• Compared with film-type resistors, carbon composition
resistors have better pulse endurance characteristics
CC Series
CHARACTERISTICS
Item
Operating Temperature Range
Short Time Overload
Effect of Soldering
Temperature Cycling
Insulation Resistance
Characteristics
-55°C ~ +125°C
±(2.5% +0.05Ω)
±(3% +0.05Ω)
±4%
10,000MΩ min.
DERATING CURVE
100
80
Rated Power 60
Ratio (%) 40
20
0
0.25W
0.50W
70
1/4
130
1/2
150
120
160
−55
40
80
Ambient Temperature (°C)
PART NUMBERING SYSTEM
3
0
B
J
Series
2
5
0
-
1
K
*
Value
*
For Reel Part Number Add: /Reel to Part Number Above
SERIES, WATTAGE, RANGE OF VALUES, TOLERANCE, VOLTAGE, AND DIMENSIONS
d
H
L
H
D
Series
30BJ250
30BJ500
Watts
1/4
1/2
Standard Range
of Values (Ω)
2.2~22M
2.2~22M
Resistance
Tolerance
±5%
±5%
Voltage (V) (max.)
Working
Overload
Pulse
250
400
500
350
700
700
L
6.4
9.5
Dimensions (mm)
D
H
2.3
27.0±3
3.5
27.0±3
d
0.6
0.74
STANDARD STOCKED VALUES (Ω)
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1.0K
1.1K
1.2K
1.3K
1.5K
1.6K
1.8K
2.0K
2.2K
2.4K
2.7K
3.0K
3.3K
3.6K
3.9K
4.3K
4.7K
5.1K
5.6K
6.2K
6.8K
7.5K
8.2K
9.1K
10K
11K
12K
13K
15K
16K
18K
20K
22K
24K
27K
30K
33K
36K
39K
43K
47K
51K
56K
62K
68K
75K
82K
91K
100K 200K 390K 750K 2.2M 6.8M
110K 220K 430K 820K 2.4M 8.2M
120K 240K 470K 910K 2.7M
130K 270K 510K 1.0M 3.3M
150K 300K 560K 1.2M 3.9M
160K 330K 620K 1.5M 4.7M
180K 360K 680K 1.8M 5.6M
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600213
Date Revised: 10/18/07
Carbon Composition Resistors
SURGE RESISTANCE CHARACTERISTICS
Charging and Discharging a 2,000 pF Condenser for 100 Cycles.
10
0
0
Δ
R/R (%)
−10
−20
−30
0
2
1/4 Watt
a: 1.2 MΩ
b: 33 kΩ
c: 1 kΩ
4
6
8
10
Voltage (kV)
c
Δ
R/R (%)
a
b
−1
CC Series
1/4 Watt
−2
Under 70°C 220kΩ
−3
1/2 Watt
12
14
0 100
500
Testing Time (Hrs)
1000
RELATIONSHIP BETWEEN LOAD
RATIO AND AMBIENT TEMPERATURE
10
0
Δ
R/R (%)
−10
−20
−30
0
2
1/2 Watt
a: 1MΩ
b: 10 kΩ
c: 1 kΩ
4
6
8
10
Voltage (kV)
12
14
c
LOAD LIFE (RATED LOAD)
3
2
Δ
R/R (%)
a
b
1
0
−1
0
2
4
6
8
10
Time Elasped (Month)
12
a = 1/4 Watt 100kΩ
b = 1/4 Watt 1kΩ
c = 1/2 Watt 1MΩ
a
b
c
VARIATION WITH TIME
0
0
Δ
R/R (%)
−5 Load Ratio P/Pn = 1.25
−10
1/2 Watt 100kΩ, n = 50
2,500 hours
−15
1.0
0.25
0.75
0.5
FREQUENCY CHARACTERISTICS
100
Δ
R/R (%)
75
50
a
25
b
0
0.1
0.5 1
5
10
50 100
30
50
70
90
100
130
Ambient Temperature (°C)
fxR (Mhz−M
Ω)
RELIABILITY TEST
Load Life in Moisture
Samples: 1/4 Watt, 100Ω, 1kΩ, 10kΩ, 100kΩ, 150 pieces of each, 600 pieces in total.
Conditions: 40°C in 95% RH 1% hours "ON" and 0.5 hours "OFF" cycling for 5,000 hours with DC voltage given by the following ratios:
Criterion
(%)
Load Ratio
P/Pn (%)
0
20
ΔR/R
±5
60
100
Total
Total
Total Testing
Time
T(Hrs)
2.984 x 10
6
2.990 x 10
6
2.997 x 10
6
2.992 x 10
6
1.196 x 10
7
1.20 x 10
7
Number
of Failures
r (pcs)
6
4
2
3
15
0
Failure Ratio
λ
0.201
0.134
0.067
0.100
0.125
0.0055
λCL
(60%)
0.244
0.176
0.104
0.139
0.138
0.0077
Average Lifetime
(60% reliability level)
(Hrs)
4.098 x 10
5
5.682 x 10
5
9.615 x 10
5
7.194 x 10
5
7.209 x 10
5
1.299 x 10
7
±10
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
XICON PASSIVE COMPONENTS • (800) 628-0544
XC-600213
Date Revised: 10/18/07
Carbon Composition Resistors
LEAD TAPING
CC Series
3.2 min.
¿0.60±0.05
6.4±0.7
2.3±0.2
6±1
5±0.5
1 Less
1.2
Craft Tape
Glued Tape
1 Less
1 Less
5.2±1
66 max.
Dimensions: in.
(except where noted)
315mm
80
55
14.3±0.8
81.5
29.4±0.8
343mm
Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
People may still feel unfamiliar with the term electromagnetic interference (EMI), but the impact of EMI is something that almost everyone has experienced. For example, when watching TV, if someone ne...
Thank you all for your help and support~~! I have found the error, which is that there is a missing interrupt function. I should add a void timer0() interrupt1 function and put the timer setting in it...
[b]Content Introduction: [/b] This book introduces various aspects of C++ language from the simplest to the most complex, and gives detailed examples for each knowledge point involved, so that readers...
Project requirements:1. You can use TI's LM3S9B90 ARM.2. ARM is connected to an ALTER FPGA through an external bus.3. In the whole process, PC transmits printing data to ARM through a 100M network, an...
Entering the information age after the millennium, the huge demand for semiconductor chips has made China the world's largest semiconductor market. According to relevant data, the scale of my count...[Details]
On April 19, it was reported that Alibaba DAMO Academy is developing a neural network chip, Ali-
NPU
, which is mainly used for
AI
reasoning calculations such as image and video analys...[Details]
On April 20, Alibaba Group announced that it would acquire
the
chip
company Zhongtian Microelectronics and invest in six
chip
companies. Yesterday, JD.com CEO Liu Qiangdong said in a...[Details]
We have come a long way from the 2G era, and now 5G is about to be commercialized. Suddenly, we realize that time has passed quickly, but technology has never stopped. The activation of 5G heralds ...[Details]
Recently, there was news that the US government asked Google to shut down the Android operating system for ZTE phones. After that, some people even imagined what the consequences would be if Intern...[Details]
background After the hardware engineer completed the PCB and schematic design, the routine was modified according to the tutorial of Zhengdian Atom to verify the correctness of the hardware. STM32F...[Details]
Development Background: 1. Main chip - STM32F207VCT6; 2. TCP/IP protocol stack - LWIP, transplanted based on ST routines; 3. Operating system - none (bare metal); Anomalies: 1. Power on the device wi...[Details]
A few days ago, Hanergy Chairman Li held a grand launch of Hanwa new products, which once again attracted the attention of the mass media to the development of photovoltaics. The unique Hanergy has gr...[Details]
With the implementation of the first version of the NR sub-6GHz draft of 3GPP in December 2017, and the subsequent Phase 2 drafts, semiconductor manufacturers and terminal manufacturers began to ...[Details]
Different from 51, AVR and other single-chip microcomputers, the clock signal sources of msp430 include LFXT1, XT2 and DCO. 1. LFXT1: It can connect high-speed and low-speed crystal oscillators. In l...[Details]
In recent years, the application of high-brightness LED has developed rapidly, especially in signboards and traffic lights. For automotive applications, LED is also very attractive. Long life, shock ...[Details]
In recent years, in addition to Huawei Kirin
chips
in the mobile phone industry
, Xiaomi's own processor Pengpai S1, AI
chip
start-ups such as Cambrian, Horizon, and Deephi Technolo...[Details]
On May 8,
Google
I/O 2018 Developer Conference was held as scheduled in Mountain View, California. In the second year of the full promotion of the "AI first" strategy, artificial intelligen...[Details]
Real-time operating system RTOS
京公网安备 11010802033920号
EEWORLD
