Low-Power, High-Resolution 16-Bit
Sensor Signal Conditioner
ZSSC3036
Datasheet
Brief Description
The ZSSC3036 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Designed for high-resolution altimeter module
applications, the ZSSC3036 can perform offset,
st
nd
span, and 1 and 2 order temperature compen-
sation of the measured signal. Developed for correc-
tion of resistive bridge sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
The measured and corrected bridge values are
provided at the digital output pins, which can be
2
configured as I C™* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP) run-
ning a correction algorithm. Calibration coefficients
are stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Pro-
gramming the ZSSC3036 is simple via the serial
interface. The IC-internal charge pump provides the
MTP programming voltage. The interface is used for
the PC-controlled calibration procedure, which pro-
grams the set of calibration coefficients in memory.
The ZSSC3036 provides accelerated signal process-
ing in order to support high-speed control, safety,
and real-time sensing applications. It complements
IDT’s additional ZSSC30x6 products.
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Benefits
Integrated 18-bit calibration math DSP
Fully corrected signal at digital output
Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
Single-pass calibration minimizes calibration
costs
No external trimming, filter, or buffering com-
ponents required
Highly integrated CMOS design
Excellent for low-voltage and low-power battery
applications
Optimized for operation in calibrated resistive
sensor modules
Physical Characteristics
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Supply voltage range: 1.8 to 3.6V
Current consumption: 1mA (operating mode)
Sleep State current: 50nA (typical)
Temperature resolution: <0.003K/LSB
Operation temperatures: –40°C to +85°C
–40°C to +110°C
Small die size
Delivery options: die for wafer bonding
*
I
2
C™ is a trademark of NXP.
**
FSO = Full Scale Output.
Features
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Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing two-
segment analog-to-digital converter (ADC)
Fully programmable gain amplifier accepting
sensors from 14 to 72 (linear factor)
Internal auto-compensated temperature sensor
Digital compensation of individual sensor offset;
st
nd
1 and 2 order digital compensation of sensor
st
nd
gain as well as of 1 and 2 order temperature
gain and offset drift
Fast sensing: 16-bit conditioned sensor signal
-1
measurement rate at more than 200s
Typical sensor elements can achieve accuracy of
less than ±0.10% FSO** @ -40 to 110°C
ZSSC3036 Application Example
© 2016 Integrated Device Technology, Inc.
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April 20, 2016
Low-Power, High-Resolution 16-Bit
Sensor Signal Conditioner
ZSSC3036
Datasheet
ZSSC3036
Block Diagram
VDDB
V
TP
V
TN
Vreg int
Temperature
Reference
Sensor
VDD
AGND / CM
Generator
Bias Current
Generator
Power Ctr.
Voltage
Regulator
VSS
ZSSC3036
Multiplexer
A
Pre-
Amplifier
Sensor
Bridge
INP
INN
VSSB
D
16 Bit
18-bit DSP Core
(Calculations,
Communication)
EOC
SPI
Power-ON
Reset
Clock
Generator
Ring
Oscillator
System
Control
Unit
MTP
ROM
I²C
TM
SCLK/SCL
SS
MOSI/SDA
MISO
SEL
Applications
Barometric altitude measurement for
portable navigation or emergency call
systems
Altitude measurement for car navigation
Inside hard disk pressure measurement
Weather forecast
Fan control
Industrial, pneumatic, and liquid pressure
Ordering Information
(See section 6 in the data sheet for additional options for delivery package and wafer thickness of 725µm.)
Sales Code
ZSSC3036CC1B
ZSSC3036CI1B
ZSSC3036CC1C
ZSSC3036CI1BH
ZSSC3036CI1CH
ZSSC30x6-KIT
Description
Die—temperature range: –40°C to +85 °C
Die—temperature range: –40°C to +85 °C, extended qualification
Die—temperature range: –40°C to +85°C
Die—temperature range: –40°C to +110 °C, extended qualification
Die—temperature range: –40°C to +110 °C, extended qualification
Delivery Package
Wafer (304µm) unsawn, tested
Wafer (304µm) unsawn, tested
Dice on frame (304µm), tested
Wafer (304µm) unsawn, tested
Dice on frame (304µm), tested
Evaluation Kit for ZSSC30x6 Product Family, including boards, cable, software, and 1 sample
Corporate Headquarters
Sales
Tech Support
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance
specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an
implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property
rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit
www.idt.com/go/glossary.
All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2016 Integrated Device Technology, Inc.
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ZSSC3036 Datasheet
Table of Contents
IC Characteristics .......................................................................................................................................... 6
1.1. Absolute Maximum Ratings .................................................................................................................... 6
1.2. Operating Conditions .............................................................................................................................. 6
1.3. Electrical Parameters ............................................................................................................................. 7
1.4. Power Supply Rejection Ratio (RSRR) vs. Frequency........................................................................... 9
2 Circuit Description ....................................................................................................................................... 10
2.1. Brief Description ................................................................................................................................... 10
2.2. Signal Flow and Block Diagram............................................................................................................ 10
2.3. Analog Front End .................................................................................................................................. 11
2.3.1. Amplifier ......................................................................................................................................... 11
2.3.2. Analog-to-Digital Converter ............................................................................................................ 13
2.3.3. Temperature Measurement ........................................................................................................... 17
2.3.4. Bridge Supply ................................................................................................................................. 17
2.4. Digital Section ....................................................................................................................................... 17
2.4.1. Digital Signal Processor (DSP) Core ............................................................................................. 17
2.4.2. MTP Memory.................................................................................................................................. 17
2.4.3. Clock Generator ............................................................................................................................. 18
2.4.4. Power Supervision ......................................................................................................................... 18
2.4.5. Interface ......................................................................................................................................... 18
3 Functional Description ................................................................................................................................. 19
3.1. Power Up .............................................................................................................................................. 19
3.2. Measurements ...................................................................................................................................... 19
3.3. Operational Modes ............................................................................................................................... 19
3.4. Command Interpretation ....................................................................................................................... 22
2
3.4.1. SPI/I C™ Commands .................................................................................................................... 22
3.5. Communication Interface...................................................................................................................... 25
3.5.1. Common Functionality ................................................................................................................... 25
3.5.2. SPI ................................................................................................................................................. 26
2
3.5.3. I C™ ............................................................................................................................................... 29
3.6. Memory ................................................................................................................................................. 30
3.6.1. Programming Memory ................................................................................................................... 30
3.6.2. Memory Status Commands ........................................................................................................... 31
3.6.3. Memory Contents ........................................................................................................................... 32
3.7. Calibration Sequence ........................................................................................................................... 38
3.7.1. Calibration Step 1 – Assigning Unique Identification ..................................................................... 39
3.7.2. Calibration Step 2 – Data Collection .............................................................................................. 39
3.7.3. Calibration Step 3 – Coefficient Calculations ................................................................................. 40
3.8. The Calibration Math ............................................................................................................................ 40
3.8.1. Bridge Signal Compensation ......................................................................................................... 40
3.8.2. Temperature Signal Compensation ............................................................................................... 43
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© 2016 Integrated Device Technology, Inc.
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ZSSC3036 Datasheet
4
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6
7
8
9
Die Pad Assignments .................................................................................................................................. 44
Quality and Reliability .................................................................................................................................. 45
Ordering Sales Codes ................................................................................................................................. 45
Related Documents ..................................................................................................................................... 45
Glossary ...................................................................................................................................................... 46
Document Revision History ......................................................................................................................... 48
Table of Figures
Figure 2.1
Figure 2.2
Figure 3.1
Figure 3.2
Figure 3.3
Figure 3.4
Figure 3.5
Figure 3.6
Figure 3.7
Figure 3.8
Figure 3.9
Figure 3.10
Figure 3.11
Figure 4.1
ZSSC3036 Functional Block Diagram ........................................................................................... 10
ADC Offset ..................................................................................................................................... 16
Operational Flow Chart: Power Up ................................................................................................ 21
Operational Flow Chart: Command Mode and Normal Mode ....................................................... 22
SPI Configuration CPHA=0 ........................................................................................................... 26
SPI Configuration CPHA=1 ........................................................................................................... 27
SPI Command Request ................................................................................................................. 27
SPI Read Status ............................................................................................................................ 28
SPI Read Data ............................................................................................................................... 28
I
2
C™ Command Request .............................................................................................................. 29
I C™ Read Status .......................................................................................................................... 29
2
I C™ Read Data ............................................................................................................................ 30
Memory Program Operation .......................................................................................................... 31
ZSSC3036 Pad Assignments ........................................................................................................ 44
2
List of Tables
Table 1.1
Table 1.2
Table 1.3
Table 1.4
Table 2.1
Table 2.2
Table 2.3
Table 2.4
Table 2.5
Table 2.6
Table 2.7
Table 2.8
Table 3.1
Table 3.2
Table 3.3
Maximum Ratings ............................................................................................................................ 6
Operating Conditions ....................................................................................................................... 6
Requirements for VDD Power-on Reset .......................................................................................... 7
Electrical Parameters ....................................................................................................................... 7
Amplifier Gain: Stage 1 .................................................................................................................. 11
Amplifier Gain: Stage 2 .................................................................................................................. 12
Gain Polarity .................................................................................................................................. 12
MSB/LSB Segmentation Settings for Bridge Measurement .......................................................... 13
MSB/LSB Segmentation Settings for Temperature Measurement ................................................ 13
ADC Conversion Times for a Single A2D Conversion................................................................... 14
Typical Conversion Times vs. Noise Performance for 16-Bit Results with Full Sensor Signal
Conditioning for AZBM, BM, AZTM, and TM ................................................................................. 15
ADC Offset Settings ....................................................................................................................... 16
2
SPI/I C™ Commands .................................................................................................................... 23
Get_Raw Commands .................................................................................................................... 24
General Status Byte ....................................................................................................................... 25
© 2016 Integrated Device Technology, Inc.
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ZSSC3036 Datasheet
Table 3.4
Table 3.5
Table 3.6
Table 3.7
Table 3.8
Table 4.2
Status Byte for Read Operations ................................................................................................... 25
Status Byte for Write Operations ................................................................................................... 25
Mode Status ................................................................................................................................... 26
Memory Status Word ..................................................................................................................... 31
MTP Memory Content Assignments .............................................................................................. 32
Pad Assignments ........................................................................................................................... 44
© 2016 Integrated Device Technology, Inc.
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April 20, 2016
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