(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Peak Repetitive Reverse Surge Current (2.0
ms,
1.0 kHz)
Storage Temperature Range
Operating Junction Temperature (Note 1)
Voltage Rate of Change (Rated V
R
)
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
I
FRM
20
I
FSM
150
I
RRM
T
stg
T
J
dv/dt
0.5
−65 to +175
−65 to +175
10,000
A
°C
°C
V/ms
A
Value
60
Unit
V
10
20
A
A
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dP
D
/dT
J
< 1/R
qJA
.
THERMAL CHARACTERISTICS
(Per Leg)
Characteristic
Thermal Resistance,
Junction−to−Case
Junction−to−Ambient (Note 2)
MBRB2060CTG
Junction−to−Ambient (Note 2)
MBR2060CTG
2. When mounted using minimum recommended pad size on FR−4 board.
Symbol
R
qJC
R
qJA
R
qJA
Value
2.0
50
60
Unit
°C/W
ELECTRICAL CHARACTERISTICS
(Per Leg)
Characteristic
Maximum Instantaneous Forward Voltage (Note 3)
(i
F
= 20 Amps, T
J
= 125°C)
(i
F
= 20 Amps, T
J
= 25°C)
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, T
J
= 125°C)
(Rated dc Voltage, T
J
= 25°C)
Symbol
v
F
0.85
0.95
i
R
35
0.15
mA
Value
Unit
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
≤
2.0%.
ORDERING INFORMATION
Device
MBRB2060CTG
MBRB2060CTT4G
NRVBB2060CTT4G*
MBR2060CTG
Package
D
2
PAK
(Pb−Free)
D
2
PAK
(Pb−Free)
D
2
PAK
(Pb−Free)
TO−220
(Pb−Free)
Shipping
†
50 Units / Rail
800 Units / Tape & Reel
800 Units / Tape & Reel
50 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NRVBB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
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2
MBRB2060CTG, MBR2060CTG, NRVBB2060CTT4G
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
50
125°C
150°C
10
100°C
5
3
T
J
= 25°C
I R, REVERSE CURRENT (mA)
20
10
T
J
= 125°C
T
J
= 100°C
1
T
J
= 150°C
0.1
1
0.5
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
v
F
, INSTANTANEOUS VOLTAGE (VOLTS)
0.9
1
0.01
0
20
T
J
= 25°C
40
60
80
100
V
R
, REVERSE VOLTAGE (VOLTS)
120
140
Figure 1. Typical Forward Voltage Per Diode
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
20
dc
15
SQUARE WAVE
10
RATED VOLTAGE APPLIED
R
qJC
= 2°C/W
AVERAGE POWER (WATTS)
20
18
16
14
12
10
8
6
4
2
0
80
100
120
140
T
C
, CASE TEMPERATURE (°C)
160
180
0
0
Figure 2. Typical Reverse Current Per Diode
I
PK
/I
AV
= 5
PI
I
PK
/I
AV
= 10
I
PK
/I
AV
= 20
SQUARE
WAVE
DC
T
J
= 125°C
5.0
2
4
6
8
10
12
14
AVERAGE CURRENT (AMPS)
16
18
20
Figure 3. Typical Current Derating, Case,
Per Leg
Figure 4. Average Power Dissipation and
Average Current
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3
MBRB2060CTG, MBR2060CTG, NRVBB2060CTT4G
PACKAGE DIMENSIONS
D
2
PAK 3
CASE 418B−04
ISSUE K
C
E
−B−
4
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
V
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
INCHES
MIN
MAX
0.340 0.380
0.380 0.405
0.160 0.190
0.020 0.035
0.045 0.055
0.310 0.350
0.100 BSC
0.080
0.110
0.018 0.025
0.090
0.110
0.052 0.072
0.280 0.320
0.197 REF
0.079 REF
0.039 REF
0.575 0.625
0.045 0.055
MILLIMETERS
MIN
MAX
8.64
9.65
9.65 10.29
4.06
4.83
0.51
0.89
1.14
1.40
7.87
8.89
2.54 BSC
2.03
2.79
0.46
0.64
2.29
2.79
1.32
1.83
7.11
8.13
5.00 REF
2.00 REF
0.99 REF
14.60 15.88
1.14
1.40
V
W
A
1
2
3
S
−T−
SEATING
PLANE
K
G
D
H
3 PL
M
W
J
0.13 (0.005)
VARIABLE
CONFIGURATION
ZONE
L
M
M
T B
M
R
N
U
L
M
P
L
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
F
VIEW W−W
1
F
VIEW W−W
2
F
VIEW W−W
3
SOLDERING FOOTPRINT*
10.49
8.38
16.155
2X
3.504
2X
1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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4
MBRB2060CTG, MBR2060CTG, NRVBB2060CTT4G
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AH
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
INCHES
MIN
MAX
0.570
0.620
0.380
0.415
0.160
0.190
0.025
0.038
0.142
0.161
0.095
0.105
0.110
0.161
0.014
0.024
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
---
---
0.080
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.53
4.07
4.83
0.64
0.96
3.61
4.09
2.42
2.66
2.80
4.10
0.36
0.61
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
---
---
2.04
−T−
B
4
SEATING
PLANE
F
T
S
C
Q
1 2 3
A
U
K
H
Z
L
V
G
D
N
R
J
STYLE 6:
PIN 1.
2.
3.
4.
ANODE
CATHODE
ANODE
CATHODE
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
N. American Technical Support:
800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
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