MH8S64FFC-10 datasheet, PDF - EEWORLD Datasheet

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MH8S64FFC-10: Description536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM; Categorystorage storage; File Size554KB，55 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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MH8S64FFC-10 Overview

536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM

MH8S64FFC-10 Parametric

Parameter Name	Attribute value
Maker	Mitsubishi
Parts packaging code	DIMM
package instruction	DIMM, DIMM144,32
Contacts	144
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	8 ns
Maximum clock frequency (fCLK)	100 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N144
memory density	536870912 bi
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	144
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8MX64
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM144,32
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	25.4 mm
Maximum standby current	0.004 A
Maximum slew rate	0.64 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	0.8 mm
Terminal location	DUAL

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Preliminary Spec.

Some contents are subject to change without notice.

MITSUBISHI LSIs

MH8S64FFC-10,10L

536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM

DESCRIPTION

The MH8S64FFC is 8388608 - word by 64-bit

Synchronous DRAM module. This consists of four

industry standard 8Mx16 Synchronous DRAMs in

TSOP and one industory standard EEPROM in

TSSOP.

The mounting of TSOP on a card edge Dual Inline

package provides any application where high

densities and large quantities of memory are

required.

This is a socket type - memory modules, suitable for

easy interchange or addition of modules.

Utilizes industry standard 8M x 16 Synchronous DRAMs

TSOP and industry standard EEPROM in TSSOP

144-pin (72-pin dual in-line package)

single 3.3V±0.3V power supply

Clock frequency 100MHz(max.)

Fully synchronous operation referenced to clock rising

edge

4 bank operation controlled by BA0,1(Bank Address)

/CAS latency- 2/3(programmable)

FEATURES

Frequency

-10,-10L

100MHz

CLK Access Time

(Component SDRAM)

Burst length- 1/2/4/8/Full Page(programmable)

Burst type- sequential / interleave(programmable)

Column access - random

Auto precharge / All bank precharge controlled by A10

Auto refresh and Self refresh

4096 refresh cycle /64ms

LVTTL Interface

8.0ns(CL=3)

APPLICATION

main memory or graphic memory in computer systems

PCB Outline

(Front)

(Back)

143

144

MIT-DS-0281-0.1

MITSUBISHI

ELECTRIC

( 1 / 55 )

15.Jan.1999

MH8S64FFC-10 Related Products

	MH8S64FFC-10	MH8S64FFC-10L
Description	536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM	536870912-BIT (8388608 - WORD BY 64-BIT)SynchronousDRAM
Maker	Mitsubishi	Mitsubishi
Parts packaging code	DIMM	DIMM
package instruction	DIMM, DIMM144,32	DIMM, DIMM144,32
Contacts	144	144
Reach Compliance Code	unknow	unknow
ECCN code	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	8 ns	8 ns
Maximum clock frequency (fCLK)	100 MHz	100 MHz
I/O type	COMMON	COMMON
JESD-30 code	R-XDMA-N144	R-XDMA-N144
memory density	536870912 bi	536870912 bi
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	64	64
Number of functions	1	1
Number of ports	1	1
Number of terminals	144	144
word count	8388608 words	8388608 words
character code	8000000	8000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	8MX64	8MX64
Output characteristics	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM
Encapsulate equivalent code	DIMM144,32	DIMM144,32
Package shape	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
refresh cycle	4096	4096
Maximum seat height	25.4 mm	25.4 mm
Maximum standby current	0.004 A	0.004 A
Maximum slew rate	0.64 mA	0.64 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD
Terminal pitch	0.8 mm	0.8 mm
Terminal location	DUAL	DUAL

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