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SPC5675KF0MMS2

Description
32-bit Microcontrollers - MCU NXP 32-bit MCU, Dual Power Arch, 2MB Flash, 180MHz, -40/+125degC, Automotive Qual, MAPBGA 473
Categorysemiconductor    The embedded processor and controller   
File Size1MB,147 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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SPC5675KF0MMS2 Overview

32-bit Microcontrollers - MCU NXP 32-bit MCU, Dual Power Arch, 2MB Flash, 180MHz, -40/+125degC, Automotive Qual, MAPBGA 473

SPC5675KF0MMS2 Parametric

Parameter NameAttribute value
Product Category32-bit Microcontrollers - MCU
ManufacturerNXP
RoHSDetails
Package / CaseMAPBGA-257
Data Bus Width32 bit
PackagingBulk
Moisture SensitiveYes
Factory Pack Quantity420
Unit Weight0.057260 oz
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPC5675K
Rev. 8, 10/2013
MPC5675K
Qorivva MPC5675K
Microcontroller Data Sheet
1
1.1
MAPBGA–225
15 mm x 15 mm
QFN12
##_mm_x_##mm
Introduction
Document overview
1
SOT-343R
##_mm_x_##mm
473 MAPBGA
(19 x 19 mm)
TBD
PKG-TBD
## mm x ## mm
257 MAPBGA
(14 x 14 mm)
This document provides electrical specifications, pin
assignments, and package diagrams for the Qorivva
MPC5675K series of microcontroller units (MCUs).
1.2
Description
2
The Qorivva MPC5675K microcontroller, a SafeAssure
solution, is a 32-bit embedded controller designed for
advanced driver assistance systems with RADAR, CMOS
imaging, LIDAR and ultrasonic sensors, and multiple 3-phase
motor control applications as in hybrid electric vehicles
(HEV) in automotive and high temperature industrial
applications.
A member of Freescale Semiconductor’s Qorivva
MPC5500/5600 family, it contains the Book E compliant
Power Architecture technology core with Variable Length
Encoding (VLE). This core complies with the Power
Architecture embedded category, and is 100 percent user
mode compatible with the original Power PC user
instruction set architecture (UISA). It offers system
performance up to four times that of its MPC5561
predecessor, while bringing you the reliability and familiarity
of the proven Power Architecture technology.
A comprehensive suite of hardware and software
development tools is available to help simplify and speed
system design. Development support is available from
leading tools vendors providing compilers, debuggers and
simulation development environments.
3
4
5
6
7
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Device comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.5 Feature list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.6 Feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Package pinouts and signal descriptions . . . . . . . . . . . . . . . . 18
2.1 Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.2 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
3.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
3.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . 70
3.3 Recommended operating conditions . . . . . . . . . . . . . . 71
3.4 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 73
3.5 Electromagnetic interference (EMI) characteristics . . . 74
3.6 Electrostatic discharge (ESD) characteristics. . . . . . . . 75
3.7 Static latch-up (LU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
3.8 Power Management Controller (PMC)
electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
3.9 Supply current characteristics . . . . . . . . . . . . . . . . . . . 77
3.10 Temperature sensor electrical characteristics . . . . . . . 78
3.11 Main oscillator electrical characteristics . . . . . . . . . . . . 78
3.12 FMPLL electrical characteristics. . . . . . . . . . . . . . . . . . 79
3.13 16 MHz RC oscillator electrical characteristics. . . . . . . 80
3.14 ADC electrical characteristics. . . . . . . . . . . . . . . . . . . . 81
3.15 Flash memory electrical characteristics . . . . . . . . . . . . 86
3.16 SRAM memory electrical characteristics . . . . . . . . . . . 88
3.17 GP pads specifications . . . . . . . . . . . . . . . . . . . . . . . . . 88
3.18 PDI pads specifications . . . . . . . . . . . . . . . . . . . . . . . . 91
3.19 DRAM pad specifications . . . . . . . . . . . . . . . . . . . . . . . 94
3.20 RESET characteristics . . . . . . . . . . . . . . . . . . . . . . . . 101
3.21 Reset sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
3.22 Peripheral timing characteristics. . . . . . . . . . . . . . . . . 108
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
4.1 Package mechanical data . . . . . . . . . . . . . . . . . . . . . 132
Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Reference documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . 138
© Freescale Semiconductor, Inc., 2009–2013. All rights reserved.

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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