®
BF3510TV
FULL 50-60Hz RECTIFICATION BRIDGE
PRELIMINARY DATASHEET
MAIN PRODUCT CHARACTERISTICS
I
F(AV)
V
RRM
Tj (max)
V
F
(max)
FEATURES AND BENEFITS
COMPACT ISOTOP DESIGN COMPATIBLE
WITH FAST DIODES AND TRANSISTORS.
EXCELLENT THERMAL TRANSFER BETWEEN
JUNCTION AND HEATSINK
UL PENDING
DESCRIPTION
The Bridges series from ST Microelectronics has
been designed to allow a better standardization of
packages on boards principally designed with ISO-
TOP packages. The insulated package of the
bridge will be able to sit on heatsink with other
components. Single phase and 3-phase high
power SMPS, UPS, MOTOR DRIVES and WELD-
ING equipment will primarily find advantage in
these industry package products.
35 A
1000 V
150
°C
1.30 V
-
+
+
-
ISOTOP
TM
ABSOLUTE RATINGS AND ELECTRICAL CHARACTERISTICS (per diode unless specified)
Symbol
V
RRM
V
RSM
I
F(AV)
total
I
FSM
I
2
.t
T
stg
Tj
Pmax total
Parameter
Repetitive peak reverse voltage
Non repetitive peak reverse voltage
Average forward current
Tc = 80°C sinusoidal
Surge non repetitive forward current
50Hz JEDEC method
Fusing
Storage temperature range
Maximum operating junction temperature
Totol power dissipation
Value
1000
1000
35
300
660
- 55 to + 150
150
50
Unit
V
V
A
A
A
2
.s
°C
°C
W
TM : ISOTOP is a trademark of ST Microelectronics.
August 1999 - Ed: 2A
1/3
BF3510TV
THERMAL RESISTANCES
Symbol
Rth (j-c)
Junction to case
Parameter
total
Value
0.5
Unit
°C/W
ELECTRICAL CHARACTERISTICS (Per diode)
STATIC CHARACTERISTICS
Symbol
I
R
*
Parameter
Reverse leakage
current
Test Conditions
V
R
= 0.8 V
RRM
δ
< 2%
tp = 5ms
I
F
= 35 A
δ
< 2%
tp = 380µs
T
j
= 25
°
C
T
j
= 125
°
C
T
j
= 25
°
C
T
j
= 125
°
C
Min.
Typ.
Max.
10
0.2
1.4
1.3
Unit
µ
A
mA
V
V
V
F **
Forward voltage
drop
Pulse test : * tp = 5 ms, duty cycle < 2 %
** tp = 380
µs,
duty cycle < 2 %
For one diode: Pcond = 1.02 x I
F(AV)
+ 0.008 x I
2F(RMS)
Tj = Pcond x 4 x R
th(j-c)
+ Tc
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BF3510TV
PACKAGE MECHANICAL DATA
ISOTOP (Plastic)
DIMENSIONS
Millimeters
Inches
Min.
A
A1
B
C
C2
D
D1
E
E1
E2
G
G1
G2
F
F1
P
P1
S
Cooling method : by conduction (C)
Electrical isolation : 2500V
(RMS)
Max.
Min.
Max.
11.80 12.20
8.90
9.10
7.8
8.20
0.75
0.85
1.95
2.05
37.80 38.20
31.50 31.70
25.15 25.50
23.85 24.15
24.80 typ.
14.90 15.10
12.60 12.80
3.50
4.30
4.10
4.30
4.60
5.00
4.00
4.30
4.00
4.40
30.10 30.30
0.465 0.480
0.350 0.358
0.307 0.323
0.030 0.033
0.077 0.081
1.488 1.504
1.240 1.248
0.990 1.004
0.939 0.951
0.976 typ.
0.587 0.594
0.496 0.504
0.138 0.169
0.161 0.169
0.181 0.197
0.157
0.69
0.157 0.173
1.185 1.193
REF.
Capacitance : < 45 pF
Inductance: < 5 nH
- Recommended torque value : 1.3 N.m (MAX 1.5 N.m) for the 6 x M4 screws. (2 x M4 screws recommended for mounting the package on the
heatsink and the 4 screws given with the screw version).
- The screws supplied with the package are adapted for mounting on a board (or other types of terminals) with a thickness of 0.6 mm min and
2.2 mm max.
Ordering type
BF3510TV
Marking
BF3510TV
Package
ISOTOP
Weight
27g
without screws
Base qty
10
Delivery mode
Tube
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringementof patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
©
1999 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
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