SO
T2
BSS138BK
60 V, 360 mA N-channel Trench MOSFET
Rev. 1 — 4 August 2011
Product data sheet
1. Product profile
1.1 General description
N-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23
(TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET
technology.
3
1.2 Features and benefits
Logic-level compatible
Very fast switching
Trench MOSFET technology
ESD protection up to 1.5 kV
AEC-Q101 qualified
1.3 Applications
Relay driver
High-speed line driver
Low-side loadswitch
Switching circuits
1.4 Quick reference data
Table 1.
Symbol
V
DS
V
GS
I
D
R
DSon
Quick reference data
Parameter
drain-source voltage
gate-source voltage
drain current
drain-source on-state
resistance
V
GS
= 10 V; T
amb
= 25 °C
V
GS
= 10 V; I
D
= 350 mA;
T
j
= 25 °C
[1]
Conditions
T
j
= 25 °C
Min
-
-20
-
-
Typ
-
-
-
1
Max
60
20
360
1.6
Unit
V
V
mA
Ω
Static characteristics
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm
2
.
NXP Semiconductors
BSS138BK
60 V, 360 mA N-channel Trench MOSFET
2. Pinning information
Table 2.
Pin
1
2
3
Pinning information
Symbol Description
G
S
D
gate
source
drain
1
2
G
Simplified outline
3
Graphic symbol
D
SOT23 (TO-236AB)
S
017aaa255
3. Ordering information
Table 3.
Ordering information
Package
Name
BSS138BK
TO-236AB
Description
plastic surface-mounted package; 3 leads
Version
SOT23
Type number
4. Marking
Table 4.
BSS138BK
[1]
% = placeholder for manufacturing site code.
Marking codes
Marking code
[1]
%SB
Type number
BSS138BK
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 4 August 2011
2 of 16
NXP Semiconductors
BSS138BK
60 V, 360 mA N-channel Trench MOSFET
5. Limiting values
Table 5.
Symbol
V
DS
V
GS
I
D
I
DM
P
tot
Limiting values
Parameter
drain-source voltage
gate-source voltage
drain current
peak drain current
total power dissipation
V
GS
= 10 V; T
amb
= 25 °C
V
GS
= 10 V; T
amb
= 100 °C
T
amb
= 25 °C; single pulse; t
p
≤
10 µs
T
amb
= 25 °C
T
sp
= 25 °C
T
j
T
amb
T
stg
I
S
V
ESD
[1]
[2]
[3]
[2]
[1]
[1]
[1]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Conditions
T
j
= 25 °C
Min
-
-20
-
-
-
-
-
-
-55
-55
-65
T
amb
= 25 °C
HBM
[1]
Max
60
20
360
230
1.2
350
420
1140
150
150
150
360
1500
Unit
V
V
mA
mA
A
mW
mW
mW
°C
°C
°C
mA
V
junction temperature
ambient temperature
storage temperature
source current
electrostatic discharge voltage
Source-drain diode
-
-
ESD maximum rating
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm
2
.
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
Measured between all pins.
120
P
der
(%)
80
001aao121
120
I
der
(%)
80
001aao122
40
40
0
-75
-25
25
75
125
T
j
(°C)
175
0
-75
-25
25
75
125
T
j
(°C)
175
Fig 1.
Normalized total power dissipation as a
function of junction temperature
Fig 2.
Normalized continuous drain current as a
function of junction temperature
BSS138BK
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 4 August 2011
3 of 16
NXP Semiconductors
BSS138BK
60 V, 360 mA N-channel Trench MOSFET
10
I
D
(A)
1
aaa-000157
(1)
10
-1
(2)
(3)
(4)
(5)
10
-2
10
-3
10
-1
1
10
V
DS
(V)
10
2
I
DM
is a single pulse
(1) t
p
= 1 ms
(2) t
p
= 10 ms
(3) t
p
= 100 ms
(4) DC; T
sp
= 25 °C
(5) DC; T
amb
= 25 °C; 1 cm
2
drain mounting pad
Fig 3.
Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain-source
voltage
6. Thermal characteristics
Table 6.
Symbol
R
th(j-a)
R
th(j-sp)
Thermal characteristics
Parameter
thermal resistance from junction to ambient
thermal resistance from junction to solder
point
Conditions
in free air
[1]
[2]
Min
-
-
-
Typ
310
260
-
Max
370
300
115
Unit
K/W
K/W
K/W
[1]
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm
2
.
BSS138BK
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 4 August 2011
4 of 16
NXP Semiconductors
BSS138BK
60 V, 360 mA N-channel Trench MOSFET
10
3
Z
th(j-a)
(K/W)
10
2
duty cycle = 1
0.75
0.5
0.33
0.25
0.1
0.2
0.05
0.02
0.01
0
017aaa015
10
1
10
−3
10
−2
10
−1
1
10
10
2
t
p
(s)
10
3
FR4 PCB, standard footprint
Fig 4.
10
3
Z
th(j-a)
(K/W)
10
2
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
017aaa016
duty cycle = 1
0.75
0.5
0.33
0.25
0.1
0.2
0.05
0.02
0.01
10
0
1
10
−3
10
−2
10
−1
1
10
10
2
t
p
(s)
10
3
FR4 PCB, mounting pad for drain 1 cm
2
Fig 5.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BSS138BK
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 4 August 2011
5 of 16
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