◆Dimensions
L
a
a
Type
URG1608
(inch)
0603
Size
L
1.60±0.20
W
0.80＋0.25/−0.20
a
0.30±0.20
t
0.40＋0.15/−0.10
W
URG2012
t
0805
2.00±0.20
1.25＋0.25/−0.20
0.40±0.20
0.40＋0.15/−0.10
Thin film surface mount resistors
URG3216
1206
3.20±0.20
1.60±0.25
0.50±0.25
0.40＋0.15/−0.10
URG5025
2010
5.00±0.20
2.50±0.25
0.60±0.25
0.45+0.15/-0.10
URG6432
2512
6.40＋0.20/−0.40
3.20±0.25
0.75±0.25
0.45±0.20
URG series
（unit：mm）
◆Reliability
specification
Test items
Short time overload
Condition (test methods (MIL-PRF-55342/JIS C5201-1)
*1
2.5 x rated voltage, 5seconds
Standard
±0.02％+0.01Ω
±0.02％+0.01Ω(R≧250Ω)
±0.05％+0.01Ω(R＜250Ω)
±0.05％+0.01Ω
±0.02％+0.01Ω
±0.05％+0.01Ω
±0.0１％+0.01Ω
Life (biased)
70℃, rated voltage,
*1
90min on 30min off, 2000hours
High temperature high humidity
Temperature shock
High temperature exposure
Resistance to soldering heat
*1
85℃, 85%RH, 1/10 of rated power, 90min on 30min off, 1000hours
-65℃ (15min) ~ 150℃ (15min) 100cycles
155℃, no bias, 1000hours
235±5℃, 30 seconds (reflow), (by MIL-PRF-55342)
Rated voltage is given by E=
R x P
E= rated voltage (V), R=nominal resistance value(Ω), P=rated power(W)
If rated voltage exceeds maximum voltage /element, maximum voltage/element is the rated voltage.
12
Metal thin film chip resistors
(the highest reliability and precision)
■URG
series
◆Reliability
test data
○Biased
life test
Thin film surface mount resistors
1000
800
URG2012
LL70℃_0.25W, n = 20
1000
800
URG3216
LL70℃_0.25W, n = 20
Resistance drift (ppm)
600
400
200
0
-200
-400
-600
-800
-1000
Resistance drift (ppm)
600
400
200
0
-200
-400
-600
-800
-1000
250Ω
20kΩ
1kΩ
32kΩ
10kΩ
250Ω
1kΩ
68kΩ
URG series
10 100 1000 10000
Test duration(h)
110 100 1000 10000
Test duration(h)
○High
temperature high humidity (biased)
500
400
URG2012
THB 85 ℃, 85 %, n = 20
500
400
URG3216
THB 85 ℃, 85 %, n = 20
Resistance drift (ppm)
300
200
100
0
-100
-200
-300
-400
-500
Resistance drift (ppm)
300
200
100
0
-100
-200
-300
-400
-500
250Ω
20kΩ
1kΩ
32kΩ
10kΩ
250Ω
1kΩ
68kΩ
10 100 1000 10000
Test duration(h)
10 100 1000 10000
Test duration(h)
○Temperature
shock
200
200
URG2012, n = 10
Thermal Shock_-65℃ to +150℃
Resistance drift (ppm)
Resistance drift (ppm)
150
100
50
0
-50
-100
-150
-200
150
100
50
0
-50
-100
-150
-200
URG3216, n = 10
Thermal Shock_ -65℃ to +150℃
250Ω
1kΩ
68kΩ
250Ω
1kΩ
68kΩ
10 10 100 1000
Number of cycles
10 10 100 1000
Number of cycles
○High
temperature exposure
500
400
URG2012, n = 20
High Temperature Exposure,155℃
500
400
URG3216, n = 20
High Temperature Exposure,155℃
Resistance drift (ppm)
300
200
100
0
-100
-200
-300
-400
-500
Resistance drift (ppm)
300
200
100
0
-100
-200
-300
-400
-500
250Ω
1kΩ
32kΩ
250Ω
1kΩ
68kΩ
10 100 1000 10000
Test duration(h)
10 100 1000 10000
Test duration(h)
13
◆Temperature
coefficient of Resistance
○URG2012
1000
800
Variation of resistance with temperature
URG2012-1kΩ
No.1
No.2
No.3
No.4
No.5
No.6
No.7
No.8
No.9
No.10
1000
800
Variation of resistance with temperature
URG2012-32kΩ
No.1
No.2
No.3
No.4
No.5
No.6
No.7
No.8
No.9
No.10
Resistance drift (ppm)
400
200
0
-200
-400
-600
-800
-1000
-75 -50 -25 0
±2ppm / ℃
±5ppm / ℃
Resistance drift (ppm)
600
600
400
200
0
-200
-400
-600
-800
-1000
Thin film surface mount resistors
±2ppm / ℃
±5ppm / ℃
Ambient temperature (℃)
25
50 75 100 125
150 175
-75 -50 -25 0
Ambient temperature (℃)
25
50 75 100 125
150 175
○URG3216
1000
800
Variation of resistance with temperature
URG3216-1kΩ
No.1
No.2
No.3
No.4
No.5
No.6
No.7
No.8
No.9
No.10
URG series
1000
800
Variation of resistance with temperature
URG3216-68kΩ
No.1
No.2
No.3
No.4
No.5
No.6
No.7
No.8
No.9
No.10
Resistance drift (ppm)
400
200
0
-200
-400
-600
-800
-1000
-75 -50 -25 0
±2ppm / ℃
±5ppm / ℃
Resistance drift (ppm)
600
600
400
200
0
-200
-400
-600
-800
-1000
±2ppm / ℃
±5ppm / ℃
Ambient temperature (℃)
25
50 75 100 125
150 175
-75 -50 -25 0
Ambient temperature (℃)
25
50 75 100 125
150 175
◆Derating
Curve
Ratio to rated power (％)
100
50
0
-55 0 50 70 100 155
Ambient temperature (℃)
14
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