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BZM55C22-TR

Description
32-bit Microcontrollers - MCU 512KB Flash 128KB USB ENET
CategoryDiscrete semiconductor    diode   
File Size109KB,7 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
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BZM55C22-TR Overview

32-bit Microcontrollers - MCU 512KB Flash 128KB USB ENET

BZM55C22-TR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerVishay
Parts packaging codeMELF
package instructionO-LELF-R2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresLOW NOISE
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeO-LELF-R2
JESD-609 codee2
Humidity sensitivity level1
Number of components1
Number of terminals2
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Certification statusNot Qualified
Nominal reference voltage22 V
surface mountYES
technologyZENER
Terminal surfaceTIN SILVER
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance5.67%
Working test current5 mA
BZM55-Series
www.vishay.com
Vishay Semiconductors
Small Signal Zener Diodes
FEATURES
• Saving space
• Hermetic sealed parts
• Electrical data identical with the devices
BZT55..series, TZM..series
• Fits onto SOD-323
• Very sharp reverse characteristic
• Low reverse current level
• Very high stability
UNIT
V
mA
PRIMARY CHARACTERISTICS
PARAMETER
V
Z
range nom.
Test current I
ZT
V
Z
specification
Int. construction
VALUE
2.4 to 75
2.5; 5
Pulse current
Single
• Low noise
• AEC-Q101 qualified
• Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
• Halogen-free according to IEC 61249-2-21 definition
APPLICATIONS
• Voltage stabilization
ORDERING INFORMATION
DEVICE NAME
BZM55-series
BZM55-series
ORDERING CODE
BZM55-series-TR3
BZM55-series-TR
TAPED UNITS PER REEL
10 000 (8 mm tape on 13" reel)
2500 (8 mm tape on 7" reel)
MINIMUM ORDER QUANTITY
10 000
12 500
PACKAGE
PACKAGE NAME
MicroMELF
WEIGHT
12 mg
MOLDING COMPOUND MOISTURE SENSITIVITY
FLAMMABILITY RATING
LEVEL
UL 94 V-0
MSL level 1
(according J-STD-020)
SOLDERING
CONDITIONS
260 °C/10 s at terminals
ABSOLUTE MAXIMUM RATINGS
(T
amb
= 25 °C, unless otherwise specified)
PARAMETER
Power dissipation
Junction to ambient air
Junction tie point
Junction temperature
Storage temperature range
Zener current
Forward voltage
I
F
= 200 mA
TEST CONDITION
R
thJA
300 K/W
Mounted on epoxy-glass hard tissue, fig. 1
35 μm copper clad, 0.9 mm
2
copper area per
electrode
SYMBOL
P
tot
R
thJA
R
thJL
T
j
T
stg
I
Z
V
F
VALUE
500
500
300
175
- 65 to + 175
P
tot
/V
Z
1.5
UNIT
mW
K/W
K/W
°C
°C
mA
V
Rev. 2.1, 25-Nov-11
Document Number: 85597
1
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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