General Description ............................................................................................................................................... 10
Pin and Marking Diagram ..............................................................................................................................11
Absolute Maximum Ratings ........................................................................................................................... 13
2.4.1. Power Consumption .................................................................................................................................. 14
2.4.2. Frequency Synthesis................................................................................................................................. 14
2.4.5. Digital Specification ...................................................................................................................................17
Power Supply Strategy .................................................................................................................................. 18
Frequency Synthesis ..................................................................................................................................... 18
3.3.4. Lock Time ..................................................................................................................................................20
3.4.4. OOK Modulation........................................................................................................................................ 23
3.4.6. Power Amplifiers ....................................................................................................................................... 23
3.4.7. Over Current Protection ............................................................................................................................ 24
3.5.2. LNA - Single to Differential Buffer ............................................................................................................. 25
3.5.3. Automatic Gain Control ............................................................................................................................. 26
3.5.7. DC Cancellation ........................................................................................................................................ 29
Rev. 7 - June 2013
Page 2
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SX1231
WIRELESS & SENSING PRODUCTS
Table of contents
DATASHEET
Section
Page
3.5.8. Complex Filter - OOK ................................................................................................................................ 29
3.5.12. OOK Demodulator................................................................................................................................... 31
3.5.13. Bit Synchronizer ...................................................................................................................................... 33
3.5.14. Frequency Error Indicator........................................................................................................................ 33
3.5.15. Automatic Frequency Correction............................................................................................................. 34
3.5.16. Optimized Setup for Low Modulation Index Systems.............................................................................. 35
3.5.17. Temperature Sensor ...............................................................................................................................36
Automatic Sequencer and Wake-Up Times................................................................................................... 37
4.2.1. Transmitter Startup Time ...........................................................................................................................38
4.3.3. End of Cycle Actions ................................................................................................................................. 42
Data Processing .................................................................................................................................................... 45
5.1.2. Data Operation Modes .............................................................................................................................. 45
5.2.
Control Block Description............................................................................................................................... 46
5.2.3. Sync Word Recognition............................................................................................................................. 48
5.4.1. General Description................................................................................................................................... 51
5.5.1. General Description................................................................................................................................... 52
5.5.2. Packet Format ........................................................................................................................................... 53
5.5.8. DC-Free Data Mechanisms....................................................................................................................... 60
6.
Configuration and Status Registers ....................................................................................................................... 62
6.1.
6.2.
6.3.
6.4.
6.5.
6.6.
6.7.
6.8.
7.
7.1.
7.2.
General Description ....................................................................................................................................... 62
Common Configuration Registers ..................................................................................................................65
Temperature Sensor Registers...................................................................................................................... 76
Test Registers................................................................................................................................................ 76
Reset of the Chip ........................................................................................................................................... 77
Application Information .......................................................................................................................................... 77
Packaging Information ........................................................................................................................................... 81
AFC Control ................................................................................................................................................... 86
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