|
MCM62973AFN18 |
MCM62973A |
MCM62973AFN20 |
| Description |
4K x 12 Bit Synchronous Static RAM |
4K x 12 Bit Synchronous Static RAM |
4K x 12 Bit Synchronous Static RAM |
| Is it Rohs certified? |
incompatible |
- |
incompatible |
| Maker |
Motorola ( NXP ) |
- |
Motorola ( NXP ) |
| package instruction |
QCCJ, LDCC44,.7SQ |
- |
PLASTIC, LCC-44 |
| Reach Compliance Code |
unknow |
- |
unknow |
| ECCN code |
EAR99 |
- |
EAR99 |
| Maximum access time |
10 ns |
- |
10 ns |
| Other features |
OUTPUT REGISTER; SELF-TIMED WRITE |
- |
OUTPUT REGISTER; SELF-TIMED WRITE |
| I/O type |
SEPARATE |
- |
SEPARATE |
| JESD-30 code |
S-PQCC-J44 |
- |
S-PQCC-J44 |
| JESD-609 code |
e0 |
- |
e0 |
| length |
16.5862 mm |
- |
16.5862 mm |
| memory density |
49152 bi |
- |
49152 bi |
| Memory IC Type |
STANDARD SRAM |
- |
STANDARD SRAM |
| memory width |
12 |
- |
12 |
| Number of functions |
1 |
- |
1 |
| Number of terminals |
44 |
- |
44 |
| word count |
4096 words |
- |
4096 words |
| character code |
4000 |
- |
4000 |
| Operating mode |
SYNCHRONOUS |
- |
SYNCHRONOUS |
| Maximum operating temperature |
70 °C |
- |
70 °C |
| organize |
4KX12 |
- |
4KX12 |
| Output characteristics |
3-STATE |
- |
3-STATE |
| Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
| encapsulated code |
QCCJ |
- |
QCCJ |
| Encapsulate equivalent code |
LDCC44,.7SQ |
- |
LDCC44,.7SQ |
| Package shape |
SQUARE |
- |
SQUARE |
| Package form |
CHIP CARRIER |
- |
CHIP CARRIER |
| Parallel/Serial |
PARALLEL |
- |
PARALLEL |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
- |
NOT SPECIFIED |
| power supply |
5 V |
- |
5 V |
| Certification status |
Not Qualified |
- |
Not Qualified |
| Maximum seat height |
4.57 mm |
- |
4.57 mm |
| Maximum standby current |
0.03 A |
- |
0.03 A |
| Minimum standby current |
4.5 V |
- |
4.5 V |
| Maximum slew rate |
0.17 mA |
- |
0.16 mA |
| Maximum supply voltage (Vsup) |
5.5 V |
- |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
- |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
- |
5 V |
| surface mount |
YES |
- |
YES |
| technology |
CMOS |
- |
CMOS |
| Temperature level |
COMMERCIAL |
- |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
| Terminal form |
J BEND |
- |
J BEND |
| Terminal pitch |
1.27 mm |
- |
1.27 mm |
| Terminal location |
QUAD |
- |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
- |
NOT SPECIFIED |
| width |
16.5862 mm |
- |
16.5862 mm |