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2013882-1

Description
ILM ASSY, LGA115X
CategoryThe connector   
File Size6MB,2 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Environmental Compliance
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2013882-1 Overview

ILM ASSY, LGA115X

2013882-1 Parametric

Parameter NameAttribute value
Attachment typeILM components
Top support plate materialStainless steel
Spring plate assembly materialStainless steel
Outlet typeLGA 115X
Working group temperature range-25 – 100 °C [ -13 – 212 °F ]
Encapsulation methodbag/box
Introducing
Sockets and Hardware for LGA 1156 Processors
TE Connectivity’s surface mount LGA socket was designed for use with Intel’s
®
Core™ i7
LGA 1156 processor. The contacts have solder balls for surface mount onto the PCB, while
the top side provides a cantilever beam interface to the package. The integrated lever
mechanism (ILM) generates the Z-axis compression load. A robust bolster plate eliminates
PCB bowing during compression. The sockets have been validated to Intel Design Guides.

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Index Files: 1015  1334  1430  1165  2721  21  27  29  24  55 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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