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MH1S72CPG-12

Description
75497472-BIT (1048576-WORD BY 72-BIT)SynchronousDRAM
Categorystorage    storage   
File Size437KB,47 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
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MH1S72CPG-12 Overview

75497472-BIT (1048576-WORD BY 72-BIT)SynchronousDRAM

MH1S72CPG-12 Parametric

Parameter NameAttribute value
MakerMitsubishi
Parts packaging codeDIMM
package instruction,
Contacts168
Reach Compliance Codeunknow
ECCN codeEAR99
JESD-30 codeR-XDMA-N168
memory density75497472 bi
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width72
Number of functions1
Number of ports1
Number of terminals168
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
organize1MX72
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Certification statusNot Qualified
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Terminal formNO LEAD
Terminal locationDUAL
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH1S72CPG-10,-12,-15
75497472-BIT (1048576-WORD BY 72-BIT)SynchronousDRAM
DESCRIPTION
The MH1S72CPG is 1048576-word by 64-bit
Synchronous DRAM module. This consists of five
industry standard 1Mx16 Synchronous DRAMs in
TSOP and one industory standard EEPROM in
TSSOP.
The mounting of TSOP on a card edge Dual Inline
package provides any application where high
densities and large quantities of memory are
required.
This is a socket type - memory modules, suitable for
easy interchange or addition of modules.
85pin
1pin
FEATURES
Frequency
-10
-12
-15
100MHz
83MHz
67MHz
CLK Access Time
(Component SDRAM)
94pin
95pin
10pin
11pin
8ns(CL=3)
8ns (CL=3)
Back side
9ns (CL=3)
Front side
Utilizes industry standard 1M x 16 Synchronous DRAMs
TSOP and industry standard EEPROM in TSSOP
168-pin (84-pin dual in-line package)
124pin
125pin
40pin
41pin
single 3.3V±0.3V power supply
Clock frequency 100MHz/83MHz/67MHz
Fully synchronous operation referenced to clock rising
edge
Dual bank operation controlled by BA(Bank Address)
/CAS latency- 1/2/3(programmable)
Burst length- 1/2/4/8(programmable)
Burst type- sequential / interleave(programmable)
Column access - random
Auto precharge / All bank precharge controlled by A10
Auto refresh and Self refresh
4096 refresh cycle /64ms
LVTTL Interface
168pin
84pin
APPLICATION
main memory or graphic memory in computer systems
Module item "-10","-12" , and "-15" show mounted SDRAM devices Cycle time(min.).
MIT-DS-0089-3.0
MITSUBISHI
ELECTRIC
( 1 / 47 )
28.Mar.1997

MH1S72CPG-12 Related Products

MH1S72CPG-12 MH1S72CPG-15 MH1S72CPG-10
Description 75497472-BIT (1048576-WORD BY 72-BIT)SynchronousDRAM 75497472-BIT (1048576-WORD BY 72-BIT)SynchronousDRAM 75497472-BIT (1048576-WORD BY 72-BIT)SynchronousDRAM
Maker Mitsubishi Mitsubishi -
Parts packaging code DIMM DIMM -
Contacts 168 168 -
Reach Compliance Code unknow unknow -
ECCN code EAR99 EAR99 -
JESD-30 code R-XDMA-N168 R-XDMA-N168 -
memory density 75497472 bi 75497472 bi -
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE -
memory width 72 72 -
Number of functions 1 1 -
Number of ports 1 1 -
Number of terminals 168 168 -
word count 1048576 words 1048576 words -
character code 1000000 1000000 -
Operating mode SYNCHRONOUS SYNCHRONOUS -
organize 1MX72 1MX72 -
Package body material UNSPECIFIED UNSPECIFIED -
Package shape RECTANGULAR RECTANGULAR -
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY -
Certification status Not Qualified Not Qualified -
Maximum supply voltage (Vsup) 3.6 V 3.6 V -
Minimum supply voltage (Vsup) 3 V 3 V -
Nominal supply voltage (Vsup) 3.3 V 3.3 V -
surface mount NO NO -
technology CMOS CMOS -
Terminal form NO LEAD NO LEAD -
Terminal location DUAL DUAL -

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