MCR100 Series
Preferred Device
Sensitive Gate
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
PNPN devices designed for high volume, line-powered consumer
applications such as relay and lamp drivers, small motor controls, gate
drivers for larger thyristors, and sensing and detection circuits.
Supplied in an inexpensive plastic TO-226AA package which is
readily adaptable for use in automatic insertion equipment.
Features
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SCRs
0.8 A RMS
100 thru 600 V
•
Sensitive Gate Allows Triggering by Microcontrollers and Other
•
•
•
•
•
•
•
Logic Circuits
Blocking Voltage to 600 V
On−State Current Rating of 0.8 Amperes RMS at 80°C
High Surge Current Capability − 10 A
Minimum and Maximum Values of IGT, VGT and IH Specified
for Ease of Design
Immunity to dV/dt − 20 V/msec Minimum at 110°C
Glass-Passivated Surface for Reliability and Uniformity
Pb−Free Packages are Available*
G
A
K
MARKING
DIAGRAM
MCR
100−x
AYWW
1
TO−92 (TO−226)
CASE 029
STYLE 10
2
3
x
A
Y
WW
= Specific Device Code
= Assembly Location
= Year
= Work Week
PIN ASSIGNMENT
1
2
3
Cathode
Gate
Anode
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Preferred
devices are recommended choices for future use
and best overall value.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2005
1
January, 2005 − Rev. 6
Publication Order Number:
MCR100/D
MCR100 Series
ORDERING INFORMATION
Device
MCR100−003
MCR100−004
MCR100−006
MCR100−008
MCR100−3RL
MCR100−6RL
MCR100−6RLRA
MCR100−6RLRM
MCR100−6ZL1
MCR100−8RL
MCR100−003G
MCR100−006G
MCR100−008G
MCR100−3RLG
MCR100−6RLG
MCR100−6RLRAG
MCR100−6RLRMG
MCR100−6ZL1G
MCR100−8RLG
2000 Units / Tape & Ammunition Box
2000 Units / Tape & Reel
TO−92 (TO−226)
TO 92 (TO 226)
(Pb−Free)
2000 Units / Tubes
2000 Units / Tape & Reel
5000 Units / Bulk
2000 Units / Tape & Ammunition Box
2000 Units / Tape & Reel
TO−92 (TO−226)
TO 92 (TO 226)
2000 Units / Tape & Reel
5000 Units / Bulk
Package Code
Shipping
†
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MAXIMUM RATINGS
(T
J
= 25°C unless otherwise noted)
Rating
Peak Repetitive Off−State Voltage (Note 1)
(T
J
=
*40
to 110°C, Sine Wave, 50 to 60 Hz; Gate Open)
MCR100−3
MCR100−4
MCR100−6
MCR100−8
On-State RMS Current, (T
C
= 80°C) 180° Conduction Angles
Peak Non-Repetitive Surge Current, (1/2 Cycle, Sine Wave, 60 Hz, T
J
= 25°C)
Circuit Fusing Consideration, (t = 8.3 ms)
Forward Peak Gate Power, (T
A
= 25°C, Pulse Width
v
1.0
m
s)
Forward Average Gate Power, (T
A
= 25°C, t = 8.3 ms)
Forward Peak Gate Current, (T
A
= 25°C, Pulse Width
v
1.0
m
s)
Reverse Peak Gate Voltage, (T
A
= 25°C, Pulse Width
v
1.0
m
s)
Operating Junction Temperature Range @ Rate V
RRM
and V
DRM
Storage Temperature Range
I
T(RMS)
I
TSM
I
2
t
P
GM
P
G(AV)
I
GM
V
GRM
T
J
T
stg
Symbol
V
DRM,
V
RRM
100
200
400
600
0.8
10
0.415
0.1
0.10
1.0
5.0
−40 to 110
−40 to 150
A
A
A
2
s
W
W
A
V
°C
°C
Value
Unit
V
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. V
DRM
and V
RRM
for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate
voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current
source such that the voltage ratings of the devices are exceeded.
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2
MCR100 Series
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,Junction−to−Case
Junction−to−Ambient
Lead Solder Temperature
(t1/16″ from case, 10 secs max)
Symbol
R
qJC
R
qJA
T
L
Max
75
200
260
Unit
°C/W
°C
ELECTRICAL CHARACTERISTICS
(T
C
= 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current (Note 2)
T
C
= 25°C
T
C
= 110°C
(V
D
= Rated V
DRM
and V
RRM
; R
GK
= 1 kW)
I
DRM
, I
RRM
−
−
−
−
10
100
mA
ON CHARACTERISTICS
Peak Forward On−State Voltage
*
(I
TM
= 1.0 A Peak @ T
A
= 25°C)
Gate Trigger Current (Continuous dc) (Note 3)
(V
AK
= 7.0 Vdc, R
L
= 100
W)
Holding Current
(2)
(V
AK
= 7.0 Vdc, Initiating Current = 20 mA)
Latch Current
(V
AK
= 7.0 V, Ig = 200
mA)
Gate Trigger Voltage (Continuous dc) (Note 3)
(V
AK
= 7.0 Vdc, R
L
= 100
W)
T
C
= −40°C
T
C
= 25°C
T
C
= 25°C
T
C
= −40°C
T
C
= 25°C
T
C
= −40°C
T
C
= 25°C
V
TM
I
GT
I
H
I
L
V
GT
−
−
−
−
−
−
−
−
−
40
0.5
−
0.6
−
0.62
−
1.7
200
5.0
10
10
15
0.8
1.2
V
mA
mA
mA
V
DYNAMIC CHARACTERISTICS
Critical Rate of Rise of Off−State Voltage
(V
D
= Rated V
DRM
, Exponential Waveform, R
GK
= 1000
W,T
J
= 110°C)
Critical Rate of Rise of On−State Current
(I
PK
= 20 A; Pw = 10
msec;
diG/dt = 1 A/msec, Igt = 20 mA)
*Indicates Pulse Test: Pulse Width
≤
1.0 ms, Duty Cycle
≤
1%.
2. R
GK
= 1000
W
included in measurement.
3. Does not include R
GK
in measurement.
dV/dt
di/dt
20
−
35
−
−
50
V/ms
A/ms
Voltage Current Characteristic of SCR
+ Current
Anode +
V
TM
on state
I
RRM
at V
RRM
I
H
Symbol
V
DRM
I
DRM
V
RRM
I
RRM
V
TM
I
H
Parameter
Peak Repetitive Off State Forward Voltage
Peak Forward Blocking Current
Peak Repetitive Off State Reverse Voltage
Peak Reverse Blocking Current
Peak on State Voltage
Holding Current
Reverse Blocking Region
(off state)
Reverse Avalanche Region
Anode −
+ Voltage
I
DRM
at V
DRM
Forward Blocking Region
(off state)
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3
MCR100 Series
100
GATE TRIGGER VOLTAGE (VOLTS)
95
90
GATE TRIGGER CURRENT (
m
A)
80
70
60
50
40
30
20
10
−40 −25 −10
5
20 35 50 65 80
T
J
, JUNCTION TEMPERATURE (°C)
110
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
−40 −25 −10
5
20 35 50
65 80
T
J
, JUNCTION TEMPERATURE (°C)
95
110
Figure 1. Typical Gate Trigger Current versus
Junction Temperature
Figure 2. Typical Gate Trigger Voltage versus
Junction Temperature
1000
1000
100
LATCHING CURRENT (
m
A)
95
110
HOLDING CURRENT (
m
A)
100
10
−40 −25 −10
5
20 35 50 65 80
T
J
, JUNCTION TEMPERATURE (°C)
10
−40 −25 −10
5
20 35 50 65 80
T
J
, JUNCTION TEMPERATURE (°C)
95
110
Figure 3. Typical Holding Current versus
Junction Temperature
Figure 4. Typical Latching Current versus
Junction Temperature
TC, MAXIMUM ALLOWABLE CASE TEMPERATURE (
°
C)
I T, INSTANTANEOUS ON−STATE CURRENT (AMPS)
120
110
100
90
DC
80
70
60
50
40
0
0.1
30°
60°
90°
120°
0.5
180°
10
MAXIMUM @ T
J
= 25°C
MAXIMUM @ T
J
= 110°C
1
0.2
0.3
0.4
I
T(RMS)
, RMS ON-STATE CURRENT (AMPS)
0.1
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
V
T
, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)
Figure 5. Typical RMS Current Derating
Figure 6. Typical On−State Characteristics
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4
MCR100 Series
TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A
H2A
H2B
H2B
H
W2
H4 H5
L1
L
F1
P2
P1
P
H1
W1 W
T
T2
P2
D
T1
F2
Figure 7. Device Positioning on Tape
Specification
Inches
Symbol
D
D2
F1, F2
H
H1
H2A
H2B
H4
H5
L
L1
P
P1
P2
T
T1
T2
W
W1
W2
Millimeter
Max
Min
3.8
0.38
2.4
1.5
8.5
0
0
18
15.5
8.5
2.5
12.5
5.95
3.55
0.15
—
0.35
17.5
5.5
.15
Item
Tape Feedhole Diameter
Component Lead Thickness Dimension
Component Lead Pitch
Bottom of Component to Seating Plane
Feedhole Location
Deflection Left or Right
Deflection Front or Rear
Feedhole to Bottom of Component
Feedhole to Seating Plane
Defective Unit Clipped Dimension
Lead Wire Enclosure
Feedhole Pitch
Feedhole Center to Center Lead
First Lead Spacing Dimension
Adhesive Tape Thickness
Overall Taped Package Thickness
Carrier Strip Thickness
Carrier Strip Width
Adhesive Tape Width
Adhesive Tape Position
Min
0.1496
0.015
0.0945
.059
0.3346
0
0
0.7086
0.610
0.3346
0.09842
0.4921
0.2342
0.1397
0.06
—
0.014
0.6889
0.2165
.0059
Max
4.2
0.51
2.8
4.0
9.5
1.0
1.0
19.5
16.5
11
—
12.9
6.75
3.95
0.20
1.44
0.65
19
6.3
0.5
0.1653
0.020
0.110
.156
0.3741
0.039
0.051
0.768
0.649
0.433
—
0.5079
0.2658
0.1556
0.08
0.0567
0.027
0.7481
0.2841
0.01968
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements.
4. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
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