4306R-101-201LF datasheet, PDF

4306R-101-201LF: DescriptionResistor Networks u0026 Arrays THK FILM MOLD SIP 200uH 2%; CategoryPassive components The resistor; ManufacturerBourns; Websitehttp://www.bourns.com; Environmental Compliance

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Resistor Networks u0026 Arrays THK FILM MOLD SIP 200uH 2%

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
package instruction	SIP, 5808
Reach Compliance Code	not_compliant
Factory Lead Time	5 weeks
structure	Molded
Component power consumption	0.2 W
The first element resistor	200 Ω
JESD-609 code	e3
Lead length	3.43 mm
lead spacing	2.54 mm
Installation features	THROUGH HOLE MOUNT
Network Type	BUSSED
Number of components	5
Number of functions	1
Number of terminals	6
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package height	4.95 mm
Package length	14.83 mm
Package shape	RECTANGULAR PACKAGE
Package form	SIP
Package width	2.16 mm
Rated power dissipation(P)	0.75 W
Rated temperature	70 °C
resistance	200 Ω
Resistor type	ARRAY/NETWORK RESISTOR
size code	5808
surface mount	NO
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	100 ppm/°C
Temperature coefficient tracking	50 ppm/°C
Terminal surface	Matte Tin (Sn)
Terminal shape	FLAT
Tolerance	2%
Operating Voltage	100 V
Base Number Matches	1

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