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BR24G16FJ-3GTE2

Description
Translation - Voltage Levels Dual Bit Dual-Supply Bus Xcvr
Categorystorage    storage   
File Size1MB,40 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Environmental Compliance
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BR24G16FJ-3GTE2 Overview

Translation - Voltage Levels Dual Bit Dual-Supply Bus Xcvr

BR24G16FJ-3GTE2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instructionLSOP,
Reach Compliance Codecompliant
Factory Lead Time10 weeks
Other featuresSEATED HGT CALCULATED
Maximum clock frequency (fCLK)0.4 MHz
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.9 mm
memory density16384 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count2048 words
character code2000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2KX8
Package body materialPLASTIC/EPOXY
encapsulated codeLSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height1.65 mm
Serial bus typeI2C
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.6 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm
Maximum write cycle time (tWC)5 ms
Base Number Matches1
Datasheet
Serial EEPROM Series Standard EEPROM
I
2
C BUS EEPROM (2-Wire)
BR24G16-3
General Description
BR24G16-3 is a 16Kbit serial EEPROM of I
2
C BUS Interface.
Features
Completely conforming to the world standard I
2
C
BUS.
All controls available by 2 ports of serial clock
(SCL) and serial data (SDA)
Other devices than EEPROM can be connected to
the same port, saving microcontroller port
1.6V to 5.5V Single Power Source Operation most
suitable for battery use
1.6V to 5.5V wide limit of operating voltage, possible
FAST MODE 400kHz operation
Up to 16 Byte in Page Write Mode
Bit Format 2K x 8bit
Self-timed Programming Cycle
Low Current Consumption
Prevention of Write Mistake
WP(Write Protect) Function added
Prevention of Write Mistake at Low Voltage
More than 1 million write cycles
More than 40 years data retention
Noise filter built in SCL / SDA terminal
Initial delivery state FFh
Packages
W(Typ) x D(Typ) x H(Max)
DIP-T8
9.30mm x 6.50mm x 7.10mm
TSSOP-B8
3.00mm x 6.40mm x 1.20mm
SOP8
5.00mm x 6.20mm x 1.71mm
TSSOP-B8M
3.00mm x 6.40mm x 1.10mm
SOP- J8M
4.90mm x 6.00mm x 1.80mm
TSSOP-B8J
3.00mm x 4.90mm x 1.10mm
SOP- J8
4.90mm x 6.00mm x 1.65mm
MSOP8
2.90mm x 4.00mm x 0.90mm
SSOP-B8
3.00mm x 6.40mm x 1.35mm
VSON008X2030
2.00mm x 3.00mm x 0.60mm
VMMP008Z1830
1.85mm x 3.00mm x 0.40mm
Figure 1.
○Product
structure:Silicon monolithic integrated circuit
www.rohm.com
©2013 ROHM Co., Ltd. All rights reserved.
TSZ22111½14½001
○This
product has no designed protection against radioactive rays
1/36
TSZ02201-0R2R0G100200-1-2
6.Sep.2016 Rev.008

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Description Translation - Voltage Levels Dual Bit Dual-Supply Bus Xcvr Headers u0026 Wire Housings 2MM R/A PIN HDR 4P SMT GOLD EEPROM I2C BUS 16Kbit(2048x8bit) EEPROM RF Connectors / Coaxial Connectors R/A PCB Skt
Is it Rohs certified? conform to conform to conform to conform to
package instruction LSOP, LSSOP, HVSON, TSSOP,
Reach Compliance Code compliant compliant compliant compliant
Factory Lead Time 10 weeks 10 weeks 11 weeks 10 weeks
Maximum clock frequency (fCLK) 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-N8 R-PDSO-G8
JESD-609 code e3 e3 e3 e3
length 4.9 mm 4.4 mm 3 mm 4.4 mm
memory density 16384 bit 16384 bit 16384 bit 16384 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 8 8 8 8
word count 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 2KX8 2KX8 2KX8 2KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LSOP LSSOP HVSON TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, LOW PROFILE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Maximum seat height 1.65 mm 1.35 mm 0.6 mm 1.2 mm
Serial bus type I2C I2C I2C I2C
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.6 V 1.6 V 1.6 V 1.6 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin (Sn) Tin (Sn) Tin (Sn) Tin (Sn)
Terminal form GULL WING GULL WING NO LEAD GULL WING
Terminal pitch 1.27 mm 0.65 mm 0.5 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 3.9 mm 3 mm 2 mm 3 mm
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms
Base Number Matches 1 1 1 1
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