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KMPC8313ZQADDB

Description
Microprocessors - MPU 8313 REV2.1 W/O ENCR
Categorysemiconductor    The embedded processor and controller   
File Size1MB,99 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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KMPC8313ZQADDB Overview

Microprocessors - MPU 8313 REV2.1 W/O ENCR

KMPC8313ZQADDB Parametric

Parameter NameAttribute value
Product CategoryMicroprocessors - MPU
ManufacturerNXP
RoHSNo
Mounting StyleSMD/SMT
Package / CasePBGA-516
Coree300c3
Number of Cores1 Core
Data Bus Width32 bit
Maximum Clock Frequency266 MHz
L1 Cache Instruction Memory16 kB
L1 Cache Data Memory16 kB
Operating Supply Voltage1 V
Maximum Operating Temperature+ 105 C
PackagingTray
I/O Voltage1.8 V, 2.5 V, 3.3 V
Instruction TypeFloating Point
Interface TypeEthernet, I2C, PCIe, SPI, UART, USB
Memory TypeL1 Cache
Minimum Operating Temperature0 C
Moisture SensitiveYes
Number of Timers/Counters2 x 32 bit
Processor SeriesPowerQUICC II Pro
Factory Pack Quantity2
Watchdog TimersWatchdog Timer
Unit Weight0.200033 oz
Freescale Semiconductor
Datasheet: Technical Data
Document Number: MPC8313EEC
Rev. 4, 11/2011
MPC8313E
PowerQUICC II Pro Processor
Hardware Specifications
This document provides an overview of the MPC8313E
PowerQUICC™ II Pro processor features, including a block
diagram showing the major functional components. The
MPC8313E is a cost-effective, low-power, highly integrated
host processor that addresses the requirements of several
printing and imaging, consumer, and industrial applications,
including main CPUs and I/O processors in printing systems,
networking switches and line cards, wireless LANs
(WLANs), network access servers (NAS), VPN routers,
intelligent NIC, and industrial controllers. The MPC8313E
extends the PowerQUICC™ family, adding higher CPU
performance, additional functionality, and faster interfaces
while addressing the requirements related to time-to-market,
price, power consumption, and package size.
NOTE
The information in this document is accurate for
revisions 1.0, 2.x, and later. See
Section 23.1, “Part
Numbers Fully Addressed by this Document.”
Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 12
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 13
DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 14
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Ethernet: Three-Speed Ethernet, MII Management . 21
High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 36
USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Enhanced Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . 47
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
I
2
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 63
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
System Design Information . . . . . . . . . . . . . . . . . . . 87
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 93
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
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© Freescale Semiconductor, Inc., 2007–2011. All rights reserved.

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