DG50_ACJ/CWE ..................................................0°C to +70°C
DG50_ABK........................................................-20°C to +85°C
DG50_ADJ/DY/EWE..........................................-40°C to +85°C
DG50_AAK/MY ...............................................-55°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow)
PDIP, Wide SO, Narrow SO, CERDIP containing lead(Pb)..+240°C
PDIP, Wide SO, Narrow SO lead(Pb)-free ....................+260°C
Note 1:
Signals on S_ or D_ exceeding V+ or V- are clamped by internal diodes. Limit forward-diode current to maximum current ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
This is a free software [url=http://www.designspark.com/chn]http://www.designspark.com/chn[/url] RS launches DesignSpark Mechanical 3D design software: [url=http://article.cechina.cn/13/0912/05/201309...
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In recent years, with the increasing demand for manufacturing and automated production management, industrial barcode scanners have gradually become an indispensable part of the industrial manufact...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
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summary
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Tools/Materials
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Definitions of VR
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What is Virtual Reality?
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