brand Name ON Semiconductor ON Semiconductor
Is it lead-free? Contains lead Lead free
Maker ON Semiconductor ON Semiconductor
Parts packaging code SC-70 SC-70
package instruction 2 X 2 MM, CASE 419B-02, SC-88, SC-70-6, 6 PIN 2 X 2 MM, LEAD FREE, CASE 419B-02, SC-88, SC-70-6, 6 PIN
Contacts 6 6
Manufacturer packaging code 419B-02 419B-02
Reach Compliance Code not_compliant compliant
ECCN code EAR99 EAR99
Configuration SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR
Minimum drain-source breakdown voltage 8 V 8 V
Maximum drain current (Abs) (ID) 0.775 A 1.1 A
Maximum drain current (ID) 0.775 A 0.775 A
Maximum drain-source on-resistance 0.3 Ω 0.3 Ω
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
Maximum feedback capacitance (Crss) 40 pF 40 pF
JESD-30 code R-PDSO-G6 R-PDSO-G6
JESD-609 code e0 e3
Number of components 2 2
Number of terminals 6 6
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE
Maximum operating temperature 150 °C 150 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 240 260
Polarity/channel type P-CHANNEL P-CHANNEL
Maximum power dissipation(Abs) 0.55 W 0.55 W
Certification status Not Qualified Not Qualified
surface mount YES YES
Terminal surface Tin/Lead (Sn80Pb20) Tin (Sn)
Terminal form GULL WING GULL WING
Terminal location DUAL DUAL
Maximum time at peak reflow temperature 30 40
transistor applications SWITCHING SWITCHING
Transistor component materials SILICON SILICON
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