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MAX4366

Description
330mW, Ultra-Small, Audio Power Amplifiers with Shutdown
File Size393KB,18 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Download Datasheet Compare View All

MAX4366 Overview

330mW, Ultra-Small, Audio Power Amplifiers with Shutdown

19-2338; Rev 2; 12/02
330mW, Ultra-Small, Audio Power Amplifiers
with Shutdown
General Description
The MAX4366/MAX4367/MAX4368 are bridged audio
power amplifiers intended for devices with internal
speakers and headsets. The MAX4366/MAX4367/
MAX4368 are capable of delivering 330mW of continu-
ous power into a 32Ω load, or 200mW into a 16Ω load
with 1% THD+N from a single 5V supply.
The MAX4366/MAX4367/MAX4368 bridged outputs elimi-
nate the need for output-coupling capacitors minimizing
external component count. The MAX4366/MAX4367/
MAX4368 also feature a low-power shutdown mode,
clickless power-up/power-down and internal DC bias
generation. The MAX4366 is a unity-gain stable, program-
mable gain amplifier. The MAX4367/MAX4368 feature
internally preset gains of 2V/V and 3V/V, respectively.
All devices are available in space-saving 8-pin SOT23,
thin QFN and µMAX packages, and an 8-bump chip-
scale package (UCSP™).
Features
o
Drives 330mW into 32Ω (200mW into 16Ω)
o
0.02% THD+N at 1kHz (120mW into 32Ω)
o
Internal Bridged Configuration
o
o
o
o
No Output-Coupling Capacitors
2.3V to 5.5V Single-Supply Operation
2mA Supply Current
Low-Power Shutdown Mode
MAX4366/MAX4367/MAX4368
o
Clickless Power-Up and Shutdown
o
Thermal Overload Protection
o
Available in SOT23, Thin QFN, µMAX, and UCSP
Packages
Ordering Information
PART
TEMP RANGE
PIN/BUMP-
PACKAGE
8 UCSP-8
8 SOT23-8
8 µMAX
8 Thin QFN-EP*
TOP
MARK
AAK
AAIO
AAC
Applications
Cellular Phones
Two-Way Radios
PDAs
Headphones
Headsets
General-Purpose Audio
MAX4366EBL-T
-40°C to +85°C
MAX4366EKA-T -40°C to +85°C
MAX4366EUA
MAX4366ETA
-40°C to +85°C
-40°C to +85°C
*EP
= Exposed paddle.
Ordering Information continued at end of data sheet.
Selector Guide and Functional Diagrams appear at end of
data sheet.
Pin Configurations
TOP VIEW
(BUMP SIDE
DOWN)
1
A
IN-
OUT+
IN+
2
3
Typical Operating Circuit
V
CC
V
CC
BIAS
CLICKLESS/POPLESS
SHUTDOWNCONTROL
SHDN
OUT-
B
GND
MAX4366
MAX4367
MAX4368
V
CC
IN+
AUDIO
INPUT
OUT+
IN-
C
BIAS
OUT-
SHDN
UCSP
MAX4367
MAX4368
GND
Pin Configurations continued at end of data sheet.
UCSP is a trademark of Maxim Integrated Products, Inc.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX4366 Related Products

MAX4366 MAX4366EKA-T MAX4366EBL-T MAX4366EUA MAX4366ETA MAX4367 MAX4368
Description 330mW, Ultra-Small, Audio Power Amplifiers with Shutdown 330mW, Ultra-Small, Audio Power Amplifiers with Shutdown 330mW, Ultra-Small, Audio Power Amplifiers with Shutdown 330mW, Ultra-Small, Audio Power Amplifiers with Shutdown 330mW, Ultra-Small, Audio Power Amplifiers with Shutdown 330mW, Ultra-Small, Audio Power Amplifiers with Shutdown 330mW, Ultra-Small, Audio Power Amplifiers with Shutdown
Is it Rohs certified? - incompatible incompatible incompatible incompatible - -
Parts packaging code - SOIC BGA TSSOP SON - -
package instruction - LSSOP, TSSOP8,.1 UCSP-8 TSSOP, TSSOP8,.19 3 X 3 MM, 0.80 MM HEIGHT, MO-229, TQFN-8 - -
Contacts - 8 8 8 8 - -
Reach Compliance Code - _compli _compli _compli _compli - -
ECCN code - EAR99 EAR99 EAR99 EAR99 - -
Nominal bandwidth - 20 kHz 20 kHz 20 kHz 20 kHz - -
Commercial integrated circuit types - AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER - -
JESD-30 code - R-PDSO-G8 S-PBGA-B8 S-PDSO-G8 S-XDSO-N8 - -
JESD-609 code - e0 e0 e0 e0 - -
length - 2.9 mm 1.52 mm 3 mm 3 mm - -
Humidity sensitivity level - 1 1 1 1 - -
Number of channels - 1 1 1 1 - -
Number of functions - 1 1 1 1 - -
Number of terminals - 8 8 8 8 - -
Maximum operating temperature - 85 °C 85 °C 85 °C 85 °C - -
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C - -
Nominal output power - 0.33 W 0.33 W 0.33 W 0.33 W - -
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED - -
encapsulated code - LSSOP VFBGA TSSOP VSON - -
Encapsulate equivalent code - TSSOP8,.1 BGA9,3X3,20 TSSOP8,.19 SOLCC8,.12,25 - -
Package shape - RECTANGULAR SQUARE SQUARE SQUARE - -
Package form - SMALL OUTLINE, LOW PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE - -
Peak Reflow Temperature (Celsius) - 245 240 240 240 - -
power supply - 5 V 5 V 5 V 5 V - -
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified - -
Maximum seat height - 1.45 mm 0.67 mm 1.1 mm 0.8 mm - -
Maximum slew rate - 4.3 mA 4 mA 4 mA 4.3 mA - -
Maximum supply voltage (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V - -
Minimum supply voltage (Vsup) - 2.3 V 2.3 V 2.3 V 2.3 V - -
surface mount - YES YES YES YES - -
technology - BIPOLAR BIPOLAR BIPOLAR BIPOLAR - -
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL - -
Terminal surface - Tin/Lead (Sn85Pb15) Tin/Lead (Sn63Pb37) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) - -
Terminal form - GULL WING BALL GULL WING NO LEAD - -
Terminal pitch - 0.65 mm 0.5 mm 0.65 mm 0.65 mm - -
Terminal location - DUAL BOTTOM DUAL DUAL - -
Maximum time at peak reflow temperature - NOT SPECIFIED 20 20 20 - -
width - 1.625 mm 1.52 mm 3 mm 3 mm - -
Base Number Matches - 1 1 1 1 - -
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