1. Mounted with minimum recommended pad size, PC Board FR4, See Figures 9 & 10
Symbol
R
tjl
R
tjtab
R
tja
Value
35
23
277
Unit
C/W
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 2), See Figure 2
(I
F
= 0.1 A)
(I
F
= 1.0 A)
(I
F
= 3.0 A)
Maximum Instantaneous Reverse Current (Note 2), See Figure 4
(V
R
= 40 V)
(V
R
= 20 V)
2. Pulse Test: Pulse Width
250
ms,
Duty Cycle
2%
i
F
, INSTANTANEOUS FORWARD CURRENT (AMPS)
I
F
, INSTANTANEOUS FORWARD CURRENT (AMPS)
I
R
Symbol
V
F
T
J
= 25C
0.36
0.55
0.85
T
J
= 25C
0.5
0.15
Value
T
J
= 85C
0.30
0.515
0.88
T
J
= 85C
25
18
mA
Unit
V
10
100
10
1.0
T
J
= 125C
T
J
= 85C
T
J
= 25C
T
J
=
−40C
1.0
T
J
= 125C
T
J
= 85C
T
J
= 25C
0.1
0.1
0.3
0.5
0.7
0.9
0.1
0.1
0.3
0.5
0.7
0.9
v
F
, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
V
F
, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE
(VOLTS)
Figure 1. Typical Forward Voltage
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2
Figure 2. Maximum Forward Voltage
MBRM140T1G, NRVBM140T1G, MBRM140T3G, NRVBM140T3G
10E−3
I
R
, REVERSE CURRENT (AMPS)
I
R
, MAXIMUM REVERSE CURRENT (AMPS)
100E−3
T
J
= 85C
10E−3
1.0E−3
T
J
= 85C
100E−6
T
J
= 25C
10E−6
1.0E−3
T
J
= 25C
100E−6
1.0E−6
0
10
20
30
V
R
, REVERSE VOLTAGE (VOLTS)
40
10E−6
0
10
20
30
V
R
, REVERSE VOLTAGE (VOLTS)
40
Figure 3. Typical Reverse Current
FREQ = 20 kHz
P
FO
, AVERAGE POWER DISSIPATION (WATTS)
I
O
, AVERAGE FORWARD CURRENT (AMPS)
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
25
35
SQUARE WAVE
I
pk
/I
o
=
p
I
pk
/I
o
= 5
I
pk
/I
o
= 10
I
pk
/I
o
= 20
dc
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
Figure 4. Maximum Reverse Current
I
pk
/I
o
= 10
I
pk
/I
o
= 20
I
pk
/I
o
=
p
SQUARE
I
pk
/I
o
= 5
WAVE
dc
45
55
65
75
85
95
105
115 125
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
T
L
, LEAD TEMPERATURE (C)
Figure 5. Current Derating
I
O
, AVERAGE FORWARD CURRENT (AMPS)
Figure 6. Forward Power Dissipation
T
J
, DERATED OPERATING TEMPERATURE (_C)
1000
125
115
105
R
tja
= 33.72C/W
95
85
75
51C/W
69C/W
83.53C/W
0
5.0
96C/W
40
C, CAPACITANCE (pF)
T
J
= 25C
100
10
0
5.0
10
15
20
25
30
V
R
, REVERSE VOLTAGE (VOLTS)
35
40
Figure 7. Capacitance
Figure 8. Typical Operating Temperature Derating*
30
35
10
20
25
15
V
R
, DC REVERSE VOLTAGE (VOLTS)
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-
verse voltage conditions. Calculations of T
J
therefore must include forward and reverse power effects. The allowable operating
T
J
= T
Jmax
−
r(t)(Pf + Pr) where
T
J
may be calculated from the equation:
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable T
J
due to reverse bias under DC conditions only and is calculated as T
J
= T
Jmax
−
r(t)Pr,
where r(t) = Rthja. For other power applications further calculations must be performed.
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3
MBRM140T1G, NRVBM140T1G, MBRM140T3G, NRVBM140T3G
R
(T)
, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
1.0
50%
20%
0.1
10%
5.0%
2.0%
1.0%
Rtjl(t) = Rtjl*r(t)
0.001
0.00001
0.01
0.0001
0.001
0.01
T, TIME (s)
0.1
1.0
10
100
Figure 9. Thermal Response Junction to Lead
R
(T)
, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
1.0
50%
0.1
20%
10%
5.0%
0.01
2.0%
Rtjl(t) = Rtjl*r(t)
1.0%
0.001
0.00001
0.0001
0.001
0.01
0.1
T, TIME (s)
1.0
10
100
1,000
Figure 10. Thermal Response Junction to Ambient
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4
MBRM140T1G, NRVBM140T1G, MBRM140T3G, NRVBM140T3G
PACKAGE DIMENSIONS
POWERMITE
CASE 457−04
ISSUE E
−A−
S
C
J
F
0.08 (0.003)
M
T B
S
C
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
1.75
2.05 0.069
0.081
1.75
2.18 0.069
0.086
0.85
1.15 0.033
0.045
0.40
0.69 0.016
0.027
0.70
1.00 0.028
0.039
-0.05
+0.10 -0.002 +0.004
0.10
0.25 0.004
0.010
3.60
3.90 0.142
0.154
0.50
0.80 0.020
0.031
1.20
1.50 0.047
0.059
0.50 REF
0.019 REF
−B−
K
PIN 1
PIN 2
R
J
H
−T−
L
DIM
A
B
C
D
F
H
J
K
L
R
S
D
0.08 (0.003)
M
T B
S
C
S
STYLE 1:
PIN 1. CATHODE
2. ANODE
SOLDERING FOOTPRINT*
0.635
0.025
0.762
0.030
2.67
0.105
2.54
0.100
1.27
0.050
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
POWERMITE is a registered trademark of and used under a license from Microsemi Corporation.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
N. American Technical Support:
800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature:
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For additional information, please contact your local
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