MH28S72PJG-6 datasheet, PDF - EEWORLD Datasheet

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MH28S72PJG-6: Description9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM; Categorystorage storage; File Size988KB，57 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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MH28S72PJG-6 Overview

9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

MH28S72PJG-6 Parametric

Parameter Name	Attribute value
Maker	Mitsubishi
Parts packaging code	DIMM
package instruction	DIMM, DIMM168
Contacts	168
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Maximum access time	5.4 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	133 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N168
memory density	9663676416 bi
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	168
word count	134217728 words
character code	128000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128MX72
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	8192
self refresh	YES
Maximum standby current	0.351 A
Maximum slew rate	6.795 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL

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Preliminary Spec.

Some contents are subject to change without notice.

MITSUBISHI LSIs

MH28S72PJG -5,-6,-7

9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

DESCRIPTION

The MH28S72PJG is 134,217,728 - word x 72-bit

Sy nchronous DRAM stacked structural module. This

consist of t hirty -six industry standard 64M x 4

Sy nchronous DRAMs in TSOP.

The stacked structure of TSOP on a card edge dual in-

line package prov ides any application where high

densities and large of quantities memory are required.

This is a socket-ty pe memory m odule ,suitable f or

easy interchange or addition of m odule.

85pin

1pin

FEATURES

Frequency

-5

-6

-7

133MHz

100MHz

CLK Access Time

(at Latch mode,Components)

94pin

95pin

10pin

11pin

5.4ns(CL=3)

5.4ns(CL=4)

6.0ns(CL=3)

124pin

40pin

41pin

Utilizes industry standard 64M X 4 Synchronous DRAMs in

TSOP package , industry standard Resister in TSSOP package ,

and industry standard PLL in TSSOP package.

Single 3.3V +/- 0.3V supply

Burst length 1/2/4/8/Full Page (programmable)

Burst type sequential / interleave (programmable)

Column access random

Burst W rite / Single W rite (programmable)

Auto precharge / Auto bank precharge controlled by A10

Auto refresh and Self refresh

LVTTL Interface

8192 refresh cycles ev ery 64ms

125pin

APPLICATION

Main memory unit for computers, Microcomputer memory.

168pin

84pin

MIT-DS-406-0.2

MITSUBISHI

ELECTRIC

27/Mar. /2001

MH28S72PJG-6 Related Products

	MH28S72PJG-6	MH28S72PJG-7	MH28S72PJG-5
Description	9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM	9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM	9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Maker	Mitsubishi	Mitsubishi	Mitsubishi
Parts packaging code	DIMM	DIMM	DIMM
package instruction	DIMM, DIMM168	DIMM, DIMM168	DIMM, DIMM168
Contacts	168	168	168
Reach Compliance Code	unknow	unknow	unknown
ECCN code	EAR99	EAR99	EAR99
access mode	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST	DUAL BANK PAGE BURST
Maximum access time	5.4 ns	6 ns	5.4 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	133 MHz	100 MHz	133 MHz
I/O type	COMMON	COMMON	COMMON
JESD-30 code	R-XDMA-N168	R-XDMA-N168	R-XDMA-N168
memory density	9663676416 bi	9663676416 bi	9663676416 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	72	72	72
Number of functions	1	1	1
Number of ports	1	1	1
Number of terminals	168	168	168
word count	134217728 words	134217728 words	134217728 words
character code	128000000	128000000	128000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	128MX72	128MX72	128MX72
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	8192	8192
self refresh	YES	YES	YES
Maximum standby current	0.351 A	0.286 A	0.351 A
Maximum slew rate	6.795 mA	6.37 mA	6.795 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL

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