5% Anti-Surge Thick Film Chip Resistors
(RoHS Compliant)
FEATURES
•
•
•
•
Temperature Range:-55ºC ~ +155ºC (derated over 70ºC)
±5% tolerance
Wave or Flow solderable
Other values may be available on request
AS-RC SERIES
DERATING CURVE
-55ºC
100
80
60
40
20
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
Ambient temperature (ºC)
+70ºC
+155ºC
Percent rated load %
PART NUMBERING SYSTEM
3
0
Series
3
-
1
0
Value
L
K
/
R
E
E
L
-
R
C
Package
Suffix (RoHS Compliant)
SERIES, SIZE, WATTAGE, VOLTAGE, AND DIMENSIONS
C
W
H
D
Series
303
305
306
307
310
312
Case Size
0603
0805
1206
1206
2010
2512
C
L
W
H
D
Watts
(W)
1/4
1/2
3/5
3/4
3/4
1.5
Voltage (Max.) @ 70ºC
W.V.
50
150
200
200
200
250
O.V.
100
300
400
500
500
500
L
1.60 ± .10
2.00 ± .15
3.10 ± .15
3.10 ± .10
5.00 ± .10
6.35 ± .10
W
.80 ± .10
1.25 + .15
1.25 + .15
2.60 ± .20
2.50 ± .15
3.20 ± .15
Dimension (mm)
H
.45 ± .10
.55 ± .10
.55 ± .10
.55 ± .10
.55 ± .10
.55 ± .10
C
.30 ± .20
.40 ± .20
.40 ± .20
.50 ± .25
.60 ± .25
.60 ± .25
D
.30 ± .20
.40 ± .20
.40 ± .20
.50 ± .20
.50 ± .20
.50 ± .20
STANDARD VALUES (Ω)
1.0
2.0
2.2
2.4
3.0
4.7
5.6
10
15
22
30
47
56
100
220
270
390
430
470
560
1K
2K
2.0K
3.0K
4.7K
5.6K
6.8K
10K
22K
27K
30K
33K
100K
220K
330K
470K
20M
47M
50M
100M
200M
470M
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600245
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 7/18/17
5% Anti-Surge Thick Film Chip Resistors
(RoHS Compliant)
Characteristics
Dielectric
withstanding
voltage
Temperature
Coefficient
Limits
No evidence of flashover
mechanical damage, arcing or
insulation break down
1Ω-10Ω : ≤±400PPM/ºC
11Ω-10MΩ : ≤±100PPM/ºC
(2010, 2512) 1Ω-10Ω : ≤±200PPM/ºC
AS-RC SERIES
Test Methods
(JIS C 5201-1)
Clamped in the trough of a 90ºC metallic v-block
and shall be tested at ac potential respectively specified
in the type for 60-70 seconds
Natural resistance change per temp.
degree centigrade.
R2-R1
x 10 (PPM/ºC)
R1(t2-t1)
R1: Resistance value at room temperature (T1)
R2: Resistance value at room temp. plus 100 ºC(T2)
Test Pattern: room temp. (T1), room temp. +100ºC(T2)
Short Time
Overload
Solderability
Resistance change rate is
± (1.0% + 0.1Ω) Max.
95% coverage Min.
Permanent resistance change after the
application of a potential of 2.5 times RCWV
for 5 seconds
Wave Solder:
Test temperature of solder:
245ºC ± 3ºC dipping time in solder: 2-3 seconds
Reflow:
250
200
150
100
50
VALUE TEMPERATURE:
245ºC -250ºC
230ºC
WARM-UP TIME
180ºC
150ºC
90±30s
20±10s
HOT UP TIME
SOLDER TIME
Soldering Heat
Temperature cycling
Resistance change rate is:
+(1%+0.05Ω) Max.
Resistance change rate is
± (0.5% + 0.05Ω) Max.
Dip the resistor into a solder bath having a temperature of
260ºC±3ºC and hold it for 10±1 seconds.
Resistance change after continuous
5 cycles for duty cycle specified below:
Step
1
2
3
4
Temperature
-55ºC ± 3ºC
Room temp.
+155ºC ± 2ºC
Room temp.
Time
30 mins
10~15 mins
30 mins
10~15 mins
Humidity
Resistance change rate is
± (3.0% + 0.1Ω) Max.
Resistance change rate is
± (3.0% + 0.1Ω) Max.
Temporary resistance change after 240 hours
exposure in a humidity test chamber controlled at
40±2ºC and 90-95% relative humidity
Resistance change after 1000 hours
(1.5 hours "on", 0.5 hour "off") at RCWV
in a humidity controlled at 40ºC ± 2ºC
and 90 to 95% relative humidity
Permanent resistance change after 1,000 hours
operating at RCWV, with duty cycle of
(1.5 hours"on", 0.5 hour"off") at 70ºC + 2ºC ambient
Twist of Test Board:
Y/X = 3/90 mm for 60 seconds
Load life in
humidity
Load Life
Resistance change rate is
± (3.0% + 0.1Ω) Max.
Resistance change rate is
± (1.0% + 0.05Ω) Max.
Terminal bending
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600245
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
Date Revised: 7/18/17
Embedded System
京公网安备 11010802033920号
EEWORLD
