MH16S72BDFA-7 datasheet, PDF - EEWORLD Datasheet

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MH16S72BDFA-7: Description1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM; Categorystorage storage; File Size1MB，56 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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MH16S72BDFA-7 Overview

1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

MH16S72BDFA-7 Parametric

Parameter Name	Attribute value
Maker	Mitsubishi
Parts packaging code	DIMM
package instruction	DIMM, DIMM168
Contacts	168
Reach Compliance Code	unknow
ECCN code	EAR99
Is Samacsys	N
access mode	FOUR BANK PAGE BURST
Maximum access time	6 ns
Maximum clock frequency (fCLK)	100 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N168
memory density	1207959552 bi
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	168
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX72
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum standby current	0.043 A
Maximum slew rate	2.725 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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MITSUBISHI LSIs

MH16S72BDFA-7, -8

1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

PRELIMINARY

Some of contents are subject to change w ithout notice.

DESCRIPTION

The MH16S72BDFA is 16777216 - word x 72-bit

Sy nchronous DRAM module. This consist of eighteen

industry standard 16M x 4 Sy nchronous DRAMs in

TSOP.

The TSOP on a card edge dual in-line package prov ides

any application where high densities and large of

quantities memory are required.

This is a socket-ty pe memory m odule ,suitable f or

easy interchange or addition of module.

85pin

1pin

FEATURES

Type name

Max.

Frequency

CLK

Access Time

[component level]

94pin

95pin

10pin

11pin

MH16S72BDFA-7

MH16S72BDFA-8

100MHz

6ns (CL = 2, 3)

6ns (CL = 3)

Utilizes industry standard 16M X 4 Synchronous DRAMs in

TSOP package , industry standard Resistered buffer in TSSOP

package and industry standard PLL in TSSOP package

Single 3.3V +/- 0.3V supply

LVTTL Interface

Burst length 1/2/4/8/Full Page(programmable)

Burst W rite / Single W rite(programmable)

Auto precharge / All bank precharge controlled by A10

Auto refresh and Self refresh

4096 refresh cycles every 64ms

Discrete IC and module design conform to

PC/100 specification.

(module Spec. Rev. 1.2 and SPD 1.2A)

124pin

125pin

40pin

41pin

APPLICATION

Main memory unit for computers, Microcomputer memory.

168pin

84pin

MIT-DS-0329-0.0

MITSUBISHI

ELECTRIC

19/Jun/1999

MH16S72BDFA-7 Related Products

	MH16S72BDFA-7	MH16S72BDFA-8
Description	1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM	1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Maker	Mitsubishi	Mitsubishi
Parts packaging code	DIMM	DIMM
package instruction	DIMM, DIMM168	DIMM, DIMM168
Contacts	168	168
Reach Compliance Code	unknow	unknow
ECCN code	EAR99	EAR99
Is Samacsys	N	N
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Maximum access time	6 ns	6 ns
Maximum clock frequency (fCLK)	100 MHz	100 MHz
I/O type	COMMON	COMMON
JESD-30 code	R-XDMA-N168	R-XDMA-N168
memory density	1207959552 bi	1207959552 bi
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	72	72
Number of functions	1	1
Number of ports	1	1
Number of terminals	168	168
word count	16777216 words	16777216 words
character code	16000000	16000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	16MX72	16MX72
Output characteristics	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
refresh cycle	4096	4096
Maximum standby current	0.043 A	0.043 A
Maximum slew rate	2.725 mA	2.725 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL
Base Number Matches	1	1

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