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MH16S64PFC-10L

Description
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
Categorystorage    storage   
File Size561KB,55 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
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MH16S64PFC-10L Overview

1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM

MH16S64PFC-10L Parametric

Parameter NameAttribute value
MakerMitsubishi
Parts packaging codeDIMM
package instructionDIMM, DIMM144,32
Contacts144
Reach Compliance Codeunknow
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time8 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
JESD-30 codeR-XDMA-N144
memory density1073741824 bi
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals144
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16MX64
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM144,32
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
self refreshYES
Maximum standby current0.008 A
Maximum slew rate1.28 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch0.8 mm
Terminal locationDUAL
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64PFC -7,-7L,-8,-8L,-10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
DESCRIPTION
The MH16S64PFC is 16777216 - word by 64-bit
Synchronous DRAM module. This consists of eight
industry standard 8Mx16 Synchronous DRAMs in
TSOP and one industory standard EEPROM in
TSSOP.
The mounting of TSOP on a card edge Dual Inline
package provides any application where high
densities and large quantities of memory are
required.
This is a socket type - memory modules, suitable for
easy interchange or addition of modules.
Utilizes industry standard 8M x 16 Synchronous DRAMs
TSOP and industry standard EEPROM in TSSOP
144-pin (72-pin dual in-line package)
single 3.3V±0.3V power supply
Clock frequency 100MHz(max.)
Fully synchronous operation referenced to clock rising
edge
4 bank operation controlled by BA0,1(Bank Address)
/CAS latency- 2/3(programmable)
FEATURES
Frequency
-7,-7L
-8,-8L
-10,-10L
100MHz
100MHz
100MHz
CLK Access Time
(Component SDRAM)
Burst length- 1/2/4/8/Full Page(programmable)
Burst type- sequential / interleave(programmable)
Column access - random
Auto precharge / All bank precharge controlled by A10
Auto refresh and Self refresh
4096 refresh cycle /64ms
6.0ns(CL=3)
6.0ns(CL=3)
8.0ns(CL=3)
PC100 Compliant
LVTTL Interface
APPLICATION
main memory or graphic memory in computer systems
PCB Outline
(Front)
(Back)
1
2
143
144
MIT-DS-0293-0.0
MITSUBISHI
ELECTRIC
( 1 / 55 )
21.Dec.1998

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Maker Mitsubishi Mitsubishi Mitsubishi Mitsubishi Mitsubishi -
Parts packaging code DIMM DIMM DIMM DIMM DIMM -
package instruction DIMM, DIMM144,32 DIMM, DIMM144,32 DIMM, DIMM144,32 DIMM, DIMM144,32 DIMM, DIMM144,32 -
Contacts 144 144 144 144 144 -
Reach Compliance Code unknow unknow unknow unknow unknow -
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 -
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST -
Maximum access time 8 ns 6 ns 6 ns 6 ns 6 ns -
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH -
Maximum clock frequency (fCLK) 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz -
I/O type COMMON COMMON COMMON COMMON COMMON -
JESD-30 code R-XDMA-N144 R-XDMA-N144 R-XDMA-N144 R-XDMA-N144 R-XDMA-N144 -
memory density 1073741824 bi 1073741824 bi 1073741824 bi 1073741824 bi 1073741824 bi -
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE -
memory width 64 64 64 64 64 -
Number of functions 1 1 1 1 1 -
Number of ports 1 1 1 1 1 -
Number of terminals 144 144 144 144 144 -
word count 16777216 words 16777216 words 16777216 words 16777216 words 16777216 words -
character code 16000000 16000000 16000000 16000000 16000000 -
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS -
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C -
organize 16MX64 16MX64 16MX64 16MX64 16MX64 -
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE -
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED -
encapsulated code DIMM DIMM DIMM DIMM DIMM -
Encapsulate equivalent code DIMM144,32 DIMM144,32 DIMM144,32 DIMM144,32 DIMM144,32 -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY -
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
refresh cycle 4096 4096 4096 4096 4096 -
self refresh YES YES YES YES YES -
Maximum standby current 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A -
Maximum slew rate 1.28 mA 1.6 mA 1.6 mA 1.6 mA 1.6 mA -
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V -
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V -
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V -
surface mount NO NO NO NO NO -
technology CMOS CMOS CMOS CMOS CMOS -
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL -
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD -
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm -
Terminal location DUAL DUAL DUAL DUAL DUAL -

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