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M27C2001-12C6

Description
EPROM 2M (256Kx8) 120ns
Categorystorage    storage   
File Size203KB,25 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Environmental Compliance
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M27C2001-12C6 Overview

EPROM 2M (256Kx8) 120ns

M27C2001-12C6 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSTMicroelectronics
Parts packaging codeQFJ
package instructionQCCJ, LDCC32,.5X.6
Contacts32
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time120 ns
I/O typeCOMMON
JESD-30 codeR-PQCC-J32
JESD-609 codee3
length13.995 mm
memory density2097152 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals32
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)250
power supply5 V
Certification statusNot Qualified
Maximum seat height3.56 mm
Maximum standby current0.0001 A
Maximum slew rate0.035 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperature40
width11.4554 mm
M27C2001
2 Mbit (256Kb x 8) UV EPROM and OTP EPROM
Features
5V ± 10% supply voltage in Read operation
Access time: 55ns
Low power consumption:
– Active Current 30mA at 5MHz
– Standby Current 100µA
Programming voltage: 12.75V ± 0.25V
Programming time: 100µs/word
Electronic signature
– Manufacturer Code: 20h
– Device Code: 61h
Packages
– ECOPACK
®
packages available.
32
32
1
1
FDIP32W (F)
PDIP32 (B)
PLCC32 (C)
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TSOP32 (N)
8 x 20 mm
May 2006
Rev 4
1/25
www.st.com
1

M27C2001-12C6 Related Products

M27C2001-12C6 M27C2001-55XF1 M27C2001-55C1 M27C2001-90C1 M27C2001-70XF1
Description EPROM 2M (256Kx8) 120ns EPROM 2M (256Kx8) 55ns EPROM 2M (256Kx8) 55ns EPROM 2M (256Kx8) 90ns EPROM 2M (256Kx8) 70ns
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
Parts packaging code QFJ DIP QFJ QFJ DIP
package instruction QCCJ, LDCC32,.5X.6 LEAD FREE, WINDOWED, FRIT SEALED, CERAMIC, DIP-32 LEAD FREE, PLASTIC, LCC-32 LEAD FREE, PLASTIC, LCC-32 LEAD FREE, WINDOWED, FRIT SEALED, CERAMIC, DIP-32
Contacts 32 32 32 32 32
Reach Compliance Code compliant compliant compliant compliant unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 120 ns 55 ns 55 ns 90 ns 70 ns
I/O type COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PQCC-J32 R-CDIP-T32 R-PQCC-J32 R-PQCC-J32 R-CDIP-T32
JESD-609 code e3 e3 e3 e3 e3
length 13.995 mm 41.885 mm 13.995 mm 13.995 mm 41.885 mm
memory density 2097152 bit 2097152 bit 2097152 bit 2097152 bit 2097152 bit
Memory IC Type OTP ROM UVPROM OTP ROM OTP ROM UVPROM
memory width 8 8 8 8 8
Number of functions 1 1 1 1 1
Number of terminals 32 32 32 32 32
word count 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 70 °C 70 °C
organize 256KX8 256KX8 256KX8 256KX8 256KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
encapsulated code QCCJ WDIP QCCJ QCCJ WDIP
Encapsulate equivalent code LDCC32,.5X.6 DIP32,.6 LDCC32,.5X.6 LDCC32,.5X.6 DIP32,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE, WINDOW CHIP CARRIER CHIP CARRIER IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 250 245 NOT SPECIFIED NOT SPECIFIED 245
power supply 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.56 mm 5.72 mm 3.56 mm 3.56 mm 5.72 mm
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.035 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
Maximum supply voltage (Vsup) 5.5 V 5.25 V 5.5 V 5.5 V 5.25 V
Minimum supply voltage (Vsup) 4.5 V 4.75 V 4.5 V 4.5 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
Terminal form J BEND THROUGH-HOLE J BEND J BEND THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location QUAD DUAL QUAD QUAD DUAL
Maximum time at peak reflow temperature 40 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 11.4554 mm 15.24 mm 11.4554 mm 11.4554 mm 15.24 mm
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