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HCC4012BM1

Description
4000/14000/40000 SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14
Categorysemiconductor    logic   
File Size273KB,12 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric View All

HCC4012BM1 Overview

4000/14000/40000 SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PDIP14

HCC4012BM1 Parametric

Parameter NameAttribute value
Number of functions2
Number of terminals14
Maximum operating temperature125 Cel
Minimum operating temperature-55 Cel
Maximum supply/operating voltage20 V
Minimum supply/operating voltage3 V
Rated supply voltage5 V
Processing package descriptionROHS COMPLIANT, Plastic, DIP-14
Lead-freeYes
EU RoHS regulationsYes
stateDISCONTINUED
CraftsmanshipCMOS
packaging shapeRectangle
Package SizeIN-line
Terminal formTHROUGH-hole
Terminal spacing2.54 mm
terminal coatingNickel Palladium
Terminal locationpair
Packaging MaterialsPlastic/Epoxy
Temperature levelMILITARY
series4000/14000/40000
Logic IC typeD flip-flop
Number of digits1
Output polarityCOMPLEMENTARY
propagation delay TPD300 ns
Trigger typePOSITIVE edge
Max-Min frequency12 MHz
HCC4011B/12B/23B
HCF4011B/12B/23B
NAND GATES
QUAD 2 INPUT HCC/HCF 4011B
DUAL 4 INPUT HCC/HCF 4012B
TRIPLE 3 INPUT HCC/HCF 4023B
.
.
.
.
.
.
.
PROPAGATION DELAY TIME = 60ns (typ.) AT
C
L
= 50pF, V
DD
= 10V
BUFFERED INPUTS AND OUTPUTS
QUIESCENT CURRENT SPECIFIED TO 20V
FOR HCC DEVICE
INPUT CURRENT OF 100nA AT 18V AND 25°C
FOR HCC DEVICE
100% TESTED FOR QUIESCENT CURRENT
5V, 10V AND 15V PARAMETRIC RATINGS
MEETS ALL REQUIREMENTS OF JEDEC TEN-
TATIVE STANDARD N
o
. 13A, ”STANDARD
SPECIFICATIONS FOR DESCRIPTION OF ”B”
SERIES CMOS DEVICES”
EY
(Plastic Package)
F
(Ceramic Frit Seal Package)
M1
(Micro Package)
C1
(Plastic Chip Carrier)
ORDER CODES :
HCC40XXBF
HCF40XXBM1
HCF40XXBEY
HCF40XXBC1
DESCRIPTION
The
HCC4011B, HCC4012B
and
HCC4023B
(ex-
tended temperature range) and
HCF4011B,
HCF4012B
and
HCF4023B
(intermediate tempera-
ture range) are monolithic, integrated circuit, avail-
able in 14-lead dual in-line plastic or ceramic
package and plastic micropackage.
PIN CONNECTIONS
4011B
The
HCC/HCF4011B, HCC/HCF4012B
and
HCC/HCF4023B
NAND gates provide the system
designer with direct implementation of the NAND
function and supplement the existing family of
COS/MOS gates. All inputs and outputs are buf-
fered.
4012B
4023B
June 1989
1/12

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