30BQ200
Technical Data
Data Sheet N0026, Rev. A
30BQ200 SCHOTTKY RECTIFIER
Features
Small foot print, surface moutable
Low forward voltage drop
High frequency operation
Guard ring for enhanced ruggedness and long term
reliability
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request
SMC
Circuit Diagram
Applications
Disk Drives
Switching power supply
Redundant power subsystems
Converters
Free-Wheeling diodes
Reverse battery protection
Battery Charging
Maximum Ratings:
Characteristics
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
Peak One Cycle Non-Repetitive Surge
Current
Symbol
V
RRM
V
RWM
V
R
I
F (AV)
I
FSM
Condition
-
50% duty cycle @T
L
=148°C,
rectangular wave form
50% duty cycle @T
L
=138°C,
rectangular wave form
8.3 ms, half Sine pulse, T
C
=25°C
Max.
200
3.0
4.0
55
Units
V
A
A
Electrical Characteristics:
Characteristics
Forward Voltage Drop*
Reverse Current*
Junction Capacitance
Series Inductance
* Pulse width < 300 µs, duty cycle < 2%
Symbol
V
F1
V
F2
I
R1
I
R2
C
T
L
S
dv/dt
Voltage Rate of Change
Condition
@ 3 A, Pulse, T
J
= 25 °C
@ 3 A, Pulse, T
J
= 75 °C
@V
R
= Rated V
R
, Pulse, T
J
= 25 °C
@V
R
= Rated V
R
, Pulse, T
J
= 100 °C
@V
R
= 5V, T
C
= 25 °C
f
SIG
= 1MHz
Measured lead to lead 5 mm from
package body
-
Typ.
0.83
-
0.00003
0.006
50
3.0
-
Max.
0.92
0.76
1
3
60
-
10,000
Units
V
V
mA
mA
pF
nH
V/s
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30BQ200
Technical Data
Data Sheet N0026, Rev. A
Thermal-Mechanical Specifications:
Characteristics
Junction Temperature
Storage Temperature
Typical Thermal Resistance Junction to
Lead
Typical Thermal Resistance Junction to
Case
Approximate Weight
Case Style
Symbol
T
J
T
stg
R
JL
R
JA
wt
Condition
-
-
-
DC operation
-
SMC
Specification
-55 to +175
-55 to +175
12
46
0.21
Units
C
C
C/W
°C/W
g
Ratings and Characteristics Curves
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30BQ200
Technical Data
Data Sheet N0026, Rev. A
Mechanical Dimensions SMC
Millimeters
Min.
5.59
6.60
2.75
0.152
7.75
2.00
0.051
0.76
Max.
6.22
7.11
3.25
0.305
8.25
2.95
0.203
1.60
Min.
0.220
0.260
0.108
0.006
0.305
0.079
0.002
0.030
Inches
Max.
0.245
0.280
0.128
0.012
0.325
0.116
0.008
0.063
SYMBOL
A
B
C
D
E
F
G
H
Ordering Information
Device
30BQ200
SMC (Pb-Free)
Marking Diagram
3000pcs / reel
Package
Shipping
Where XXXXX is YYWWL
For information on tape and reel specifications, including part
orientation and tape sizes, please refer to our tape and reel
packaging specification.
SC3N
YY
WW
L
= Part Name
= Year
= Week
= Lot Number
Cautions：Molding
resin
Epoxy resin UL:94V-0
Carrier Tape Specification SMC
SYMBOL
A
B
C
d
E
F
P
P0
P1
T
W
Millimeters
5.90
8.20
2.40
1.40
1.40
7.60
7.90
3.90
3.90
-
15.80
Min.
6.10
8.40
2.60
1.60
1.60
7.70
8.10
4.10
4.10
0.600
16.20
Max.
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30BQ200
Technical Data
Data Sheet N0026, Rev. A
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or any
other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC -
Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third party.
When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and regulations..
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