PMSTA55; PMSTA56
500 mA PNP general-purpose transistors
Rev. 05 — 1 February 2010
Product data sheet
1. Product profile
1.1 General description
PNP transistors in a SOT323 (SC-70) very small Surface-Mounted Device (SMD) plastic
package.
Table 1.
Product overview
Package
NXP
PMSTA55
PMSTA56
SOT323
JEITA
SC-70
PMSTA05
PMSTA06
NPN complement
Type number
1.2 Features
High current (max. 500 mA)
Collector-emitter voltage:
60 V (PMSTA55)
80 V (PMSTA56)
1.3 Applications
Intended for telephony and professional communication equipment.
2. Pinning information
Table 2.
Pin
1
2
3
Pinning
Description
base
emitter
collector
1
2
3
1
2
006aab259
Simplified outline
Graphic symbol
3
NXP Semiconductors
PMSTA55; PMSTA56
500 mA PNP general-purpose transistors
3. Ordering information
Table 3.
Ordering information
Package
Name
PMSTA55
PMSTA56
SC-70
Description
plastic surface-mounted package; 3 leads
Version
SOT323
Type number
4. Marking
Table 4.
PMSTA55
PMSTA56
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Marking codes
Marking code
[1]
*2H
*2G
Type number
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CBO
Parameter
collector-base voltage
PMSTA55
PMSTA56
V
CEO
collector-emitter voltage
PMSTA55
PMSTA56
V
EBO
I
C
I
CM
I
BM
P
tot
T
j
T
amb
T
stg
[1]
Conditions
open emitter
Min
-
-
Max
−60
−80
−60
−80
−4
−500
−500
−500
200
150
+150
+150
Unit
V
V
V
V
V
mA
mA
mA
mW
°C
°C
°C
open base
-
-
open collector
-
-
-
-
T
amb
≤
25
°C
[1]
emitter-base voltage
collector current
peak collector current
peak base current
total power dissipation
junction temperature
ambient temperature
storage temperature
-
-
−65
−65
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
PMSTA55_56_5
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 — 1 February 2010
2 of 8
NXP Semiconductors
PMSTA55; PMSTA56
500 mA PNP general-purpose transistors
6. Thermal characteristics
Table 6.
Symbol
R
th(j-a)
[1]
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
Conditions
in free air
[1]
Min
-
Typ
-
Max
625
Unit
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 7.
Characteristics
T
amb
= 25
°
C unless otherwise specified.
Symbol
I
CBO
Parameter
collector-base cut-off
current
PMSTA55
PMSTA56
I
EBO
h
FE
emitter-base cut-off
current
DC current gain
V
CB
=
−60
V; I
E
= 0 A
V
CB
=
−80
V; I
E
= 0 A
V
EB
=
−4
V; I
C
= 0 A
V
CE
=
−1
V;
I
C
=
−10
mA
V
CE
=
−1
V;
I
C
=
−100
mA
V
CEsat
V
BE
f
T
collector-emitter
saturation voltage
I
C
=
−100
mA;
I
B
=
−10
mA
[1]
Conditions
Min
Typ
Max
Unit
-
-
-
100
100
-
-
50
-
-
-
-
-
-
-
-
−100
−100
−500
-
-
−250
−1.2
-
nA
nA
nA
mV
mV
MHz
base-emitter voltage I
C
=
−100
mA;
V
CE
=
−1
V
transition frequency
V
CE
=
−1
V;
I
C
=
−100
mA;
f = 100 MHz
[1]
Pulse test: t
p
≤
300
μs; δ ≤
0.02.
PMSTA55_56_5
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 — 1 February 2010
3 of 8
NXP Semiconductors
PMSTA55; PMSTA56
500 mA PNP general-purpose transistors
8. Package outline
2.2
1.8
3
0.45
0.15
1.1
0.8
2.2 1.35
2.0 1.15
1
2
0.4
0.3
1.3
0.25
0.10
04-11-04
Dimensions in mm
Fig 1.
Package outline SOT323 (SC-70)
9. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
PMSTA55
PMSTA56
[1]
For further information and the availability of packing methods, see
Section 12.
Package Description
SOT323
4 mm pitch, 8 mm tape and reel
Packing quantity
3000
-115
10000
-135
PMSTA55_56_5
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 — 1 February 2010
4 of 8
NXP Semiconductors
PMSTA55; PMSTA56
500 mA PNP general-purpose transistors
10. Revision history
Table 9.
Revision history
Release date
20100201
Data sheet status
Product data sheet
Change notice
-
Supersedes
PMSTA55_56_N_4
Document ID
PMSTA55_56_5
Modifications:
•
•
•
•
•
•
•
•
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Section 1 “Product profile”:
amended
Table 2 “Pinning”:
amended
Section 3 “Ordering information”:
added
Section 4 “Marking”:
amended
Figure 1:
superseded by minimized package outline drawing
Section 9 “Packing information”:
added
Section 11 “Legal information”:
updated
Product data sheet
Product specification
Product specification
Product specification
-
-
-
-
PMSTA55_56_3
PMSTA55_56_2
PMSTA55_56_1
-
PMSTA55_56_N_4
PMSTA55_56_3
PMSTA55_56_2
PMSTA55_56_1
20080117
19990422
19980721
19970602
PMSTA55_56_5
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 — 1 February 2010
5 of 8
京公网安备 11010802033920号
EEWORLD
