Applied volt-time product (V-us) across the inductor. This value
represents the applied v-us at 300
kHz
necessary to generate a core
loss equal to 10% of the total losses for a 40 °C temperature rise.
Dimensions-mm
TOP VIEW
12.90
Max.
FRONT VIEW
5.2
PCB PAD LAYOUT
7.37
SCHEMATIC
1
SIDE VIEW
UP2C
xxx
wwllyy R
3.0ref
9.40
Max.
2
2.79
2.92
1
2.5max*
see note A
COMPONENT VIEW
2
Dimensions in Millimeters.
wwllyy = (date code) R = revision level
xxx = Inductance value per family chart
Do not route traces or vias underneath the inductor
(A) 2.5mm max is width of copper at seating plane. The width above the seating
plane may exceed 2.5mm.
Packaging information-mm
4.0
1.5 dia
+0.1/-0.0
2.0
1.5 dia
min
A
1.7
1
11.5
24.0
+/-0.3
B0
ACTUAL SIZE
UNIPAC 2C
2
Ao=9.50mm
Bo=13.0mm
Ko=5.7mm
K0
SECTION A-A
A0
12.0
User direction of feed
A
Supplied in tape and reel packaging, 900 parts per reel
2
www.eaton.com/electronics
UP2C
UNI-PAC™ drum core power inductors
Inductance characteristics
Effective
August
2017
Technical Data
4111
Core loss
I
RMS
DERATING WITH CORE LOSS
0
20
40
50
60
70
80
0K
Hz
0K
Hz
z
KH
1M
H
20
0
50
30
% of Losses from Irms (maximum)
90
92
94
95
96
97
98
99
10
20
30
40
50 60
80
100
200
300
400 500 600
800 1000
% of Applied Volt-µ-seconds
10
0K
Hz
z
www.eaton.com/electronics
3
Technical Data
4111
Effective
August
2017
UP2C
UNI-PAC™ drum core power inductors
Solder Reflow Profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
T
ab
l
e
1 -
S
t
a
n
da
r
d S
nP
b S
ol
de
r (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
Temperature
T
smax
T
ab
l
e
2 - L
ead
(P
b
) Fr
ee S
ol
de
r (T c)
T
smin
t
s
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
Time
Volume
mm
3
<350
260°C
260°C
250°C
Volume
mm
3
350 - 2000
260°C
250°C
245°C
Volume
mm
3
>2000
260°C
245°C
245°C
25°C
Time 25°C to Peak
Reference JDEC J-STD-020
Profile Feature
Preheat
and Soak
• T
e
mperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
L
)
Time
at
liquidous (tL)
Peak package
body
temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
150°C
60-120 Seconds
3°C/
Second
Max.
183°C
60-150 Seconds
Table 1
20
Seconds**
6°C/ Second
Max.
6
Minutes Max.
Lead (Pb) Free Solder
150°C
200°C
60-120 Seconds
3°C/
Second
Max.
217°C
60-150 Seconds
T
able
2
30
Seconds**
6°C/ Second
Max.
8 Minutes Max.
*
Tolerance for peak profile temperature (Tp) is
defined as a
supplier minimum
and a
user maximum.
**
Tolerance for time
at
peak profile temperature (tp) is
defined as a
supplier minimum
and a
user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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