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BAS21WS-TP

Description
USB Connectors WR-COM 3.0 Type A 9Pin HztlFeml Offset
Categorysemiconductor    Discrete semiconductor   
File Size212KB,2 Pages
ManufacturerMCC
Websitehttp://www.mccsemi.com
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BAS21WS-TP Overview

USB Connectors WR-COM 3.0 Type A 9Pin HztlFeml Offset

BAS21WS-TP Parametric

Parameter NameAttribute value
Product CategoryDiodes - General Purpose, Power, Switching
ManufacturerMCC
RoHSDetails
ProductSwitching Diodes
Mounting StyleSMD/SMT
Package / CaseSOD-323-2
Peak Reverse Voltage250 V
Max Surge Current0.625 A
If - Forward Current0.2 A
ConfigurationSingle
Recovery Time50 ns
Vf - Forward Voltage1.25 V
Minimum Operating Temperature- 55 C
Maximum Operating Temperature+ 155 C
PackagingMouseReel
PackagingCut Tape
PackagingReel
Height1 mm
Length1.8 mm
Factory Pack Quantity3000
TypeSwitching Diode
Width1.35 mm
Unit Weight0.000363 oz
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

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BAS21WS
Features
Halogen
free available upon request by adding suffix "-HF"
. Surface Mount Application.
For
Device Marking: JS
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
For Surface Mount Application.
.
Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
High Voltage
Switching Diode
Unit
Vdc
mAdc
mAdc
C
Maximum Ratings
Symbol
V
R
I
F
I
FM(surge)
Rating
Continuous Reverse Voltage
Peak Forward Current
Peak Forward Surge Current
Value
250
200
625
SOD-323
A
B
Thermal Characteristics
Symbol
P
D
R
JA
T
J,
T
STG
Characteristic
Total Device Dissipation FR-5
Board *, T
A
=25
O
C
Derate above 25
O
C
Thermal Resistance Junction to
Ambient
Junction and Storage Temperature
Range
Max
200
Unit
mW
E
1.57
mW/
O
C
O
635
C/W
O
H
D
-55 to
+155
C
G
Electrical Characteristics @ 25
O
C Unless Otherwise Specified
Symbol
Characteristic
Min
Max
Unit
J
Off Characteristics
I
R
Reverse Voltage Leakage Current
(V
R
=200Vdc)
(V
R
=200Vdc, T
J
=150
O
C)
Reverse Breakdown Voltage
(I
BR
=100uAdc)
Forward Voltage
(I
F
=100mAdc)
(I
F
=200mAdc)
Diode Capacitance
(V
R
=0, f=1.0MHz)
Reverse Recovery Time
(I
F
=I
R
=30mAdc, R
L
=100 OHM)
---
---
0.1
100
uAdc
DIM
V
(BR)
250
---
Vdc
V
F
---
---
1000
1250
mVdc
A
B
C
D
E
G
H
J
DIMENSIONS
INCHES
MM
MIN
MAX
MIN
MAX
.090
.107
2.30
2.70
.063
.071
1.60
1.80
.045
.053
1.15
1.35
.031
.045
0.80
1.15
.010
.016
0.25
0.40
.004
.018
0.10
0.45
.004
.010
0.10
0.25
-----
.006
-----
0.15
SUGGESTED SOLDER
PAD LAYOUT
0.074"
NOTE
C
D
---
5.0
pF
trr
---
50
ns
*FR-5 Minimum Pad
0.027”
0.022”
Revision:
B
www.mccsemi.com
1 of 2
2013/01/01

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