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1N5336C-TR12

Description
Zener Diodes Zener Voltage Regulator Diode
Categorysemiconductor    Discrete semiconductor   
File Size384KB,6 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
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Zener Diodes Zener Voltage Regulator Diode

1N5336C-TR12 Parametric

Parameter NameAttribute value
Product CategoryZener Diodes
ManufacturerMicrosemi
RoHSNo
Mounting StyleThrough Hole
Package / CaseT-18-2
PackagingCut Tape
PackagingReel
Factory Pack Quantity3000
Unit Weight0.002469 oz
1N5333B thru 1N5388B
Available
Silicon 5 Watt Zener Diodes
DESCRIPTION
The 1N5333B through 1N5388B JEDEC registered series of axial-leaded 5.0 watt Zeners
provides a selection from 3.3 to 200 volts with different tolerances as identified by specific
suffix letter on the part number. These plastic encapsulated Zeners have a moisture
classification of “Level 1” with no dry pack required. They may be operated at high maximum
dc currents with adequate heat sinking due to their comparatively low thermal resistance
design. Microsemi also offers numerous other Zener products to meet higher and lower
power applications.
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
JEDEC registered 1N5333 thru 1N5388 series.
Zener voltage available 3.3 V to 200 V.
Plus/minus 10%, 5% and 2% voltage tolerances are available.
(See
part nomenclature
block.)
RoHS compliant versions available.
T-18 Package
Also available in:
G-bend Package
(surface mount)
SMBJ5333 – SMBJ5388
APPLICATIONS / BENEFITS
Regulates voltage over broad operating current and temperature ranges.
Wide selection from 3.3 to 200 V.
Flexible axial-lead mounting terminals.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Withstands high surge stresses.
Minimal changes of voltage versus current.
High specified maximum current (I
ZM
) with adequate heat sinking.
Moisture classification is “Level 1” per IPC/JEDEC J-STD-020B with no dry pack required.
Gull wing Package
(surface mount)
SMBG5333 – SMBG5388
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
(1)
Thermal Resistance Junction-to-Lead
(2)
Thermal Resistance Junction-to-Ambient
o (3)
Off-State Power Dissipation @ 25 C
Forward Voltage @ 1.0 A
Solder Temperature @ 10 s
Symbol
T
J
and T
STG
R
ӨJL
R
ӨJA
P
D
V
F
T
SP
Value
-65 to +150
25
85
5.0
1.2
260
Unit
C
C/W
o
C/W
W
V
o
C
o
o
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. At 3/8 (10 mm) lead length from body.
2. When mounted on FR4 PC board (1oz Cu) with 4 mm
2
copper pads and track width 1 mm, length 25
mm.
o
º
3. 5 watts at T
L
< 25 C 3/8 inch (10 mm) from body, or 1.47 watts at T
A
= 25 C when mounted on FR4 PC
described for thermal resistance (also see
Figure 1).
T4-LDS-0246, Rev. 1 (120180)
©2012 Microsemi Corporation
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