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BAT54XV2 — Schottky Barrier Diode
June 2015
BAT54XV2
Schottky Barrier Diode
Features
•
•
•
•
•
•
•
Low Forward Voltage Drop
Flat Lead, Surface Mount Device at 0.60mm Height
Extremely Small Outline Plastic Package SOD523F
Moisture Level Sensitivity 1
Pb-free Version and RoHS Compliant
Matte Tin (Sn) Lead Finish
Green Mold Compound
Cathode
Anode
ELECTRICAL SYMBOL
SOD-523F
Band Indicates Cathode
BAT54XV2 Marking: 5B
Ordering Information
Part Number
BAT54XV2
Top Mark
5B
Package
SOD-523F 2L
Packing Method
Tape and Reel
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at T
A
= 25°C unless otherwise noted.
Symbol
V
RRM
V
R
I
F(AV)
I
FSM
T
J
T
STG
Parameter
Maximum Repetitive Reverse Voltage
Maximum DC Blocking Voltage
Average Rectified Forward Current
Peak Forward Surge Current (Square Wave at pw = 300
μsec)
Operating Junction Temperature
Storage Temperature Range
Value
30
30
200
4
+125
-65 to +125
Unit
V
V
mA
A
°C
°C
© 2009 Fairchild Semiconductor Corporation
BAT54XV2 Rev. 1.2
www.fairchildsemi.com
BAT54XV2 — Schottky Barrier Diode
Thermal Characteristics
Values are at T
A
= 25°C unless otherwise noted.
Symbol
P
D
R
θJA
Power Dissipation
Parameter
Thermal Resistance, Junction-to-Ambient
(1)
Value
200
500
Unit
mW
°C/W
Note:
1. Device mounted on FR-4 PCB minimum land pad.
Electrical Characteristics
Values are at T
A
= 25°C unless otherwise noted.
Symbol
BV
R
I
R
Parameter
Breakdown Voltage
Reverse Leakage Current
Conditions
I
R
= 10
μA
V
R
= 25 V
I
F
= 0.1 mA
I
F
= 1 mA
Min.
30
Max.
2
0.24
0.32
0.40
0.50
0.80
5
10
Unit
V
μA
V
F
Forward Voltage
I
F
= 10 mA
I
F
= 30 mA
I
F
= 100 mA
I
F
= I
R
= 10 mA, R
L
= 100
Ω,
I
RR
= 1 mA
V
R
= 1 V, f = 1 MHz
V
T
RR
C
Reverse Recovery Time
Capacitance
nS
pF
© 2009 Fairchild Semiconductor Corporation
BAT54XV2 Rev. 1.2
www.fairchildsemi.com
2
0.90
0.70
A
B
0.8
1.30
1.10
0.50
0.25
2.0
TOP VIEW
0.35
0.25
0.10
M
B A
LAND PATTERN RECOMMENDATION
0.70 MAX
0.20
FRONT VIEW
SEATING PLANE
1.70
1.50
SIDE VIEW
0.20 MAX
NOTES:
A. CONFORMS TO JEITA SC-79
B. ALL DIMENSIONS ARE IN MILLIMETERS
C. DRAWING CONFORMS TO ASME Y14.5M-2009
D. DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH, AND TIE BAR PROTRUSIONS.
E. LAND PATTERN RECOMMENDATION IS BASED ON
IPC7351A STANDARD SOD1609X65M
F. DRAWING FILENAME: MKT-SOD523F1rev2
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