CO
M
PL
Features
RoHS compliant*
Low forward voltage
Extremely thin/leadless package
Majority carrier conduction
Designed for mounting on small surface
IA
NT
This series is currently available but
not recommended for new designs.
*R
oH
S
CD1005-B0520 – Surface Mount Schottky Barrier Diode
General Information
The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop
increasingly smaller electronic components. Bourns offers Schottky Barrier Diodes for these applications, in compact chip package 1005
(SOD323) size format, which offer PCB real estate savings and are considerably smaller than most competitive parts. The Schottky Barrier
Diodes offer a forward current of 0.5 A with a repetitive peak reverse voltage of 30 V.
Bourns
®
Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration
minimizes roll away.
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Repetitive Peak Reverse Voltage
Reverse Voltage
Average Forward Rectified Current
Maximum Instantaneous Forward Voltage
@ I
F
= 1.0 A
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
(JEDEC Method)
Forward Voltage (I
F
= 100 mA)
Forward Voltage (I
F
= 500 mA)
Reverse Current (V
R
= 20 V)
Capacitance between terminals
(f = 1 MHz, and 0 VDC reverse voltage)
Symbol
V
RRM
V
R
I
O
V
F
I
FSM
V
F
V
F
I
R
C
T
100
0.25
0.35
0.45
Min.
Nom.
Max.
30
20
0.5
0.55
2
0.36
0.47
100
Unit
V
V
A
V
A
V
V
µA
pF
Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Junction Temperature Range
Storage Temperature Range
Symbol
T
J
T
STG
CD1005-B0520
-40 to +125
-40 to +125
Unit
°C
°C
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD1005-B0520 – Surface Mount Schottky Barrier Diode
Product Dimensions
This is an RoHS compliant product. It is a SOD-323F (1005)
standard package, molded plastic. The terminals are Gold plated
and are solderable per MIL-STD-750, Method 2026. The polarity is
indicated by a cathode band. The package weighs approximately
0.006 g. The package and dimensions are shown below.
A
Recommended Pad Layout
A
B
B
C
Dimension
A (Max.)
B (Min.)
D
C (Min.)
C
DIMENSIONS:
1005
2.10
(0.082)
1.20
(0.047)
1.20
(0.047)
MM
(INCHES)
How To Order
CD 1005 - B 05 20
E
Common Code
Chip Diode
Package
• 1005
Dimension
A
B
C
D
E
1005
2.40 - 2.60
(0.095 - 0.102)
1.10 - 1.30
(0.043 - 0.051)
0.50
Typ.
(0.020)
0.70 - 0.90
(0.027 - 0.035)
1.00
Typ.
(0.039)
Model
B = Schottky Barrier Series
Average Forward Current (Io) Code
05 = 500 mA
(Code x 1000 mA = Average Forward Current)
Reverse Voltage (VR) Code
20 = 20 V
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD1005-B0520 – Surface Mount Schottky Barrier Diode
Rating and Characteristic Curves
Typical Capacitance
60
Average Forward Current (%)
20
50
40
30
20
10
0
0
5
10
Reverse Voltage (V)
15
f = 1 MHz
Ta = 25 °C
Current Derating Curve
120
100
80
60
40
20
0
0
25
50
75
100
125
150
Ambient Temperature (°C)
Forward Characteristics
1000
Capacitance Between Terminals (pF)
Reverse Characteristics
100m
10m
100 °C
Forward Current (mA)
100
125 °C
Reverse Current (A)
1m
75 °C
100µ
25 °C
10µ
10
75 °C
-25 °C
1µ
25 °C
1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Forward Voltage (Volts)
0.1µ
0
5
-25 °C
10
Reverse Voltage (V)
15
20
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD1005-B0520 – Surface Mount Schottky Barrier Diode
Packaging Information
The surface mount product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481 standard.
P
0
P
1
d
Index Hole
E
T
120
°
F
W
D2
D1 D
B
P
Trailer
A
Device
C
Leader
W1
End
....... .......
....... .......
.......
....... ....... .......
10 pitches (min.)
10 pitches (min.)
Start
MM
(INCHES)
DIMENSIONS:
Direction of Feed
Item
Carrier Width
Carrier Length
Carrier Depth
Sprocket Hole
Reel Outside Diameter
Reel Inner Diameter
Feed Hole Diameter
Sprocket Hole Position
Punch Hole Position
Punch Hole Pitch
Sprocket Hole Pitch
Embossment Center
Overall Tape Thickness
Tape Width
Reel Width
Quantity per Reel
Symbol
A
B
C
d
D
D1
D2
E
F
P
P0
P1
T
W
W1
—
1005 (SOD323)
1.90 ±0.10
(0.075 - 0.004)
4.30 ±0.10
(0.169 - 0.004)
1.80 ±0.10
(0.071 - 0.004)
1.55 ±0.05
(0.061 - 0.002)
178
(7.008)
80.0
Min.
(3.150)
13.0 ±0.20
(0.512 - 0.008)
1.75 ±0.10
(0.069 - 0.004)
3.50 ±0.05
(0.138 - 0.002)
4.00 ±0.10
(0.157 - 0.004)
4.00 ±0.10
(0.157 - 0.004)
2.00 ±0.05
(0.079 - 0.002)
0.20 ±0.10
(0.008 - 0.004)
8.00 ±0.20
(0.315 - 0.008)
13.5
Max.
(0.531)
2,500
REV.
12/15
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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